• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회B
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• pp.2862-2867
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• 2008

High-temperature components of gas turbine operated for certain period of time can be reused by being repaired or rejuvenated. In case of the gas turbine combustion liners, the biggest and the most important one in the high-temperature components, come in a repair shop after operated for 8,000 or 12,000 hours according to the model and go through the repair and rejuvenation in order to be reused. A stated combustion liner is the first channel which has the combustion gas reached a nozzle from a fuel nozzle. Materials and coating properties of old and new model combustion liners were investigated. To repair these components after the visual inspection, the coatings of combustion liners were removed and then FPI(Fluorescent Penetrant Inspection), a kind of the NDI(Non-Destructive Inspection), was conducted. Damage patterns and the number of the damaged components were classified and analyzed based on data provided from the visual inspection over a long period of time. Focusing on the difference between old model and new model combustion liners, we analyzed the damage distribution and changes and consequently concluded that new model combustion liner would increase repair rate.

• 대한기계학회논문집A
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• 제37권5호
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• pp.665-671
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• 2013

제 4 세대 소듐냉각 고속로에는 중간열교환기(IHX), 붕괴열제거 열교환기(DHX), 공기 열교환기(AHX), 핀형 소듐-공기 열교환기(FHX) 및 증기발생기(SG)를 포함한 다양한 열교환기들이 설치된다. 본 연구에서는 STELLA-1 시험루프에 설치된 소듐-공기 열교환기인 AHX 와 SELFA 시험루프에 설치될 핀형(finned) 소듐-공기 열교환기인 FHX 등 2 기의 열교환기 설계에 대해 3D 상세 유한요소해석을 수행하고, 동 결과에 기초하여 고온설계 기술기준을 따라 크리프-피로 손상평가를 수행하였다. 손상 평가결과 AHX와 FHX는 의도하는 크리프 피로 손상 하중 하에서 구조 건전성을 유지하는 것으로 확인되었다.

• 한국압력기기공학회 논문집
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• 제12권1호
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• pp.126-133
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• 2016

Recently, the research and development of Sodium-cooled Fast Reactors (SFRs) have made progresses. However, liquid sodium, the coolant of an SFR, is chemically unstable and sodium fire can be occurred when liquid sodium leaks from sodium pipe. To reduce the damage by the sodium fire, many fire walls and fire extinguishers are needed for SFRs. LBB concept in SFR might reduce the scale of sodium fire and decrease or eliminate fire walls and fire extinguishers. Therefore, LBB concept can contribute to improve economic efficiency and to strengthen defense-in depth safety. The LBB assessment procedure has been well established, and has been used significantly in light water reactors (LWRs). However, an LBB assessment of an SFR is more complicated because SFRs are operated in elevated temperature regions. In such a region, because creep damage may occur in a material, thereby growing defects, an LBB assessment of an SFR should consider elevated temperature effects. The procedure and method for this purpose are provided in RCC-MRx A16, which is a French code. In this study, LBB assessment was performed for PGSFR IHTS hot-leg pipe according to RCC-MRx A16 and the applicability of the code was discussed.

• KEPCO Journal on Electric Power and Energy
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• 제2권4호
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• pp.583-588
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• 2016

The high-temperature steam pipes of thermal power plants are subjected to severe conditions such as creep and fatigue due to the power plant frequently being started up and shut down. To prevent critical pipes from serious damage and possible failure, inspection methods such as computational analysis and online piping displacement monitoring have been developed. However, these methods are limited in that they cannot determine the life consumption rate of a critical pipe precisely. Therefore, we set out to develop a life assessment system, based on a three-dimensional piping displacement monitoring system, which is capable of evaluating the life consumption rate of a critical pipe. This system was installed at the "M" thermal power plant in Malaysia, and was shown to operate well in practice. The results of this study are expected to contribute to the increase safety of piping systems by minimizing stress and extending the actual life of critical piping.

