• 한국해양공학회지
• /
• 제7권2호
• /
• pp.57-67
• /
• 1993

The fracture behavior of plain woven glass/epoxy composite plates with a crack is investigated under static tensile loading. It is shown in this paper that the characteristic length associated with the point stress criterion depends on the crack length. To predict the not ched tensile strength, the point stress criterion proposed by Whitney and Nuismer are modified. An excellent agreement is found between the experimental results and the analytical prediction of the modified point stress criterion. The condition of unstable crack growth in the presence of a per-existing flaw(machined notch) is examined by means of the maximum stress intensity factor $K_max$ using maximumload P$_max$. The values of $K_max$ evaluated from energy release rate G$_max$(the compliance me thod) indicate a wide difference. Therefore in regard to anisotropy and heterogeneity of the composite materials studied, the modified shape correction factor f(a/W) is obtained. $K_max$evaluated by the compliance method a little or insignificantly depends on the initial crack length a, the specimen thickness B, the crack angle .theta. and the specimen geometry.

• Structural Engineering and Mechanics
• /
• 제18권6호
• /
• pp.731-744
• /
• 2004

Modified virtual crack closure integral (MVCCI) technique has become very popular for computation of strain energy release rate (SERR) and stress intensity factor (SIF) for 2-D crack problems. The objective of this paper is to propose a numerical integration procedure for MVCCI so as to generalize the technique and make its application much wider. This new procedure called as numerically integrated MVCCI (NI-MVCCI) will remove the dependence of MVCCI equations on the type of finite element employed in the basic stress analysis. Numerical studies on fracture analysis of 2-D crack (mode I and II) problems have been conducted by employing 4-noded, 8-noded (regular & quarter-point), 9-noded and 12-noded finite elements. For non-singular (regular) elements at crack tip, NI-MVCCI technique generates the same results as MVCCI, but the advantage for higher order regular and singular elements is that complex equations for MVCCI need not be derived. Gauss numerical integration rule to be employed for 8-noded singular (quarter-point) element for accurate computation of SERR and SIF has been recommended based on the numerical studies.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2001년도 춘계학술대회논문집A
• /
• pp.102-107
• /
• 2001

Interfacial cracks between an isotropic and orthotropic material, subjected to static far field tensile loading are analyzed using the technique of photoelasticity. The fracture parameters are extracted from the full-field isochromatic data and the same are compared with that obtained using boundary collocation method. Dynamic Photoelasticity combined with high-speed digital photography is employed for capturing the isochromatics in the case of propagating interfacial cracks. The normalized stress intensity factors for static crack is greater when $\alpha=90^{\circ}C$ (fibers perpendicular to the interface) than when $\alpha=0^{\circ}C$ (fiber parallel to the interface) and those when $\alpha=90^{\circ}C$ are similar to ones of isotropic material. The dynamic stress intensity factors for interfacial propagating crack are greater when $\alpha=0^{\circ}C$ than $\alpha=90^{\circ}C$. The relationship between complex dynamic stress intensity factor $|K_D|$ and crack speed C is similar to that for isotropic homogeneous materials, the rate of increase of energy release rate G or $|K_D|$ with crack speed is not as drastic as that reported for homogeneous materials.

• 대한기계학회논문집A
• /
• 제21권6호
• /
• pp.951-960
• /
• 1997

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the maximum energy release rate criterion. It could be shown that the crack propagation from the lower edge of the ie pad is easily occurred at the maximum temperature during the soldering process, where the pressure acting on the crack surface is assumed by the saturated vapor pressure at maximum temperature. The package crack formation depends on various parameters such as chip size, relative thickness, material properties, the moisture content and soldering temperature etc. The quantitative measure of the effects of the parameters could be easily obtained by using the taguchi's method which requires only a few kinds of combinations with such parameters. From the results, it could be obtained that the more significant parameters to effect the package reliability are the orders of Young's modulus, die pad size, down set, chip thickness and maximum soldering temperature.

