• Resources Recycling
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• v.3 no.3
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• pp.7-11
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• 1994

The recovery of copper from $\alpha$-Etchent waste and pure copper solution was studied by the $H_2$reduction process. The results of test were as following: 1) The recovery of copper was increased with increasing hydrogen pressure and stirring speed up to 300 psi and 500 rpm, respectively, and was decreased in the higher values. But the recovery of copper from the fresh copper solution and $\alpha$-Etchent solution reached 90% and 60%, respectively. And in all tests the copper recovery from pure copper solution is higher by 30~40% than that from $\alpha$Etchent solution. 2) The recovery of copper was increased up to 30 minute of reaction time, and after then it became constant. The copper particles prepared in the initial 30 min have the needle-like shapes and in the longer reaction time than 30 min the shape was changed into noudle-like form. The average particle size was about $2~3\mu\textrm{m}$.

• Applied Chemistry for Engineering
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• v.25 no.3
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• pp.307-311
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• 2014

In this present study, Castanea crenata was found as an excellent biosorbent for the removal capability of copper ions among four different wood wastes (Castanea crenata, Pinus densiflora, Larix kaemoferi and Robinia pseudoacaia). Also, the removal efficiencies of 5, 10, 20, 40 and 50 mg/L copper ions using Castanea crenata from aqueous solution were investigated. The most effective particle size of Castanea crenata for removing 5 mg/L copper ions was found to be $43{\sim}63{\mu}m$. When the concentration of Castanea crenata increased, the removal efficiencies of copper ions were enhanced. In addition, when the 0.8 g/100 mL of Castanea crenata was used for 30 min, the removal efficiencies of 20 and 40 mg/L copper ions were 99% and 85%, respectively. Moreover, the chemical treatment of Castanea crenata with 1 M sodium acetate was required to improve the removal ability for 50 mg/L copper ions. Meanwhile, 1 M hydrochloric acid was selected as the optimal desorption agent with 93% desorption efficiency of copper ions for recycling of modified Castanea crenata. Therefore, these experimental results could be employed as economical and practical engineering data for the development of copper removal processes.

• Journal of Preventive Medicine and Public Health
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• v.31 no.3 s.62
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• pp.414-423
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• 1998

Metal fume fever has been known as an occupational disease is induced by intense inhalation of fresh metal fume with a particle size smaller than $0.5{\mu}m\;to\;1{\mu}m$. The fumes originate from heating metals beyond their boiling point, as happens, for example, in welding operations. Oxidation usually accompanies this process. In most cases, this syndrome is due to exposure to zinc oxide fumes; however, other metals like copper, magnesium, cadmium, manganese, and antimony are also reported to produce such reactions. Authors report a case of metal fume fever suspected to be associated with copper fume inhalation. The patient was a 42-year-old male and was a smoker. He conducted inert gas tungsten arc welding on copper-coated materials without safety precautions such as a protective mask and adequate ventilation. Immediately after work, he felt metallic taste in his mouth. A few hours after welding, he developed headache, chilling sensation, and chest discomfort. He also complained of myalgia, arthralgia, feverish sensation, thirst, and general weakness. Symptoms worsened after repeated copper welding on the next day and subsided gradually following two weeks. Laboratory examination showed a transient increase of neutrophil count, eosinophilia, elevated erythrocyte sedimentation rate, and positive C-reactive proteinemia. Blood and urine copper level was also increased compared to his wife. Before this episode, he experienced above complaints several times after welding with copper materials but welding of other metals did not produce any symptoms. It was suggested that copper fume would have induced metal fume fever in this case. Further investigations are needed to clarify their pathogenic mechanisms.

