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http://dx.doi.org/10.3740/MRSK.2006.16.5.285

The Preparation of Copper Powder Using Solvothermal Process and Its Application as EMI Shielding Agent  

Lee, Hyo-Won (Korea Institute of Ceramic Eng. and Tech)
Kim, Soo-Ryong (Korea Institute of Ceramic Eng. and Tech)
Kwon, Woo-Teck (Korea Institute of Ceramic Eng. and Tech)
Choi, Duck-Kyun (Korea Institute of Ceramic Eng. and Tech)
Kim, Young-Hee (Department of Ceramic Engineering, Hanyang University)
Publication Information
Korean Journal of Materials Research / v.16, no.5, 2006 , pp. 285-291 More about this Journal
Abstract
Copper powders have been widely used in electrically conductive coatings, electrode materials et al. and are very prospective since they are cheaper than noble metal powders such as silver or palladium. In this study, copper powders for metal filler of EMI shielding have been prepared using a solvothermal process from $CuSO_4$, NaOH, Glucose, mixed solvent ($H_2O$: Ethanol) and hydrazine which was used as a reducing agent at various reaction conditions. The prepared copper powders showed finely dispersed spherical shape without agglomerate, uniform morphology, narrow size distribution, high purity and were about 400-700 nm in size. The prepared powders were characterized using XRD, SEM, TGA, XPS, particle size measurement and EMI shielding efficiency.
Keywords
copper powder; wet reduction process; solvothermal; hydrazine; EMI shielding agent;
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Times Cited By KSCI : 1  (Citation Analysis)
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1 S. Che, O. Sakurai, T. Yasuda, K. Shinozaki and N. Mizutani, J. Ceram. Soc. Jpn., 105, 269 (1997)   DOI   ScienceOn
2 Y. T. Moon, H. K. Park, K. K. Kim and C. H. Kim, J. Am. Ceram. Soc., 78, 1103 (1995)   DOI   ScienceOn
3 R. Ueyama, T. Ueyama and K. Koumotoa, J. Ceram. Soc. Jpn., 109(11), 963 (2001)   DOI
4 R. A. Crane, L. C. Chao and R. P. Andres, in Proceedings of the Materials Research Society Symposium., 368, 127 (1995)
5 C. Y. Huang and S. R. Sheen, Material Letters, 30, 357 (1997)   DOI   ScienceOn
6 Y. T. Yu and Y. Y. Choi, Kor. J. Mater. Res., 13(8), 524 (2003)   DOI   ScienceOn
7 J. H. Yoon, H. W. Kwon, Y. T. Yu, B. G. Kim and G. S. Kim, Kor, J. Mater. Res., 15, 4 (2005)