• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2008년도 추계학술대회A
• /
• pp.1880-1884
• /
• 2008

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-steop CMP consists of Cu CMP and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the buffing is performed various conditions as a cleaning process. The buffing process combined mechanical cleaning by friction between a wafer and a buffing pad and chemical cleaning by buffing solution consists of tetramethyl ammonium hydroxide (TMAH)/benzotriazole(BTA).

• Korea-Australia Rheology Journal
• /
• 제17권2호
• /
• pp.35-40
• /
• 2005

Nanofluid is a novel heat transfer fluid prepared by dispersing nanometer-sized solid particles in traditional heat transfer fluid to increase thermal conductivity and heat transfer performance. In this research we have considered the rheological properties of nanofluids made of CuO particles of 10-30nm in length and ethylene glycol in conjunction with the thermal conductivity enhancement. When examined using TEM, individual CuO particles have the shape of prolate spheroid of the aspect ratio of 3 and most of the particles are under aggregated states even after sonication for a prolonged period. From the rheological property it has been found that the volume fraction at the dilute limit is 0.002, which is much smaller than the value based on the shape and size of individual particles due to aggregation of particles. At the semi-dilute regime, the zero shear viscosity follows the Doi-Edwards theory on rodlike particles. The thermal conductivity measurement shows that substantial enhancement in thermal conductivity with respect to particle concentration is attainable only when particle concentration is below the dilute limit.

• 분석과학
• /
• 제8권4호
• /
• pp.411-418
• /
• 1995

A method for the direct determination of elemental content in each of aerosol particles by inductively coupled plasma atomic emission (ICP-AES) or mass spectrometry (ICP-MS) is described. This method is based upon the introduction of diluted aerosol into an ICP and the measurement of either the flash emission intensities of an atomic spectral line or ion intensities. A pulse-height analyzer is used for the measurement of the distribution of the elemental content. In order to calibrate the measuring system, monodisperse aerosols are used. The potentials of the method are shown by demonstrating the copper emission signals from the aerosols generated at a small electric switch, a study of the relation between the decreasing rate of particle number density and particle size, and measurements of calcium contents in the individual biological cells.

• 한국입자에어로졸학회지
• /
• 제6권1호
• /
• pp.37-46
• /
• 2010

Cu nano-colloid was prepared by wire electric explosion process under de-mineralized water and anhydrous ethanol. To control the properties of Cu nano-colloid, experimental conditions such as diameter of Cu wire and applied voltage were changed. The optimal Cu nano-colloid was prepared when the 0.1mm diameter of Cu wire with the applied voltage of 2000 V was used. The shape of Cu particles in colloid was spherical and the XRD result revealed that the phase of Cu particles was cubic phase. About 20nm Cu nanoparticles with high crystallinity were successfully prepared using wire explosion process under anhydrous ethanol and they showed more than 100 hours dispersion stability.

• 한국광물학회지
• /
• 제28권1호
• /
• pp.17-28
• /
• 2015

구리 슬래그에 대한 광물학적 및 화학적 특성을 연구하기 위하여 광학현미경, SEM/EDS, EPMA, AAS 및 XRD분석을 수행하였다. 또한 이 슬래그가 Cu의 잠재적인 금속자원로서의 가능성이 있는지 조사하기 위하여 황산 용출-실험을 수행하였다. 슬래그에는 철감람석, 크롬철석, 반동석과 황동석이 포함되어 있는 것을 확인하였다. 침상의 철감람석과 뼈대구조의 자형 크롬철석이 주로 슬래그를 형성하고 있으며 많은 양의 반동석과 황동석이 포함되어 있었다. 슬래그에 Fe와 Cu가 각각 18.37%와 0.93%로 함유되었다. 황산 용출-실험을 수행한 결과, 용출액의 농도와 용출온도가 증가할수록, 입도가 감소할수록 Cu와 Fe 용출률은 증가하였다. 본 실험조건하에서는 Cu와 Fe가 최적으로 용출되는 조건은 32 mesh에서, 2.0 M의 황산농도에서 그리고 용출온도 $60^{\circ}C$에서였다. 따라서 향후, 용출규모를 증가시킨다면 슬래그는 구리의 잠재적 대체금속자원이 될 것으로 예상된다.

• Nuclear Engineering and Technology
• /
• 제52권9호
• /
• pp.1939-1944
• /
• 2020

Pool boiling heat transfer of a copper microporous coating was experimentally studied in borated water with a concentration of boric acid from 0.0 to 5.0 vol percent (vol%) to determine the effect of boric acid on boiling heat transfer in water. A high-temperature, thermally conductive microporous coating (HTCMC) was created by sintering copper powder with an average particle size of 67 ㎛ onto a 1 cm × 1 cm plain copper surface with a coating thickness of ~300 ㎛ within a furnace in a vacuum environment. The tests showed that the nucleate boiling heat transfer coefficient (NBHT) of HTCMC became slightly less enhanced as the concentration of boric acid increased but the NBHT coefficient values were still significantly higher than those of the plain surface. The critical heat flux (CHF) values from 0 to 1.0 vol% were maintained at ~2,000 kW/㎡, and then, they gradually decreased down to ~1,700 kW/㎡ as the concentration increased further to 5.0 vol%. It is believed that the micro-scale pores of the HTCMC were partially blocked by the high boric acid concentration during the nucleate boiling such that the small bubbles were not effectively created using the HTCMC reentrant cavities as the boric acid concentration increased.

