• 대한기계학회논문집A
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• 제34권10호
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• pp.1463-1470
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• 2010

미세성형 기술은 다양한 소재의 활용, 높은 생산성과 적은 재료의 손실, 고품질 생산과 같은 기존 소성가공의 장점을 실현할 수 있기 때문에 마이크로 크기의 부품생산에 매우 유망한 기술로 간주되고 있다. 하지만 기존의 매크로 영역에서 축적된 많은 기술과 노하우들은 소재의 크기가 마이크로 단위에 줄어듦에 따라 나타나는 소위 "크기효과"로 인해 미세성형 공정에 그대로 적용될 수는 없다. 따라서, 본 연구에서는 마이크로 영역에서 나타나는 재료거동의 크기효과를 이론적, 실험적 연구를 통하여 고찰하였다. 다양한 두께의 구리시편에 열처리를 실시하여 결정립의 크기를 다양화 하였고, 인장시험을 통하여 시편의 두께와 결정립의 크기가 유동응력에 미치는 영향을 고찰하였다. 또한 이러한 크기효과의 정량적인 분석을 위하여 마이크로 및 매크로 영역에서 적용 가능한 소재의 유동응력 모델을 이론적으로 도출하였다.

• Journal of Microbiology and Biotechnology
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• 제22권11호
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• pp.1557-1567
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• 2012

Glutathione reductase (GR, E.C. 1.6.4.2) is an important enzyme that reduces glutathione disulfide (GSSG) to a sulfydryl form (GSH) in the presence of an NADPH-dependent system. This is a critical antioxidant mechanism. Owing to the significance of GR, this enzyme has been examined in a number of animals, plants, and microbes. We performed a study to evaluate the molecular properties of GR (OsGR) from rice (Oryza sativa). To determine whether heterologous expression of OsGR can reduce the deleterious effects of unfavorable abiotic conditions, we constructed a transgenic Saccharomyces cerevisiae strain expressing the GR gene cloned into the yeast expression vector p426GPD. OsGR expression was confirmed by a semiquantitative reverse transcriptase polymerase chain reaction (semiquantitative RT-PCR) assay, Western-blotting, and a test for enzyme activity. OsGR expression increased the ability of the yeast cells to adapt and recover from $H_2O_2$-induced oxidative stress and various stimuli including heat shock and exposure to menadione, heavy metals (iron, zinc, copper, and cadmium), sodium dodecyl sulfate (SDS), ethanol, and sulfuric acid. However, augmented OsGR expression did not affect the yeast fermentation capacity owing to reduction of OsGR by multiple factors produced during the fermentation process. These results suggest that ectopic OsGR expression conferred acquired tolerance by improving cellular homeostasis and resistance against different stresses in the genetically modified yeast strain, but did not affect fermentation ability.

• 대한기계학회논문집A
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• 제37권5호
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• pp.619-624
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• 2013

이동용 전자기기에 적용 가능한 유연성 전자모듈이 롤투롤 공정에 의해 개발되었다. 개발된 전자모듈은 모듈 내의 폴리이미드층이 유연성 기판 역할을 하고 그 사이에 동선과 이방성도전필름과 박막 실리콘 칩과 모듈의 봉지재 역할을 하는 접착재료로 구성된다. 개발된 유연성 전자모듈의 신뢰성을 평가하기 위하여 일련의 인증시험을 수행하였다. 시험수행 결과 열 습도 복합하중 조건인 오토클레이브 시험 후에 시편 모듈 내에 박리가 발생하였다. 오토클레이브 시험에서 열과 습기가 유연성 전자모듈에 어떤 응력을 발생시키는지를 범용 유한요소 프로그램으로 연구하였다. 열 흡습 복합하중조건에서 열과 흡습에 의한 영향을 분리하여 상대적으로 평가해 보기 위하여 오토클레이브 조건 중 온도조건에 해당하는 $121^{\circ}C$ 온도조건 만을 적용하여 해석을 별도 수행하고 두 결과를 비교하였다. 또한 비교 해석결과를 바탕으로 유연성 전자모듈의 고장메커니즘을 추정하였다.

