• 한국분말재료학회지
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• 제21권5호
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• pp.349-354
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• 2014

This study is a basic research for repair material production which manufactured a Cu repair coating layer on the base material of a Cu plate using kinetic spray process. Furthermore, the manufactured material underwent an annealing heat treatment, and the changes of microstructure and macroscopic properties in the Cu repair coating layer and base material were examined. The powder feedstocks were sphere-shaped pure Cu powders with an average size of $27.7{\mu}m$. The produced repair coating material featured $600{\mu}m$ thickness and 0.8% porosity, and it had an identical ${\alpha}$-Cu single phase as the early powder. The produced Cu repair coating material and base material displayed extremely high adhesion characteristics that produced a boundary difficult to identify. Composition analysis confirmed that the impurities in the base material and repair coating material had no significant differences. Microstructure observation after a $500^{\circ}C/1hr$. heat treatment (vacuum condition) identified recovery, recrystallization and grain growth in the repair coating material and featured a more homogeneous microstructure. The hardness difference (${\Delta}H_v$) between the repair coating material and base material significantly reduced from 87 to 34 after undergoing heat treatment.

• Journal of Welding and Joining
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• 제19권5호
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• pp.534-539
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• 2001

The formation mechanism of microconstituents in brazed joints of duplex stainless steel and Cr-Cu alloy which is an essential process of rocket engine manufacturing was investigated using Cu base insert metal. $SUS329J_3L$ and C18200 were used for base metal and AMS 4764 was used for insert metal. The brazing was carried out under various conditions. There were various phases in the joints, because of reaction between liquid insert metal and base metals. Since liquid insert metal reacts with duplex stainless steel, liquid Cu from insert metal infiltrated into the $\alpha/\beta$ interface of duplex stainless steel. Through the process of Cu infiltration, isolated stainless steel pieces come into the liquid insert metal. Since liquid insert metal reacts with Cr-Cu alloy. Cr precipitates from C18200 come into the liquid insert metal. With increment of bonding temperature and holding time, amounts and sizes of phases increased. but Cr-Mn compounds decreased at 1303k for 1.2ks and Mn-rich phases disappeared Fe-Cr compounds formed.

• Journal of Welding and Joining
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• 제31권1호
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• pp.58-64
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• 2013

The following results were obtained, microstructures and tensile properties in arc brazed joints of DP(dual phase) steel using Cu-5.3wt%Sn insert metal was investigated as function of brazing current. 1) The Fusion Zone was composed of ${\alpha}Fe+{\gamma}Cu$ and Cu23Sn2. The reason for the formation of these solid solutions. Despite, Fe & Cu were impossible to solid solution at room temperature. It's melting & reaction to something of insert metal & Base Metal (DP Steel) by Arc. Brazing Process has faster cooling rate then Cast Process, Supersaturated solid solution at room temperature. 2) The increase Hardness of Fusion Zone was directly proportional to the rise of welding current. Because, ${\alpha}Fe+{\gamma}Cu$ phase (higher hardness than the Cu23Sn2.(104.1Hv < 271.9Hv)) Volume fraction was Growth, due to increasing the amount of base metal melting by High current. 3) The results of tensile shear test by Brazing, All specimens happen to fracture in Fusion Zone. On the other hand, when Brazing Current increasing tend to rise tensile load. but it was very small, about 26-30% of the base metal. 4) The result of fracture analysis, The crack initiate at Triple Point for meet to Upper B.M/Under B.M/Fusion Zone. This Crack propagated to Fusion zone. So ruptured by tensile strength. The Reason to in the fusion zone fracture, Fusion zone by Brazing of hardness (strength) was very lower then the base metal (DP steel). In addition the Fusion Zone's thickness in triple point was thin than the base metal's thickness in triple point.

• 열처리공학회지
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• 제20권1호
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• pp.17-21
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• 2007

In this study, brazing characteristics of the dissimilar Ti and Cu metals using a Zr-base amorphous filler ($Zr_{41.2}Ti_{13.8}Cu_{12.5}Ni_{10.0}Be_{22.5}$ in at.%) have been investigated for various bonding temperatures. In the sample brazed at $790^{\circ}C$ for 10 min., the Ti-rich phases in the joint were observed, while the Cu-rich phases were obtained in the sample brazed at $825^{\circ}C$ for 10 min.. Such a different microstructure and composition in the joints could be explained by the degree of the dissolution reaction. At $790^{\circ}C$, the reaction between the Zr-rich liquid phase and the Ti base metal was actively occurred to form Ti-rich liquid phase in the joint. As the temperature increased to $825^{\circ}C$, however, the reaction between the Ti-rich liquid phase and the Cu base metal was promoted to form the Cu-rich liquid phase in the joint finally. Such a different interface reaction is attributed to the reactivity or solubility between the Zr as a main element in the filler and the Ti and Cu as a base metal element.

• 한국지열·수열에너지학회논문집
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• 제16권1호
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• pp.9-16
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• 2020

In this study, a numerical study was conducted to evaluate the performance improvement when CuO nanofluid was used in the plate heat exchanger. As a result, the heat transfer amount is increased by 5.45% when 2 vol% CuO nanofluid is used. The influence on the CuO nanofluid on the performance of heat exchanger is decreased by increasing the flow rate of working fluid. In addition, the overall heat transfer coefficient using 2 vol% CuO nanofluid decreased compared to the base fluid. However, the pressure drop and the consumption of the pump power is increased as the concentration of CuO nanofluid increased because the increase of the viscosity. These are increased up to 15.4% compared to those of the base fluid. Moreover, the performance index of CuO nanofluid is decreased by 12.6% compared to that of the base fluid.