• Restorative Dentistry and Endodontics
• /
• 제9권1호
• /
• pp.101-106
• /
• 1983

It was the purpose of this study to investigate the fracture mode of dental amalgam by observing the crack propagation, and to relate this to the microstructure of the amalgam. Caulk 20th Century Regular, Caulk Spherical, Dispersalloy, and Tytin amalgam alloys were used for this study. After each amalgam alloy and Hg measured exactly by the balance was triturated by the mechanical amalgamator (Capmaster, S.S. White), the triturated mass was inserted into the cylindrical metal mold which was 4 mm in diameter and 12 mm in height and was pressed by the Instron Universal Testing Machine at the speed of 1mm/min with 120Kg. The specimen removed from the mold was stored in the room temperature for a week. This specimen was polished with the emery papers from #100 to #200 and finally on the polishing cloth with 0.06${\mu}Al_2O_3$ powder suspended in water. The specimen was placed on the Instron testing machine in the method similar to the diametral tensile test and loaded at the crosshead speed of 0.05mm/min. The load was stopped short of fracture. The cracks on the polished surface of specimen was examined with scanning electron microscope (JSM-35) and analyzed by EPMA (Electron probe microanalyzer). The following results were obtained. 1. In low copper lathe-cut amalgam, the crack went through the voids and ${\gamma}_2$ phase, through the ${\gamma}_1$ phase around the ${\gamma}$ particles. 2. In low copper spherical amalgam, it was observed that the crack passed through the ${\gamma}_2$ and ${\gamma}_1$ phase, and through the boundary between the ${\gamma}_1$ and ${\gamma}$ phase. 3. In high copper dispersant (Dispersalloy) amalgam, the crack was found to propagate at the interface between the ${\gamma}_1$ matrix and reaction ring around the dispersant (Ag-Cu) particles, and to pass through the Ag-Sn particles. 4. In high copper single composition (Tytin) amalgam, the crack went through the ${\gamma}_1$ matrix between ${\eta}$ crystals, and through the unreacted alloy particle (core).

• 자원리싸이클링
• /
• 제27권1호
• /
• pp.55-63
• /
• 2018

열처리 조건에 따른 폐 인쇄회로기판의 물성 변화에 대해 조사하였다. 열처리는 $200^{\circ}C$부터 $325^{\circ}C$까지 공기 및 질소분위기에서 시행하였다. 열중량 분석 결과 인쇄회로기판은 두 단계로 열분해되었으며, 공기 분위기와 질소 분위기 공히 $300^{\circ}C$ 전후에서 층분리로 인해 인쇄회로기판의 두께가 11~28% 팽창되었다. 기계적 강도는 열처리 유 무에 따라 338.4 MPa에서 20.3~40.2 MPa까지 감소하였다. 열처리한 인쇄회로기판을 파쇄 후 체분리하여 입도에 따른 밀도 분포 및 단체분리도를 측정하였다. 밀도측정 결과, 비금속 입자와 구리 입자가 각각 다른 입도구간에 집중되었다. 구리의 단체분리도는 열처리를 함으로써 $1,400{\sim}2,000{\mu}m$ 구간에서 9.3%에서 100%로 향상되었다.

• 한국분말재료학회지
• /
• 제12권3호
• /
• pp.192-200
• /
• 2005

Ultrafine copper powder was prepared from $CuO-H_2O$ slurry with hydrazine, a reductant, under $70^{\circ}C$. The influence of various reaction parameters such as temperature, reaction time, molar ratio of $N_2H_4$, PvP and NaOH to Cu in aqueous solution had been studied on the morphology and powder phase of Cu powders obtained. The production ratio of Cu from CuO was increased with the ratio of $N_2H_4/Cu$ and the temperature. When the ratio of $N_2H_4/Cu$ was higher than 2.5 and the temperature was higher than $60^{\circ}C$, CuO was completely reduced into Cu within 40 min. The crystalline size of Cu obtained became fine as the temperature increase, whereas the aggregation degree of particles was increased with the reaction time. The morphology of Cu powder depended on that of the precursor of CuO and processing conditions. The average particle size was about $0.5{\mu}m$.

• 자원리싸이클링
• /
• 제25권6호
• /
• pp.98-104
• /
• 2016

본 연구의 목적은 호주산 저품위 동광을 부유선별하여 정광으로 회수하고자 할 때, 최적의 부유선별 조건을 얻고자 하는데 있다. 본 연구에서는 저품위 동광의 파분쇄 및 분급에 의해 선별에 적절한 입자크기의 시료를 얻은 다음, 이를 대상으로 부유선별 시 포수제, 활성제, 억제제의 첨가량 및 광액의 pH 변화가 부선효율에 미치는 영향을 조사함으로써 품위가 향상된 정광을 얻고자 하였다. 본 연구실험결과 얻은 최적의 부유선별 조건은 광액산도 pH9.0, 활성제 500 g/t $CuSO_4{\cdot}5H_2O$, 포수제 500 g/t K.E.X, 억제제 1500 g/t $Na_2SO_3$, 광액농도는 25 wt.% 이었다. 최적조건하에서 얻은 정광중의 동 품위 및 회수율은 각각 4 wt.%와 65 wt.% 정도이었고 대부분 철 성분을 함유한 광물 이었다.