• 제목/요약/키워드: copper-containing

검색결과 443건 처리시간 0.021초

Recovery of Nickel and Copper from Scraped Nickel Condensers

  • Liang, Ruilu;Kikuchi, Eiji;Kawabe, Yoshishige;Sakamoto, Hiroshi;Fujita, Toyohisa
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2001년도 The 6th International Symposium of East Asian Resources Recycling Technology
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    • pp.188-192
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    • 2001
  • Magnetic separation and sulphidization-flotation for recovery of nickel and copper from two types of scraped condenser wastes, containing 8- l4% nickel and 2-4% copper, were studied. The effects of magnetic field intensities, classification, and grinding on the recovery of nickel and copper were investigated. According to the characteristics of nickel and copper in the scraps, classification-magnetic separation, different magnetic field intensities, and stages-grinding-cleaning of rough concentrate were investigated. The nickel concentrates containing 38-65% nickel with 84-97% recoveries and the copper concentrates containing 25-43% nickel with 35-60% recoveries were obtained by classification-magnetic separation. In addition, copper concentrates containing 26-45% copper with 76-88% recoveries were obtained by sulphidization-flotation from magnetic tailings and middling products.

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Molecular Mechanism of Copper Resistance in Pseudomonas syringae pv. tomato.

  • Cha, Jae-Soon;Donald A. Cooksey
    • 한국식물병리학회:학술대회논문집
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    • 한국식물병리학회 1995년도 Proceedings of special lectures on Molecular Biological Approaches to Plant Disease National Agricultural Science and Technology Institute Suwon, Korea
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    • pp.97-117
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    • 1995
  • Copper resistance in Pseudomonas syringae pv. tomato is determined by copper-resistance operon (cop) on a highly conserved 35 kilobase plasmid. Copper-resistant strains of Pseudomonas syringae containing the cop operon accumulate copper and develop blue clonies on copper-containing media. The protein products of the copper-resistance operon were characterized to provide an understanding of the copper-resistance mechanism and its relationship to copper accumulation. The Cop proteins CopA (72 kDa), CopB (39 kDa), and CopC (12 kDa) were produced only under copper induction. CopA and CopC were periplasmic proteins and CopB was an outer membrane protein. Leader peptide sequences of CopA, CopB, and CopC were confirmed by amino-terminal peptide sequencing. CopA, CopB, and CopC were purified from strain PT23.2, and their copper contents were determined. One molecule of CopA bound 10.9${\pm}$1.2 atoms of copper and one molecule of CopC bound 0.6${\pm}$0.1 atom of copper. P. syringae cells containing copCD or copBCD cloned behind the lac promoter were hypersensitive to copper. The CopD (32 kDa), a probable inner membrane protein, function in copper uptake with CopC. The Cop proteins apparently mediate sequestration of copper outside of the cytoplasm as a copper-resistance mechanism.

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PCB 산업에서 배출되는 산성 염화동 폐액으로부터 Copper Oxychloride의 제조 및 특성분석 (Preparation and Characterization of Copper Oxychloride from Acidic Copper Chloride Etchant)

  • 김영희;김수룡;정상진;이윤주;어영선
    • 자원리싸이클링
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    • 제12권2호
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    • pp.3-10
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    • 2003
  • PCB (Printed Circuit Board) 산업에서 배출되는 산성 염화동 폐액으로부터 농약원제로 사용이 가능한 고순도의 copper oxycloride를 제조하였다. PCB제조 산업은 구리 소재를 이용한 전자 부품 가공 산업으로서 제조 공정인 부식 과정에서 다량의 구리가 함유된 에칭 폐액이 발생한다. 환경과 경제적인 측면에서 폐액으로부터 구리성분을 재회수하는 기술의 개발은 매우 중요하다. 본 연구에서는 가성소다로 폐액을 중화하여 copper oxychloride를 회수하는 공정의 반응 조건을 확립하였다. 반응 온도 2$0^{\circ}C$-4$0^{\circ}C$, pH 5-7 사이에서 순수한 copper oxychloride제조가 가능하였고 이때 수득율은 95% 이상이었다. 생성물의 물리적 특성을 SEM, XRD, TGA, ICP 그리고 원자 흡수 분광기를 사용하여 분석하였다.

