• Title/Summary/Keyword: copper stress

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Analysis of Thermal Stress and Deformation of Casting Roll in Twin Roll Strip Casting Process (쌍롤형 박판주조공정에서 주조 롤의 열응력 및 열변형 해석)

  • Park, Cheol-Min;Kim, Wan-Su;Park, Gyeong-Jin
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.26 no.9
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    • pp.1943-1951
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    • 2002
  • The casting roll design is one of the most important requirements in twin roll strip casting process. Coupled analyses of heat transfer and deformation for the cast roll are carried out by use of the finite element program MARC to examine the thermal stress and deformation. The effects of several factors on thermal stress and deformation are also investigated. The amount of thermal stress increases when the ni thickness increases and when the casting speed and the copper sleeve thickness decrease.

Design of Hot Extrusion Dies for Hexagonal Insert (Hexagonal 인서트용 열간압출 금형설계)

  • 권혁홍;이정로
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2001.04a
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    • pp.72-77
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    • 2001
  • The use of hexagonal ceramic inserts for copper extrusion dies offers significant technical and economic advantages over other forms of manufacture. In this paper the data on the loading of the tools is determined from a commercial FEM package as the contact stress distribution on the die-workpiece interface and as temperature distributions in the die. This data can be processed as load input data for a finite element die-stress analysis. Process simulation and stress analysis are thus combined during the design, and a data exchange program has been developed that enables optimal design of the dies taking into account the elastic deflections generated in shrink fitting the die inserts and that caused by the stresses generated in the process. The stress analysis of the dies is used to determine the stress conditions on the ceramic insert by considering contact and interference effects under both mechanical and thermal loads.

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Evaluation of Residual Stress Effect about Fatigue Characteristic of U-shaped Structure (U자형 구조의 피로특성에 대한 잔류응력의 영향 평가)

  • Kim, Sang-Young;Koo, Jae-Mean;Seok, Chang-Sung;Mo, Jin-Yong
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.4
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    • pp.79-86
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    • 2010
  • Mechanical structures with power sources experience repeated force produced by motors. In result, the life of the pipes reduces and ultimately, the pipes collapse. Such pipes are formed into several shapes and particularly, the U-shape pipe is damaged frequently. In most cases, the U-shape pipe is made with a straight pipe by complicated bending work. During this work process, plastic deformation of the pipe produces residual stress in the pipe. This residual stress significantly affects the fracture behavior of the pipe and induces the change of the stress ratio (min. stress/Max. stress = R). For this reason, residual stress has to be evaluated. In this paper, the residual stress of a U-shaped pipe was evaluated by FEM analysis. In addition, fatigue tests of the U-shaped pipe were performed by using a uniaxial fatigue testing machine. The results of the fatigue test were modified with the results of FEM (Finite Element Method) analysis for residual stress. The modified fatigue test results of the U-shaped pipe were compared with those of a straight pipe.

Enhancement of Spermidine Content and Antioxidant Capacity by Modulating Ginseng Spermidine synthase in Response to Abiotic and Biotic Stresses

  • Parvin, Shohana;Lee, Ok-Ran;Sathiyaraj, Gayathri;Kim, Yu-Jin;Khorolragchaa, Altanzul;Yang, Deok-Chun
    • Proceedings of the Plant Resources Society of Korea Conference
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    • 2011.10a
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    • pp.14-14
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    • 2011
  • Polyamines (putrescine, spermidine and spermine) play pivotal roles in plant defense to different abiotic and biotic stresses. In order to understand the function of ginseng spermidine synthase gene, a key gene involved in biosynthesis of polyamines, transgenic plant was generated in Arabidopsis. The transgenic plants exhibited high levels of polyamines compared to the untransformed control plants. We investigated the tolerance capacity of transgenic plants to abiotic stresses such as salinity and copper stress. In addition, transgenic plants also showed increased resistance against one of the important fungal pathogens of ginseng, the wilt causing Fusarium oxysporum and one of important bacteria, bacterial blight causing Pseudomonas syringae. However, an activity of the polyamine catabolic enzyme, diamine oxidase (DAO) was increased significantly in F. oxysporum and P. syringae infected transgenic plant. Polyamine catabolic enzymes which may trigger the hypersensitive response (HR) by producing hydrogen peroxide ($H_2O_2$) seem act as an inducer of PR proteins, peroxidase and phenyl ammonium lyase activity. The transgenic plants also contained higher antioxidant enzyme activities, less MDA and $H_2O_2$ under salt and copper stress than the wild type, implying it suffered from less injury. These results strongly suggest an important role of spermidine as a signaling regulator in stress signaling pathways, leading to build-up of stress tolerance mechanisms.

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Variation of Carbonization Pattern and Crystal Structure of Polyvinyl Chloride Wire Under the Thermal Stresses (열 스트레스에 의한 비닐절연전선의 탄화 패턴 및 결정 구조의 변화)

  • Choi, Chung-Seog;Kim, Hyang-Kon
    • The Transactions of the Korean Institute of Electrical Engineers P
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    • v.57 no.3
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    • pp.332-337
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    • 2008
  • We analyzed carbonization pattern and crystal structure of polyvinyl chloride wire by thermal stress. Copper that is oxidized at normal temperature is a reddish brown. If under the thermal stress range of 500 to 700 [$^{\circ}C$], carbonization and exfoliation occurrence. Section structure of electric wire is same as arrangement of particle in metallograph analysis. But, as thermal stress increases, size of particle is enlarged. Electric wire displays elongation structure in SEM image analysis and elongation structure collapses when receive thermal stress at 300 [$^{\circ}C$]. In EDX analysis, we get the spectra of CuL, CuK, OK, and ClK. FT-IR analysis was shown new spectra with in range of $1,440{\sim}1,430\;[cm^{-1}]$, 1,340 [$cm^{-1}$], 1,240 [$cm^{-1}$].

