• 제목/요약/키워드: crosstalk

검색결과 513건 처리시간 0.026초

A/D 변환기 회로에서 터미네이션 임피던스의 crosstalk에 대한 영향 분석 (A Study On Effects of The Termination Conditions on Crosstalk in The A/D Converter Circuit)

  • 임한상
    • 전자공학회논문지SC
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    • 제47권2호
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    • pp.35-42
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    • 2010
  • 본 논문은 A/D 변환기(Analog-to-Digital Converter) 회로에서 신호선의 터미네이션 조건이 crosstalk에 의해 왜곡되기 쉬운 특성을 가지며 동작 주파수가 높아짐에 따라 이에 대한 주의가 더욱 요구된다. 그중에서도 아날로그 신호인 입력 신호와 레퍼런스 전압 신호는 crosstalk에 의해 왜곡되기 쉬운 아날로그 신호이면서, A/D 변환 전체의 동작 성능을 좌우하는 신호들이다. 이 두 신호들은 각각의 회로 구성에 따라 독특한 터미네이션 조건을 가지므로 본 논문에서는 주파수 영역에서 임피던스 불일치 조건을 고려한 crosstalk를 모델링하고 해당 터미네이션 조건이 crosstalk에 미치는 영향을 확인한다. 먼저, A/D 변환기 회로에서 두 신호의 회로 구성을 파악한 후 near-end와 far-end에서 임피던스 불일치를 고려한 crosstalk 모델을 유도한다. 유도한 crosstalk 모델을 이용하여 입력 신호의 near-end와 터미네이션 임피던스 불일치와 레퍼런스 전압 신호의 far-end 커패시턴스 터미네이션이 crosstalk에 미치는 영향을 예측하고, 실험을 통해 예측 결과를 확인한다. 신호선으로는 가장 널리 사용되는 microstrip 구조를 사용하였으며 skin effect에 의한 손실 증가를 반영하였다.

Analysis of the Different Influences of Additive or Subtractive Three-dimensional Crosstalk on the Level of the Visual Fatigue

  • Park, Minyoung;Kim, Joohwan;Choi, Hee-Jin
    • Journal of the Optical Society of Korea
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    • 제19권1호
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    • pp.38-44
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    • 2015
  • Three-dimensional (3D) crosstalk is one of the main causes of visual fatigue and needs to be suppressed. The 3D crosstalk can be categorized into two different kinds according to its appearance-additive 3D crosstalk and subtractive 3D crosstalk. In this paper, we analyze the influence of different kinds of 3D crosstalk to the perceived level of visual fatigue in order to suppress the perceived 3D crosstalk effectively.

Pole-zero Dewarping을 이용한 효율적인 Crosstalk 제거 알고리듬 (An Efficient Crosstalk Cancellation Algorithm Using Pole-zero Dewarping)

  • 이준호;박영철;윤대희;정재웅
    • 한국음향학회지
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    • 제24권3호
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    • pp.133-140
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    • 2005
  • 스테레오 채널 오디오 재생 시스템에서 사용되는 간섭제거기 (crosstalk canceller)는 원치 않는 crosstalk을 제거함으로써, 청취자의 귀 주변에서 녹음된 원음장을 완벽하게 재생하는 것을 목적으로 한다. 그러나, 일반적으로 crosstalk 제거기는 물리적인 한계로 저주파 대역에서 나쁜 성능을 갖게 된다. 이를 개선하기 위한 방법으로 주파수를 warping하여 저주파 대역의 해상도를 높여 보다 효율적으로 필터를 설계하는 기술이 있으나, 많은 연산량을 필요로 한다. 본 논문에서는 이를 보다 효율적으로 구현하기 위해 pole-zero dewarping을 이용하여 필터를 구성하는 기술을 제안하였다. 이 기술을 통하여 구현된 crosstalk 제거기는 종래의 warping 기술로 구현된 crosstalk 제거기에 대하여 적은 연산량으로 유사한 성능을 제공하였으며, 모의 실험을 통하여 이를 검증하였다.