• Journal of Photoscience
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• 제9권2호
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• pp.430-432
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• 2002

The changes in expression of copper-zinc superoxide dismutase (CuZn-SOD), manganese superoxide dismutase (Mn-SOD) and glutathione peroxidase (GPX) in light-damaged rat retinas were examined. Sprague-Dawley rats (male, 6-weeks-old) were maintained on a cyclic photoperiod (12 hours light and 12 hours darkness) for 2 weeks. The illumination intensity during the light period was 80 lux. To induce light damage to the retina, a high-intensity illumination (3000-lux) was applied to the animals for 24 hours. After light exposure, the animals were returned to cyclic lighting. Eyes were enucleated 12 and 24 hours after light exposure started or 1,3, and 7 days after light exposure ended. Eyes were fixed and embedded in paraffin wax. Tissues were cut into 4${\mu}{\textrm}{m}$-thick sections. Sections were immunostained using antibody against CuZn-SOD, Mn-SOD, GPX and 8-hydroxy-deoxyguanocine (8-OHdG) as oxidative stress marker. 8-OHdG was observed in the outer nuclear layer (ONL) and retinal pigment epithelium (RPE) during light exposure. In light-damaged retinas CuZn-SOD labeling was up regulated in the ONL and RPE. Mn-SOD labeling was up regulated in rod inner segments (RIS) during light exposure and that in the RPE was up regulated after exposure. GPX labeling was observed in rod outer segments (ROS) during light exposure. GPX labeling was also observed in the RPE during and after light exposure. All three enzymes were observed in the outer retina, which suffered light damage, but occurred in defferent layers except within the RPE, in which case all three were expressed. These enzymes may play complementary roles as protective factors in light-damaged retinas.

• JSTS:Journal of Semiconductor Technology and Science
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• 제17권3호
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• pp.319-325
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• 2017

Through silicon via (TSV) technology is extensively used in 3D IC integrations. The special structure of the TSV is realized by CMP (Chemically Mechanical Polishing) process with a high Cu removal rate and, low dishing, yielding fine topography without defects. In this study, we investigated the electrochemical behavior of copper slurries with various inhibitors in the Cu CMP process for advanced TSV applications. One of the slurries was carried out for the most promising process with a high removal rate (${\sim}18000{\AA}/Min$ @ 3 psi) and low dishing (${\sim}800{\AA}$), providing good microstructure. The effects of pH value and $H_2O_2$ concentration on the slurry corrosion potential and Cu static etching rate (SER) were also examined. The slurry formula with a pH of 6 and 2% $H_2O_2$, hadthe lowest SER (${\sim}75{\AA}/Min$) and was the best for TSV CMP. A novel Cu TSV CMP process was developed with two CMPs and an additional annealing step after some of the bulk Cu had been removed, effectively improving the condition of the TSV Cu surface and preventing the formation of crack defects by variations in wafer stress during TSV process integration.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.2001-2005
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• 2005

The tensile test is generally used to measure mechanical properties with conventional fracture test. This test is extremely certain method to measure Young's modulus, yield strength, tensile strength and so on. ASTM, by international standard, prescribes two classes of tensile tests in tubular products. One is method that specimens aren't done by any process with Tube-shape. The other is that specimens are made on process for C-shape. In this paper, we would like to present the new-shape specimens for the tensile test. The presented specimen's shape is that put two pieces of C-shape specimens together. Besides a load point and a support point are fixed like Tube-shape specimens. This shape of specimen has a difference that existing specimen is made on one-step process out this specimen is made on two-step process. This shape is considered that stress concentration phenomenon occurs at the reduced section if a specimen is made on one step process.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2007년도 춘계학술대회
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• pp.250-253
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. The Ni contact was formed on the front grid pattern by electroless plating followed by anneal ing at $380{\sim}400^{\circ}C$ for $15{\sim}30$ min at $N_{2}$ gas to allow formation of a nickel-silicide in a tube furnace or a rapid thermal processing(RTP) chamber because nickel is transformed to NiSi at $380{\sim}400^{\circ}C$. The Ni plating solution is composed of a mixture of $NiCl_{2}$ as a main nickel source. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. The Ni/Cu contact was found to be well suited for high-efficiency solar cells and was successfully formed by using electroless plating and electroplating, which are more cost effective than vacuum evaporation. In this paper, we investigated low-cost Ni/Cu contact formation by electroless and electroplating for crystalline silicon solar cells.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.409-409
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• 2013