• Transactions of the Korean hydrogen and new energy society
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• v.28 no.1
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• pp.70-76
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• 2017

To synthesize copper nanoparticle a thermal decomposition was adopted. And to solve the problem of surface oxidation of the synthesized copper powder an electroless Ag plating method was used. The size and shape of synthesized Cu nanoparticle were affected by the size of copper oxalate used as a precursor, reaction solvent, reaction temperature and amount of reducing agent. Especially reaction solvent is dominant factor to control shape of Cu nano-particle which can have the shapes of sphere, polygon and rod. In case of glycerol, it produced spherical shape of about 500 nm in size. Poly ethylene produced uniform polygonal shape in about 700 nm and ethylene glycol produced both of polygon and rod having size range between 500 and 1500 nm. The silver coated copper powder showed a high electrical conductivity.

• Korean Journal of Materials Research
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• v.4 no.4
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• pp.393-400
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• 1994

A new process for uniform coating of copper to submicron tungsten powder has been developed. W-Cu alloy where copper can be uniformly distibuted has been made by the liquid phase sintering of thus prepared tungsten powder. It has been found that copper content can be lowered less than IOwt. % in our new process, maintaining the uniform distribution of copper in W-Cu alloy. Relative density above 96% was obtained after the liquid phase sintering when small amount of cobalt was added. It was revealed that the rapid increase of densification rate was due to the enhancement of wettability between tungsten particle and liquid copper.

• Korean Journal of Materials Research
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• v.16 no.5
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• pp.285-291
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• 2006

Copper powders have been widely used in electrically conductive coatings, electrode materials et al. and are very prospective since they are cheaper than noble metal powders such as silver or palladium. In this study, copper powders for metal filler of EMI shielding have been prepared using a solvothermal process from $CuSO_4$, NaOH, Glucose, mixed solvent ($H_2O$: Ethanol) and hydrazine which was used as a reducing agent at various reaction conditions. The prepared copper powders showed finely dispersed spherical shape without agglomerate, uniform morphology, narrow size distribution, high purity and were about 400-700 nm in size. The prepared powders were characterized using XRD, SEM, TGA, XPS, particle size measurement and EMI shielding efficiency.

• Korean Journal of Materials Research
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• v.3 no.2
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• pp.103-110
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• 1993

Abstract It has been attempted to make the copper-graphite composites by deposition of copper on the surface of graphite through the hydrogen reduction of copper chlorides. Both KISH and natural graphites of less than 325 mesh were used as substrates and the hydrogen reduction also was conducted in the range of 350-50$0^{\circ}C$. The distribution of copper on the surface of graphite was found to increase with the decrease of reduction temperature. In addition. the partial pressure of hydrogen played an important role in the overall rate of reduction which was substantially dominated by the chemical reaction on the surface of each particle. It was concluded that the reduction temperature should be maintained as low as possible to accomplish the well distribution of copper in the composites.

• Proceedings of the KIEE Conference
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• 2006.07a
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• pp.603-604
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• 2006

We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. According to the CMP removal rates and particle size distribution, and the micro- structures of surface layer as a function of oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_{2}O_3$ abrasive particles in CMP slurry.

• Journal of the Korean Society of Safety
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• v.1 no.1
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• pp.27-32
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• 1986

To remove sulfur dioxide from flue gas by the method of metal oxide, copper powder of average diameter $2.4\mu\textrm{m}$and $51\mu\textrm{m}$ were used in a fixed bed reactor over a, temperature range of $300^{\circ}C-500^{\circ}C$. Copper oxide reacts with sulfur dioxide producing cupric sulfate and it can be regenerated from the latter by using hydrogen or methane. Experimental results showed that the reaction rate was increased by the increase of reaction temperature in the range of $300^{\circ}C-422^{\circ}C$ and the removal efficiency of sulfur dioxide was high in case of small size copper particle. However the removal efficiency was decreased at higher temperature due to decomposition of cupric sulfate. The rate controlling step of this reaction was chemical reaction and deactivating catalysts model can be applied to this reaction. The rate constants for this reaction and deactivation are as follows ： k＝8,367exp(-10,298/RT) Kd＝2.23exp(-8,485/RT)

• Proceedings of the KIEE Conference
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• 2006.07b
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• pp.1269-1270
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• 2006

We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. According to the CMP removal rates and particle size distribution, and the micro-structures of surface layer as a function of oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_2O_3$ abrasive particles in CMP slurry.