• Journal of Mechanical Science and Technology
• /
• 제17권6호
• /
• pp.854-859
• /
• 2003

In this paper, we examine the singular stresses and electric fields in a functionally graded piezoelectric ceramic strip containing an eccentric crack off the center line under anti-plane shear loading with the theory of linear piezoelectricity. It is assumed that the properties of the functionally graded piezoelectric ceramic strip vary continuously along the thickness. Fourier transforms are used to reduce the problem to the solution of two pairs of dual integral equations, which are then expressed to a Fredholm integral equation of the second kind. Numerical values on the stress intensity factor and the energy release rate are obtained.

• Composites Research
• /
• 제15권4호
• /
• pp.37-42
• /
• 2002

면외전단하중(anti-plane shear loading)을 받는 기능경사 압전 세라믹 무한 스트립(functionally graded piezoelectric ceramic strip)의 상하 양쪽 끝단의 중앙에 평행하게 존재하는 유한한 크기의 균열(Griffith crack)에 대한 특이응력(singular stress)과 전기장(electric field)을 선형 압전 이론(theory of linear piezoelectricity)을 이용하여 결정한다. 푸리에 변환(Fourier transform)을 이용하여 복합적분 방정식을 구성하며, 이를 제2종 Fredholm 적분 방정식(Fredholm integral equation of the second kind) 으로 표현한다. 또한 응력세기계수(stress intensity factor)와 에너지 해방률(energy release rate)에 대한 수치 결과를 제시하였다.

• 한국산업융합학회 논문집
• /
• 제2권2호
• /
• pp.131-137
• /
• 1999

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the energy release rate criterion. The package crack formation depend on various parameters such as chip set, chip size, package thickness, package width, material properties and the moisture content etc. The effects of chip set and the other parameters were estimated during the analysis of package cracks which were located in the edge of the upper interface of the chip and the lower interlace of the die pad. From the results, it could be obtained that the more significant parameters to effect the chip set are chip width.

• Journal of Mechanical Science and Technology
• /
• 제15권1호
• /
• pp.21-25
• /
• 2001

We consider the problem of determining the singular stresses and electric fields in a piezoelectric ceramic strip containing a Griffith eccentric crack off the center line under anti-plane shear loading with the theory of linear piezoelectricity. Fourier transforms are used to reduce the problem to the solution of two pairs of dual integral equations, which are then expressed to a Fredholm integral equation of the second kind. Numerical values on the stress intensity factor and the energy release rate are obtained, and the influences of the electric fields for piezoelectric ceramics are discussed.

• Advanced Composite Materials
• /
• 제18권2호
• /
• pp.121-134
• /
• 2009

The present study investigated, both experimentally and numerically, the improvement of low-velocity impact damage resistance of carbon fiber reinforced plastic (CFRP) laminates due to through-the-thickness stitching. First, we conducted drop-weight impact tests for stitched and unstitched laminates. The results of damage inspection confirmed that stitching did improve the impact damage resistance, and revealed that the improvement effect became greater as the impact energy increased. Moreover, the stitching affected the through-the-thickness damage distribution. Next, we performed FEM analysis and calculated the energy release rate of the delamination crack using the virtual crack closure technique (VCCT). The numerical results revealed that the stitching affected the through-the-thickness damage distribution because the stitch threads had a marked effect on decreasing both the modes I and II energy release rate around the bottom of the laminate. Comparison of the results for models that contained delaminations of various sizes revealed that the energy release rate became lower as delamination size increased; therefore the stitching improved the impact resistance more effectively when the impact energy was higher.

• 대한기계학회논문집A
• /
• 제21권3호
• /
• pp.414-422
• /
• 1997

The characteristics on the extension of the CED(Crack Energy Density) concept to the interface kinked crack problems in a dissimilar are examined. Each mode contributions of CED are found by symmetric and antisymmetric conponents and domain independent integrals. Finite element calculation is carried out to simulate the interface kinked crack growth on a bimaterial. The focus is the establishment of fracture criterion with CED and finding the orientation of crack extension. From the results, a prediction about the extension behavior of an interface kinked crack can be done. And we show that CED can be a parameter to indicate fracture criterion at an interface kinked crack.