• 한국도로학회논문집
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• 제11권2호
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• pp.167-174
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• 2009

본 논문에서는 아스팔트 콘크리트 포장의 표층 프로파일과 차량특성인 차량속도와 현가장치를 다르게 하여 트럭 시뮬레이션 프로그램을 통한 동적하중을 분석하였다. 다양한 포장 상태의 프로파일을 입력하여 동적하중을 분석하였으며 프로파일, 차량의 현가장치, 차량속도에 따른 동적하중 변화를 분석하였다. 포장 거칠기가 증가할수록 동적하중이 증가하였으며, 속도가 증가할 수 록 동일한 포장 거칠기 하에서 동적하중이 증가하였다. Walking beam 현가장치가 Air spring 현가장치에 비해 더 큰 동적하중을 보였다. 동적하중 공분산을 이용하여 포장파손 지수를 결정하였으며, 동적하중 공분산과 신뢰도, 아스팔트 혼합물의 파괴매개변수가 증가할 수록 포장파손지수도 증가하였다. 본 연구의 결과를 이용하여 차량속도와 표층 아스팔트 혼합물 파괴특성에 근거한 포장 평탄성 규정에 이용할 수 있으며, 아스팔트 콘크리트 포장 시공 후 포장 평탄성에 근거한 지불규정에 효과적으로 사용할 수 있다고 판단된다.

• KEPCO Journal on Electric Power and Energy
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• 제4권1호
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• pp.25-31
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• 2018

A boiler system transforms water to pressured supercritical steam which drives the running of the turbine to rotate in the generator to produce electricity in power plants. Materials for building the tube system face challenges from high temperature creep damage, thermal fatigue/expansion, fireside and steam corrosion, etc. A database on the creep resistance strength and steam oxidation of the materials is important to the long-term reliable operation of the boiler system. Generally, the ferritic steels, i.e., grade 1, grade 2, grade 9, and X20, are extensively used as the superheater (SH) and reheater (RH) in supercritical (SC) and ultra supercritcal (USC) power plants. Currently, advanced austenitic steel, such as TP347H (FG), Super304H and HR3C, are beginning to replace the traditional ferritic steels as they allow an increase in steam temperature to meet the demands for increased plant efficiency. The purpose of this paper is to provide the state-of-the-art knowledge on boiler tube materials, including the strengthening, metallurgy, property/microstructural degradation, oxidation, and oxidation property improvement and then describe the modern microstructural characterization methods to assess and control the properties of these alloys. The paper covers the limited experience and experiment results with the alloys and presents important information on microstructural strengthening, degradation, and oxidation mechanisms.

• 동력기계공학회지
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• 제8권3호
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• pp.18-22
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• 2004

Boiler is one of the most important utilities providing steam to turbine in order to supply mechanical energy in thermal power plant. It is composed of thousands of tubes for high efficient heat transfer. The material for boiler tubes is used in such high temperature and pressure condition as $540^{\circ}C$, 22MPa. The boiler tube material is required to resist creep damage, fatigue cracking, and corrosion damages. 2.25%Cr-1Mo steel is used for conventional boiler tubes, and austenitenite stainless steel is used for higher temperature boiler tubes. But the temperature and pressure of steam in power plant became higher for high plant efficiency. So, the property of boiler tube material must be upgaded to fit the plant property. Several boiler tube material was developed to fit such conditions. X20CrMoV12.1 steel is also developed in 1980's and used for superheater and reheater tubes in supercritical boilers. The material has martensite microstructures which is difficult to evaluate the degradation. In this thesis, degrade the X20CrMoV12.1 steel at high temperatures in electric furnace, and evaluate hardness with Vickers hardness tester and strengths with Indentation tester.

• 대한기계학회논문집A
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• 제33권10호
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• pp.1177-1186
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• 2009

High temperature steam pipes of thermal power plant are subject to a severe thermal range and usually operates well into the creep range. Cyclic operation of the plant subjects the piping system to mechanical and thermal fatigue damages. Also, poor or malfunctional supports can impose massive loads or stress onto the piping system. In order to prevent the serious damage and failure of the critical piping system, various inspection methods such as visual inspection, computational analysis and on-line piping displacement monitoring were developed. 3-dimensional piping displacement monitoring system was developed with using the aluminum alloy rod and rotary encoder sensors, this system was installed and operated on the high temperature steam piping of "Y" thermal power plant successfully. It is expected that this study will contribute to the safety of piping system, which could minimize stress and extend the actual life of critical piping.