Analysis of Stress-Strain Relationship of Nano Structures According to the Size and Crystal Orientation by Using the Molecular Dynamics Simulation (분자동역학을 이용한 나노구조물의 크기와 결정방향에 따른 응력-변형률 관계 해석)

  • Kang, Yong-Soo;Kim, Hyun-Gyu
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.32 no.12
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    • pp.1047-1054
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    • 2008
  • In this paper, the molecular dynamics (MD) simulations are performed with single-crystal copper blocks under simple shear and simple tension to investigate the effect of size and crystal orientation. There are many variances to give influences such as deformation path, temperature, specimen size and crystal orientation. Among them, the crystal orientation has a primary influence on the volume averaged stress. The numerical results show that the volume averaged shear stress decreases as the specimen size increases and as the crystal orientation changes from single to octal. Furthermore, the Schmid factor and yield stress for crystal orientation are evaluated by using the MD simulation on the standard triangle of stereographic projection.

Over-expression of Cu/ZnSOD Increases Cadmium Tolerance in Arabidopsis thaliana

  • Cho, Un-Haing
    • Journal of Ecology and Environment
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    • v.30 no.3
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    • pp.257-264
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    • 2007
  • Over-expression of a copper/zinc superoxide dismutase (Cu/ZnSOD) resulted in substantially increased tolerance to cadmium exposure in Arabidopsis thaliana. Lower lipid peroxidation and $H_2O_2$ accumulation and the higher activities of $H_2O_2$ scavenging enzymes, including catalase (CAT) and ascorbate peroxidase (APX) in transformants (CuZnSOD-tr) compared to untransformed controls (wt) indicated that oxidative stress was the key factor in cadmium tolerance. Although progressive reductions in the dark-adapted photochemical efficiency (Fv/Fm) and quantum efficiency yield were observed with increasing cadmium levels, the chlorophyll fluorescence parameters were less marked in CuZnSOD-tr than in wi. These observations indicate that oxidative stress in the photosynthetic apparatus is a principal cause of Cd-induced phytotoxicity, and that Cu/ZnSOD plays a critical role in protection against Cd-induced oxidative stress.

Development of Electrode Guide of Super-drill EDM and Electrical Discharge Machining of Small Hole for High Precision Semiconductor Die (초정밀 반도체 금형 제작을 위한 슈퍼드릴 방전가공기 전극가이드 개발과 미세홀 방전가공)

  • Park, Chan-Hae;Kim, Jong-Up;Wang, Duck-Hyun;Kim, Won-Il
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.4 no.3
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    • pp.32-38
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    • 2005
  • Electrical discharge machining is the method of using thermal energy by electrical discharge. Generally, if the material of workpiece has conductivity even though very hard materials and complicated shape which are difficult to cut such as quenching steel, cemented carbide, diamond and conductive ceramics, the EDM process is favorable one of possible machining processes. But, the process is necessarily required of finish cut and heat treatment because of slow cutting speed, no mirror surface, brittleness and crack due to the residual stress for manufactured goods. In this experimental thesis, the super EDM drilling was developed for high precision semiconductor die steel and for minimization of leadframe width. It was possible to development of EDM drilling machine for high precision semiconductor die with the electrode guide and its modelling and stress analysis. The development of electrode with the copper pipe type was conducted to drill the hole from the diameter of 0.1mm to 3.0mm with the error of from 0.02mm to 0.12mm. From the SEM and EDX analysis, the entrance of the EDM drill was found the resolidification of not only the component of tungsten but also the component of copper.

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Extrusion Process Analysis of Al/Cu Clad Composite Materials by Finite Element Method (유한요소법을 이용한 Al/Cu 층상복합재료의 압출공정해석)

  • 김정인;강충길;권혁천
    • Composites Research
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    • v.12 no.5
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    • pp.87-97
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    • 1999
  • A clad material is a different type of the typical composites which are composed of two or more matericals joined at their interface surface. The advantge of cald material is that the combination of different materials can satisfy both the need of good mechanical properties and the other demand of user such as electrical properties instantaneously. This paper is concerned with the direct and indirect extrusion processes of copper-clad aluminum rod. Extrusion of copper-clad aluminum rod was simulated using a commercially available finite element package of DEFORM. The simulations were performed for copperclad aluminum rod to predict the distributions of temperature, effective stress, effective strain rate and mean stress for sheath thicknesses, die exit diameters and die temperatures.

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Influence of Applied Current Density on Properties of Cu thin layer Electrodeposited from Copper Pyrophosphate Bath (피로인산동 도금용액으로부터 전기도금 된 Cu 도금층의 물성에 미치는 인가전류밀도의 영향)

  • Yoon, Pilgeun;Park, Deok-Yong
    • Journal of the Korean institute of surface engineering
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    • v.53 no.4
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    • pp.190-199
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    • 2020
  • Copper pyrophosphate baths were employed in order to study the dependencies of current efficiency, residual stress, surface morphology and microstructure of electrodeposited Cu thin layers on applied current density. The current efficiency was obtained to be more than about 90 %, independent of the applied current density. Residual stress of Cu electrodeposits was measured to be in the range of -30 MPa and 25 MPa with the increase of applied current density from 0.5 to 15 mA/㎠. Relatively smooth surface morphologies of the electodeposited Cu layers were obtained at an intermediate current range between 3 and 4 mA/㎠. The Cu electrodeposits showed FCC(111), FCC(200), and FCC(220) peaks and any preferred orientation was not observed in this study. The average crystalline size of Cu thin layers was measured to be in the range of 44~69 nm.