공동주택 바닥용 시멘트 모르타르의 복합강화법 변화에 따른 열전도 특성 (Properties of Thermal Conductivity of Cement Mortar for Apartment Housing Floor Using Combined Strengthening Method)

  • 윤길봉;전충근;정성철;윤기원;한천구
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 2001년도 봄 학술발표회 논문집
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    • pp.243-248
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    • 2001
  • The objective of this study is to investigate the thermal conductivity of cement mortar for apartment housing floor using expansive admixture, copper fiber, cower lathe, hollowed aluminum plate. According to test results, temperature at point (a) located above heating pipe does not show significant variation with age, and temperature at (b), which is located at the finishing surface above heating pipe, and temperature at (c), which is located at center surface between heating pipe has remarkable change. Temperature distribution sat (b) are in order for, structure containing copper fiber>plain structure>structure containing hollowed aluminum plate>structure containing expansive admixture. Temperature distribution, shows high tendency in order for, structure containing copper fiber>structure containing copper lathe>structure containing hollowed aluminum plate>plain structure>structure containing expansive admixture. (a) estimation of temperature distribution is determined with the variation of temperature between (b) point and (c) point during 60 minutes heating.

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Synthesis and Characterization of Copper(Ⅱ) Complex Containing 2,2'-dipyridylbenzamide

  • 이동환;김병순;오영희;라명수;장원길
    • Bulletin of the Korean Chemical Society
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    • 제17권9호
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    • pp.836-839
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    • 1996
  • A new copper complex containing 2,2'-dipyridylbenzamide(dpba), Cu(dpba)(NO3)2(CH3CN), has been synthesized and characterized. The crystal structure has been determined. Crystal data: space group P212121, Z=8, a=13.911(3) Å, b=16.813(3) Å, c=18.932(3) Å, V=4427.9(1) Å3 and R=0.0674 for 1716 reflections. The copper environment is square pyramidal containing acetonitrile in axial site. Spectroscopic properties has been characterized in solution state. The redox property of the Cu(dpba)(NO3)2 complex is different from that of corresponding copper-dpa complex.

As, Sb, Bi, Pb가 조동의 부동태에 미치는 영향 (Effect of Arsenic, Antimony, Bismuth and Lead on Passivation Behavior of Copper Anode)

  • 안승천;이상문;김용환;정원섭;정우창
    • 한국표면공학회지
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    • 제39권5호
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    • pp.215-222
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    • 2006
  • The passivity behavior of copper anode containing impurities in copper sulfate solution for electrorefining process was studied at several different levels of impurities such as As, Sb, Bi and Pb. The passivity behavior was investigated by electrochemical techniques (galvanostatic, potentiodynamic and cyclic voltammetry tests) and surface analysis (optical microscopy, electron probe microanalysis, scanning electron microscopy). The results were that arsenic, antimony inhibited passivation and bismuth accelerated it and lead containing anode showed different passivity behavior from above anodes. The improved passivity characteristics could be explained by decrease in oxygen content in passivity film which resulted from a reaction among the impurities, oxygen and copper in the anode. The SEM image revealed that arsenic or antimony containing anode exhibited a porous passivity film and bismuth containing anode showed the compact passivity film and lead containing anode had loose passivity film on anode.

PCB 産業에서 배출되는 산성 염화동 폐액으로부터 입자형상이 제어된 산화동 회수에 관한 연구 (A Study on the Recovery of Shape-controlled Copper Oxide from the Waste etchant of PCB Industry)

  • 김영희;류도형;김수룡;어용선
    • 자원리싸이클링
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    • 제10권6호
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    • pp.15-21
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    • 2001
  • 구리를 포함하는 산성 염화동 폐액으로부터 입자형상이 제어된 고순도의 산화동을 중화법을 사용하여 제조하였다 PCB(Printed Circuit Board)제조 산업은 구리 소재를 이용한 전자 부품 가공 산업으로서 제조 공정인 부식 과정에서 다량의 구리가 함유된 에칭 폐액이 발생한다. 환경과 경제적인 측면에서 폐액으로부터 구리성분을 재회수하는 기술의 개발은 매우 중요하다. 본 연구에서는 폐액으로부터 산화동을 회수하는 공정 중 반응 온도를 조절하여 생성물의 입자 크기와 형상을 제어하였다. $40 ^{\circ}C$미만에서 회수한산화동은 입자모양이 침상이었으며 $40^{\circ}C$이상에서 회수한 산화동은 판상을 보여 주었다. 생성물의 물리적 특성을 SEM, XRD, TGA그리고 원자 흡수 분광기를 사용하여 분석하였다.

