• International Journal of Computer Science & Network Security
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• 제24권1호
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• pp.61-70
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• 2024

Cloud Computing is internet-based computing, where the users are provided with whatever service they need from the resources, software, and information. Recently, the security of cloud computing is considered as one of the major issues for both cloud service providers CSP and end-users. Privacy and highly confidential data make many users refuse to store their data within cloud computing, since data on cloud computing is not dully secured. The cryptographic algorithm is a technique which is used to maintain the security and privacy of the data on the cloud. In this research, we applied eight different cryptographic algorithms on Xen and KVM as hypervisors on cloud computing, to be able to measure and compare the performance of the two hypervisors. Response time and CPU utilization while encryption and decryption have been our aspects to measure the performance. In terms of response time and CPU utilization, results show that KVM is more efficient than Xen on average at 11.5% and 11% respectively. While TripleDES cryptographic algorithm shows a more efficient time response at Xen hypervisor than KVM.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• KSII Transactions on Internet and Information Systems (TIIS)
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• 제14권1호
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• pp.455-472
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• 2020

As a user in modern societies with the rapid growth of Internet environment and more complicated business flow processes in order to be effective at work and accomplish things on time when the manager of the company went for a business trip, he/she need to delegate his/her signing authorities to someone such that, the delegatee can act as a manager and sign a message on his/her behalf. In order to make the delegation process more secure and authentic, we proposed a secure and efficient identity-based proxy signcryption in cloud data sharing (SE-IDPSC-CS), which provides a secure privilege delegation mechanism for a person to delegate his/her signcryption privilege to his/her proxy agent. Our scheme allows the manager of the company to delegate his/her signcryption privilege to his/her proxy agent and the proxy agent can act as a manager and generate signcrypted messages on his/her behalf using special information called "proxy key". Then, the proxy agent uploads the signcrypted ciphertext to a cloud service provider (CSP) which can only be downloaded, decrypted and verified by an authorized user at any time from any place through the Internet. Finally, the security analysis and experiment result determine that the proposed scheme outperforms previous works in terms of functionalities and computational time.

• Journal of Microbiology and Biotechnology
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• 제15권4호
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• pp.831-837
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• 2005

Low-temperature adaptation and cryoprotection were studied in Leuconostoc mesenteroides SYl, a strain isolated from Kimchi. L. mesenteroides SY1 cells grown in exponential growth phase at $30^{\circ}C$ were exposed to $15^{\circ}C,\;10^{\circ}C$, and $5^{\circ}C$ for 2, 4, and 6 h, respectively, and then frozen at $- 70^{\circ}C$ for 24 h. Survival ratio was measured after the cells were thawed. The freezing-thawing cycles were repeated four times. Preadapted cells survived better than non-adapted control cells, and the highest survival ratio ($96\%$) was observed for cells preadapted for 2 h at $5^{\circ}C$, whereas control cells showed only $22\%$. The 2D gel showed that two proteins (spots A and B) were induced in cells preadapted at lower temperatures. Spots A and B have the same molecular weight (7 kDa), but the pI was 4.6 for spot A and 4.3 for spot B. The first 29 and 15 amino acid sequences from spots A and B were determined, and they were identical, except for one amino acid. A csp gene was cloned, and nucleotide sequencing confirmed that the gene encoded spot A cold shock protein.

• 한국컴퓨터정보학회논문지
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• 제18권7호
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• pp.149-155
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• 2013

일반적으로 재료절단 문제는 재료를 절단할 수 있는 패턴을 찾고 선형계획법으로 최적의 패턴 수를 찾는다. 그러나 패턴 수는 일반적으로 지수적으로 증가하기 때문에 사전에 모든 패턴을 고려하는 것은 비현실적인 것으로 알려져 있다. 본 논문은 Suliman의 실현 가능 패턴을 구하는 방법을 적용하여 사전에 패턴을 구하는 방법을 적용하였다. 또한, 실현 가능 패턴들을 대상으로 선형계획법이나 근사 알고리즘을 적용하지 않고 정확한 해를 다항시간으로 얻는 방법을 제안하였다. 제안된 방법은 실현 가능 패턴들 중 모든 요구의 1st 발생 빈도가 손실량 0에 모두 분포하는 경우와 다양한 손실량에 분산되어 분포하는 경우로 구분하여 패턴 수를 분배하는 방법을 적용하였다. 제안된 알고리즘을 2개의 데이터에 적용한 결과 모든 데이터에서 정확한 해를 구하는데 성공하였다.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2010년도 춘계 학술발표회
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• pp.1452-1457
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• 2010