최근, 집적 소자의 미세화에 따라 늘어난 배선 신호 지연 및 상호 간섭, 그리고 소비 전력의 증가는 초고집적 소자 성능 개선에 한계를 가져온다. 이에 따라 기존의 알루미늄(Al)/실리콘 절연 산화막은 구리(Cu)/저유전율 박막(low-k)으로 대체되고 있고, 이는 소자 성능 개선에 큰 영향을 미친다. 그러나 Cu는 Si과 low-k 내부로 확산이 빠르게 일어나 소자의 비저항을 높이고, 누설 전류를 일으키는 등 소자의 성능을 저하시킬 수 있는 문제점을 가지고 있다. 이러한 Cu의 확산을 막기 위하여 Ta, TaN 등과 같은 확산방지막에 대한 연구가 활발히 진행되어 왔으나, 배선 공정의 집적화와 low-k 대체에 따른 공정 및 신뢰성 문제로 인해 새로운 확산방지막의 개발이 필요하게 되었다. 이를 위해, 본 연구에서는 Cu-V 합금을 사용하여 low-k 기판 위에 확산방지막을 자가 형성 시키는 공정에 대한 연구를 진행하였다. 다양한 low-k 기판에서 열처리조건에 따른 Cu-V 합금의 특성을 확인하기 위해 4-point probe를 통한 비저항 평가와 XRD (X-ray diffraction) 분석이 이뤄졌다. 또한, TEM (transmission electron microscope)을 이용하여 $300^{\circ}C$에서 1 시간 동안 열처리를 거쳐 자가형성된 V-based interlayer가 low-k와 Cu의 계면에서 균일하게 형성된 것을 확인하였다. 형성된 V-based interlayer의 barrier 특성을 평가하고자 Cu-V합금/low-k/Si 구조와 Cu/low-k/Si 구조의 leakage current를 비교 분석하였다. Cu/low-k/Si 구조는 비교적 낮은 온도에서 leakage current가 급격히 증가하는 양상을 보였으나, Cu-V 합금/low-k/Si 구조는 $550^{\circ}C$의 thermal stress 에서도 leakage current의 변화가 거의 없었다. 이러한 결과를 바탕으로 열처리를 통해 자가형성된 V-based interlayer의 Cu/low-k 간 확산방지막으로서 가능성을 검증하였다.

• 한국항공우주학회지
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• 제33권12호
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• pp.109-116
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• 2005

재생냉각형 액체로켓 연소기의 냉각채널 설계에 대한 탄-소성 구조설계를 수행하였다. 구조해석에 필요한 데이터를 얻기 위하여 여러 가지 온도에서 재생냉각 챔버 제작에 사용하는 구리합금의 단축인장시험을 수행하였다. 재료시험 결과 구리합금은 브레이징 공정 후에 연화되어 강도 값이 매우 저하되며 온도가 증가함에 따라 유동 응력 값이 더 작게 나타났다. 재료시험 데이터를 이용하여 냉각채널의 구조해석을 수행한 결과 채널 내부 냉각유체에 의한 내부압력보다 고온의 연소가스에 의한 열 하중에 의하여 채널의 변형이 심하게 발생함을 확인하였다. 따라서 기계적인 하중을 견딜 수 있는 한도 내에서 냉각채널의 두께를 감소시켜 열 하중을 최소화함으로서 연소기의 무게 감소, 냉각성능 향상, 그리고 구조적인 안정성을 향상시킬 수 있다는 것을 알 수 있었다.

• Fisheries and Aquatic Sciences
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• 제14권1호
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• pp.43-54
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• 2011

Gene structure of copper/zinc-superoxide dismutase (Cu/Zn-SOD; sod1) was characterized in Hemibarbus mylodon (Teleostei; Cypriniformes), an endangered freshwater fish species in Korean peninsula. Full-length cDNA of H. mylodon SOD1 consisted of a 796-bp open reading frame sequence encoding 154 amino acids, and the deduced polypeptide sequence shared high sequence homology with other orthologs, particularly with regard to metal-coordinating ligands. Genomic structure of the H. mylodon sod1 gene (hmsod1; 1,911 bp from the ATG start codon to the stop codon) was typical quinquepartite (i.e., five exons interrupted by four introns); the lengths of the exons were similar among species belonging to various taxonomic positions. The molecular phylogeny inferred from sod1 genes in the teleost lineage was in accordance with the conventional taxonomic assumptions. 5'-flanking upstream region of hmsod1, obtained using the genome walking method, contained typical TATA and CAAT boxes. It also showed various transcription factor binding motifs that may be potentially involved in stress/immune response (e.g., sites for activating proteins or nuclear factor kappa B) or metabolism of xenobiotic compounds (e.g., xenobiotic response element; XRE). The hmsod1 transcripts were ubiquitously detected among tissues, with the liver and spleen showing the highest and lowest expression, respectively. An experimental challenge with Edwardsiella tarda revealed significant upregulation of the hmsod1 in kidney (4.3-fold) and spleen (3.1-fold), based on a real-time RT-PCR assay. Information on the molecular characteristics of this key antioxidant enzyme gene could be a useful basis for a biomarker-based assay to understand cellular stresses in this endangered fish species.