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Synthesis, Crystal Structure and Spectroscopic Characterization of a Copper(II) Complex Coordinated by 2,2'-Dipyridylstearylamine

  • 오영희;김지영;박영자
    • Bulletin of the Korean Chemical Society
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    • 제22권4호
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    • pp.379-382
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    • 2001
  • A new ligand containing the long aliphatic hydrocarbon chain, dipyridylstearylamine (dps) and its copper(Ⅱ) complex, Cu(dps)(NO3)2 have been prepared. The copper complex was characterized structurally and spectroscopically. The XRD crystal structure of the copper complex reveals that copper is octahedrally coordinated by dps and two nitrato ligands. The nitrato groups ligate asymmetrically to the copper. Crystal data are P1bar, a=8.249(2), b=10.416(3), $c=20.915(4)\AA$, $\alpha=86.54(2)$, $\beta=84.026(2)$, $\gamma=72.32(2)^{\circ}$, V=1702.7(7) $\AA3$ , Z=2, ${\lambda}$(Mo $K\alpha)=0.71073\AA$, $\mu=0.689$ mm-1 , T=293(2) K, R=0.0560 for 3529 reflections. The dps and the copper complex are stable in the air and the copper complex exhibits features of typical of other copper(Ⅱ) complexes containing dipyridylamine-based ligand.

벼 종자배양에서 Copper가 캘러스 형성 및 식물체 재분화에 미치는 영향 (Effect of Copper on Callus Formation and Plant Regeneration in Seed Culture of Rice)

  • 권용삼;손재근
    • 식물조직배양학회지
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    • 제28권4호
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    • pp.205-208
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    • 2001
  • 벼의 종자배양에서 식물체 재분화 능력을 향상시키기 위하여 2 mg/L의 2,4-D와 여러 가지 농도의 copper (0~5.0mg/L)가 첨가된 MS배지에 종자배양 한 바 캘러스 생장정도는 copper 농도에 따라 다르게 나타났는데 특히, 2.5 mg/L의 copper가 첨가된 배지에서 가장 양호하였다. 그리고 캘러스 형성률과 copper 농도 간에는 유의성 있는 차이가 인정되지 않았다. 식물체 재분화 배지에 2.5 mg/L의 copper의 첨가는 Indica 품종들의 식물체 재분화 효율을 크게 향상시켰다. Copper가 첨가되지 않은 N$_{6}$배지에서 Indica 6품종의 평균재분화율은 2.4%이었으나, copper가 첨가된 배지에서 27.4%로 높게 나타났다.

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Corrosion of Dental Au-Ag-Cu-Pd Alloys in 0.9 % Sodium Chloride Solution

  • Chiba, Atsushi;Kusayanagi, Yukiharu
    • Corrosion Science and Technology
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    • 제4권1호
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    • pp.19-22
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    • 2005
  • Two Au-Ag-Cu-Pd dental casting alloys (Au:12% and 20%) used. The test solutions used 0.9 % NaCl solution (isotonic sodium chloride solution), 0.9 % NaCl solution containing 1 % lactic acid, and 0.9 % NaCl solution containing 1 % lactic acid and 0.1 mol $dm^{-3}$ $Na_2S$. The surface of two samples in three sample solutions was not natural discoloration during one year. The alloy containing 12 % gold was easily alloyed and the composition was uniform comparing with the alloy containing 20 % gold. The rest potentials have not a little effect after three months. The kinds of metals could not definitely from the oxidation and reduction waves of metal on the cyclic voltammograms. The dissolutions of gold and palladium were 12 % Au sample in the 0.9 % NaCl solution containing 1 % lactic acid and 0.1 mol $dm^{-3}$ $Na_{2}S$. The pH of solution had an affect on dissolution of copper, and sulfur ion had an affect on dissolution of silver. The copper dissolved amount from 20 % gold sample was about 26 times comparing with that of 12 % gold sample in the 0.9 % solution containing 1 % lactic acid. Corrosion products were silver chloride and copper chloride in NaCl solution, and silver sulfide and copper sulfide in NaCl solution containing $Na_{2}S$.