광폴리머를 사용한 두꺼운 홀로그램의 수축에 의한 혼선잡음 (Crosstalk Noise by Shrinkage of Thick Holographic Photopolymer)

  • 황용섭;김근율;박주연;남하은
    • 정보저장시스템학회:학술대회논문집
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    • 정보저장시스템학회 2005년도 추계학술대회 논문집
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    • pp.134-138
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    • 2005
  • The crosstalk noise of thick holographic photopolymer is studied. Three different experiments, (1) reading area dependency (2) post-exposure effect (3) effect of later recorded holograms on earlier recorded holograms, have been accomplished and a tendency of crosstalk noises has been found for each case. The larger reading area, the higher crosstalk noises fur the later recorded holograms. Before the post-exposure the crosstalk noises are higher in the earlier recorded holograms, but after the post-exposure the crosstalk noises we higher in the later recorded holograms. The crosstalk noises of the earlier recorded holograms become higher as more holograms are recorded by multiplexing. To explain the tendency of crosstalk noises of these experiments, we suggest a model considering the anisotropic shrinkage of the photopolymer According to the model. the shrinkage is more dominant at the center of the recorded region than the edge of that. After the post-exposure, however, the amount of shrinkage becomes the same far the whole recorded region. The results of all three experiments are well explained by this model.

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박판화된 다층기판에서 dual-offset stripline 구조의 누화 해석 (Analysis of crosstalk of dual-offset stripline in a FR-4 high multilayer PCB)

  • 이명호;전용일;전병윤;박권철;강석열
    • 전자공학회논문지S
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    • 제35S권4호
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    • pp.20-29
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    • 1998
  • In this paper, we find the values of near-end crosstalk coefficients in dual-offset stripline of a FR-4 multilayer PCB by an analytic method and a HSPICE simulation method, define calculation errors inananlytic method and the application range, simulate near-end crosstalk coefficients of the FCT(Fast CMOS TTL) in complicated dual-offset stripline by HSPICE and analyze near-end crosstalk and far-end crosstalk coefficients in dual-offset stripline. So, we analyze coupling structure of the near-end crosstalk and far-end crosstalk in the complicated dual-offset striplines that are 1[pF] capacitors termainated, and define a coupling formula of near-end crosstalk and far-end crosstalk coefficients dual-offset striplines.

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열 잉크젯 프린트헤드의 채널간 간섭현상의 모델링 (Modeling of Crosstalk Behaviors in Thermal Inkjet Print Heads)

  • 이유섭;손동기;김민수;국건
    • 대한기계학회논문집B
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    • 제31권2호
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    • pp.141-150
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    • 2007
  • This paper presents a lumped model to predict crosstalk characteristics of thermally driven inkjet print heads. Using the lumped R-C model, heating characteristics of the head are predicted to be in agreement with IR temperature measurements. The inter-channel crosstalk is simulated using the lumped R-L network. The values of viscous flow resistance, R and flow inertance, L of connecting channels are adjusted to accord with the 3-D numerical simulation results of three adjacent jets. The crosstalk behaviors of a back shooter head as well as a top shooter head have been investigated. Predictions of the proposed lumped model on the meniscus oscillations are consistent with numerical simulation results. Comparison of the lumped model with experimental results identifies that abnormal two-drop ejection phenomena are related to the increased meniscus oscillations because of the more severe crosstalk effects at higher printing speeds. The degree of crosstalk has been quantified using cross-correlations between neighboring channels and a critical channel dimension for acceptable crosstalk has been proposed and validated with the numerical simulations. Our model can be used as a design tool for a better design of thermal inkjet print heads to minimize crosstalk effects.