본 연구에서는 국내 회처리장에 매립되어 있는 매립회를 효율적으로 사용하기 위한 실내 모형시험장치인 CSP 시스템을 제작하여 매립회와 물 그리고 시멘트량을 조절하여 모형지반을 조성하고 이에 대한 강성변화를 평가하였다. 시멘트를 첨가한 모형지반이 시멘트를 첨가하지 않은 경우에 비해 빠른 속도로 경화가 진행되었으며 192시간 경과 후에는 경화속도가 급격히 감소하는 것으로 나타났다. 모형지반 조성시 전체 중량의 30~45% 사이의 물의 양 변화는 지반의 강성 변화에 큰 영향을 끼치지는 않는 것으로 나타났다. 추후에는 지반 조성 초기에 큰 지반강성의 크기를 얻을 수 있도록 시멘트량을 증가시키는 등의 다양한 영향인자에 대한 시험을 수행하여 고유동성 채움재 활용성을 정량적으로 평가하는 것이 필요할 것으로 판단된다.

• 제어로봇시스템학회논문지
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• 제22권3호
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• pp.199-203
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• 2016

A brain-computer interface or BCI provides an alternative method for acting on the world. Brain signals can be recorded from the electrical activity along the scalp using an electrode cap. By analyzing the EEG, it is possible to determine whether a person is thinking about his/her hand or foot movement and this information can be transferred to a machine and then translated into commands. However, we do not know which information relates to motor imagery and which channel is good for extracting features. A general approach is to use all electronic channels to analyze the EEG signals, but this causes many problems, such as overfitting and problems removing noisy and artificial signals. To overcome these problems, in this paper we used a new optimization method called the Fruit Fly optimization algorithm (FOA) to select the best channels and then combine them with CSP method to extract features to improve the classification accuracy by linear discriminant analysis. We also used particle swarm optimization (PSO) and a genetic algorithm (GA) to select the optimal EEG channel and compared the performance with that of the FOA algorithm. The results show that for some subjects, the FOA algorithm is a better method for selecting the optimal EEG channel in a short time.

• 마이크로전자및패키징학회지
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• 제13권2호
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• pp.1-7
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• 2006

본 논문에서는 솔더 레지스트(solder resist)의 두께와 코어의 물성에 따른 인쇄회로기판의 철의 크기와 형상에 대하여 연구하였다. 인쇄회로기판의 굽힘 변형은 적층되는 재료의 열팽창계수의 차이에 의해 발생한다. 따라서 굽힘 변형의 감소를 위해서는 열팽창계수의 차이가 작은 적층 재료를 사용하는 것이 필요하며, 구조 형상에서도 상면과 하면의 불균일성을 완화시킬 필요가 있다. 또한, 적층 재료에서 코어의 강성을 높여 점의 발생을 억제할 수 있다. 코어를 이루는 복합재료는 적층 순서와 섬유 각에 따른 물성 특성의 방향성에 따라 굽힘과 비틀림이 연성되는 현상을 보이며, 이와 같은 성질을 이용하면 휨을 제어할 수 있다. 본 연구에서는 2층으로 구성된 chip scale package (CSP) 기판의 휨에 대한 연구로, 실험 및 유한 요소해석 툴을 이용하여 개선 결과를 도출하였다.

• 제어로봇시스템학회논문지
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• 제19권6호
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• pp.527-533
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• 2013

BCI (Brain-Computer Interface) is a system that transforms a subject's brain signal related to their intention into a control signal by classifying EEG (electroencephalograph) signals obtained during the imagination of movement of a subject's limbs. The BCI system allows us to control machines such as robot arms or wheelchairs only by imaging limbs. With the exact same experiment environment, activated brain regions of each subjects are totally different. In that case, a simple approach is to use as many channels as possible when measuring brain signals. However the problem is that using many channels also causes other problems. When applying a CSP (Common Spatial Pattern), which is an EEG extraction method, many channels cause an overfitting problem, and in addition there is difficulty using this technique for medical analysis. To overcome these problems, we suggest an optimal channel selection method using a BPSO (Binary Particle Swarm Optimization), BPSO with channel impact factor, and GA. This paper examined optimal selected channels among all channels using three optimization methods and compared the classification accuracy and the number of selected channels between BPSO, BPSO with channel impact factor, and GA by SVM (Support Vector Machine). The result showed that BPSO with channel impact factor selected 2 fewer channels and even improved accuracy by 10.17~11.34% compared with BPSO and GA.