• Bulletin of the Korean Chemical Society
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• 제35권1호
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• pp.141-146
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• 2014

A series of bimetallic Cu-Zn/$SiO_2$ catalysts were prepared via thermal decomposition of the as-synthesized $CuZn(OH)_4(H_2SiO_3)_2{\cdot}nH_2O$ hydroxides precursors. This highly dispersed Cu-solid base catalyst is extremely effective for hydrogenation of ethyl acetate to ethanol. The reduction and oxidation features of the precursors prepared by coprecipitation method and catalysts were extensively investigated by TGA, XRD, TPR and $N_2$-adsorption techniques. Catalytic activity by ethyl acetate hydrogenation of reaction temperatures between 120 and $300^{\circ}C$, different catalyst calcination and reduction temperatures, different Cu/Zn loadings have been examined extensively. The relation between the performance for hydrogenation of ethyl acetate and the structure of the Cu-solid base catalysts with Zn loading were discussed. The detected conversion of ethyl acetate reached 81.6% with a 93.8% selectivity of ethanol. This investigation of the Cu-Zn/$SiO_2$ catalyst provides a recently proposed pathway for ethyl acetate hydrogenation reaction to produce ethanol over Cu-solid base catalysts.

• 분석과학
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• 제13권5호
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• pp.558-564
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• 2000

단핵성 네자리 시프염기인 N,N'-bissalicylidene-1,2-phenylenediamine(BSPD)와 이핵성 네자리 시프 염기 리간드인 N,N',N'',N'''-tetrasalicylidene-3,3',4,4'-tetraaminodiphenyl-methane (TSTM) 및 N, N',N'',N'''-tetrasalicylidene-3,3'-diaminobenzidine (TSDB)을 합성하고, 이들 리간드의 양성자 해리상수를 전위차법으로 구하였다. 합성된 시프염기 리간드들과 Cu(II) 이온을 이용해 착물을 합성하여 순환전압-전류법으로 착물의 특성을 측정한 결과 $Cu(II)_2$-TSTM 착물은 순환전압-전류법에서 두 과정 두 단계의 환원과정으로 두 전자의 확산 지배적인 과정으로 일어남을 알았다. 또한 단핵성 착물 Cu(II)-BSPD와 이핵성 착물 $Cu(II)_2$-TSDB 및 $Cu(II)_2$-TSTM을 ascorbic acid의 산화반응에 이용한 결과, 반응속도는 $Cu(II)_2$ -TSTM>$Cu(II)_2$-TSDB>Cu(II)-BSPD의 순으로 이핵성인 $Cu(II)_2$-TSTM 착물이 가장 큰 값을 가짐을 알았다.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 1994년도 추계학술대회강연 및 발표대회 강연및 발표논문 초록집
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• pp.12-13
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• 1994

• 한국진공학회:학술대회논문집
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• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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• pp.169-169
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• 2000

최근 반도체 소자의 초고집적화 현상에 따라 기존의 Al-base 합금에 대한 한계에 달하면서 그에 대한 대체 물질로 Cu가 관심을 모으게 되었고 그럼으로써 Cu metallization을 위한 많은 연구가 진행되어 왔다. Cu는 Al-base 합금계보다 비저항이 낮고, 녹는점이 높으며, 또한 electromigration 특성이 뛰어난 것으로 알려져 있다. 공학적인 면에서 이미 이들 계에 대한 adhesion 및 전기적 특성에 대한 많은 연구가 있어왔지만, 이들 특성 변화에 대한 물리적 의미를 제공할 만한 기초 자료들이 부족한 상태이다. 본 연구에서는 부도체인 polyimide 박막과 diffusion barrier인 TiN 박막위에서의 Cu 박막성장에 따르는 interface chemical reaction의 변화를 XPS를 이용하여 관찰함으로서 이들 계에 있어서의 adhesion과의 관계를 조사하였다. 그리고 XPS를 이용한 modified surface accumulation method를 적용시켜 TiN diffusion barrier를 통한 Cu의 grain boundary diffusion 상수들을 측정하였다. Cu/TiN system의 경우에는 interface chemical reaction이 일어나지 않았지만 Cu/polymide system에 있어서는 boundary diffusivity는 특히 40$0^{\circ}C$에서 $650^{\circ}C$ 영역에서, Db=60$\times$10-11exp[-0.29/(kBT)]cm2/sec 이었다.

• Bulletin of the Korean Chemical Society
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• 제33권2호
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• pp.473-482
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• 2012

A novel malemide epoxy containing Co(II), Ni(II) and Cu(II) ions have been synthesized by curing malemide epoxy resin (MIEB-13) and Co(II), Ni(II) and Cu(II) complexes of macrocyclic bis-hydrazone Schiff base. The Schiff base was synthesized by reacting 1,4-dicarbnyl phenyl dihydrazide with 2,6-diformyl-4-methyl phenol. The Schiff base and its Co(II), Ni(II) and Cu(II) complexes have been characterized by elemental analyses, spectral (IR, $^1H$ NMR, UV-vis., FAB mass, ESR), thermal and magnetic data. The curing reaction of maleimide epoxy compound with metal complexes was studied as curing agents. The stability of cured samples was studied by thermo-gravimetric analyses and which have excellent chemical (acid/alkali/solvent) and water absorption resistance. Further, the scanning electron microscopy (SEM) and definitional scanning colorimetric (DSC) techniques were confirmed the phase homogeneity of the cured systems.