파장 분할 다중화 방식을 위한 고속 레이저 다이오드 배열 모듈의 혼신해석 (Crosstalk analysis of laser-diode array modules for wavelength division multiplexing)

  • 김성일;이해영
    • 전자공학회논문지D
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    • 제34D권7호
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    • pp.71-78
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    • 1997
  • In this paper, we analyzed the crosstalk characteristics of LD array modules for WDM and improved the crosstalk levels using a screening line between access lines. From the calculation resutls, we have found that inductive crosstalk of access lines is dominant for the low impedance LD arrays with short bondwire interconnections. The proposed array interconnecton with the screening line and ouble bondwires, rduces the crosstalk level about 10dB compared to conventional interconnections using simple access lines and a single bondwire. This proposed structure also can be easily imlemented with transmission reliability.

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인쇄뢰로기판의 누화해석 (Crosstalk Analysis on Printed Circuit Board)

  • 박경희;김제영;김수중
    • 전자공학회논문지A
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    • 제28A권9호
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    • pp.700-707
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    • 1991
  • Transmission line crosstalk of a printed circuit baord terminated with the linear resistive and nonlinear terminal network is analyzed. Based on a quasi-static approximation, crosstalk voltage is computed in frequency domain by applying the modal analysis. A scheme to calculate the maximum crosstalk voltage for a line terminated with the nonlinear digital gate is proposed. And also, crosstalk quantities are numerically obtained for the microstrip and strip line, and compared with the experimental data to validate relevance of this method.

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On the Minimization of Crosstalk Conflicts in a Destination Based Modified Omega Network

  • Bhardwaj, Ved Prakash;Nitin, Nitin
    • Journal of Information Processing Systems
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    • 제9권2호
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    • pp.301-314
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    • 2013
  • In a parallel processing system, Multi-stage Interconnection Networks (MINs) play a vital role in making the network reliable and cost effective. The MIN is an important piece of architecture for a multiprocessor system, and it has a good impact in the field of communication. Optical Multi-stage Interconnection Networks (OMINs) are the advanced version of MINs. The main problem with OMINs is crosstalk. This paper, presents the (1) Destination Based Modified Omega Network (DBMON) and the (2) Destination Based Scheduling Algorithm (DBSA). DBSA does the scheduling for a source and their corresponding destination address for messages transmission and these scheduled addresses are passed through DBMON. Furthermore, the performance of DBMON is compared with the Crosstalk-Free Modified Omega Network (CFMON). CFMON also minimizes the crosstalk in a minimum number of passes. Results show that DBMON is better than CFMON in terms of the average number of passes and execution time. DBSA can transmit all the messages in only two passes from any source to any destination, through DBMON and without crosstalk. This network is the modified form of the original omega network. Crosstalk minimization is the main objective of the proposed algorithm and proposed network.

A Low-Crosstalk Design of 1.25 Gbps Optical Triplexer Module for FTTH Systems

  • Kim, Sung-Il;Park, Sun-Tak;Moon, Jong-Tae;Lee, Hai-Young
    • ETRI Journal
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    • 제28권1호
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    • pp.9-16
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    • 2006
  • In this paper, we analyzed and measured the electrical crosstalk characteristics of a 1.25 Gbps triplexer module for Ethernet passive optical networks to realize fiber-tothe-home services. Electrical crosstalk characteristic of the 1.25 Gbps optical triplexer module on a resistive silicon substrate should be more serious than on a dielectric substrate. Consequently, using the finite element method, we analyze the electrical crosstalk phenomena and propose a silicon substrate structure with a dummy ground line that is the simplest low-crosstalk layout configuration in the 1.25 Gbps optical triplexer module. The triplexer module consists of a laser diode as a transmitter, a digital photodetector as a digital data receiver, and an analog photodetector as a cable television signal receiver. According to IEEE 802.3ah and ITU-T G.983.3, the digital receiver and analog receiver sensitivities have to meet -24 dBm at $BER=10^{-12}$ and -7.7 dBm at 44 dB SNR. The electrical crosstalk levels have to maintain less than -86 dB from DC to 3 GHz. From analysis and measurement results, the proposed silicon substrate structure that contains the dummy line with $100\;{\mu}m$ space from the signal lines and 4 mm separations among the devices satisfies the electrical crosstalk level compared to a simple structure. This proposed structure can be easily implemented with design convenience and greatly reduce the silicon substrate size by about 50 %.

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