• Title/Summary/Keyword: copper particle

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Photocatalysis Characteristics of Nano Cu/TiO2 Composite Powders Fabricated from Salt Solution (염용액으로부터 제조된 Cu/TiO2복합분말의 광촉매 특성)

  • 고봉석;안인섭;배승열;이상진
    • Journal of Powder Materials
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    • v.10 no.2
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    • pp.136-141
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    • 2003
  • In the present study, $TiO_2$ imbedded copper matrix powders have been successfully prepared from the ($CuSO_4+TiO_2+Zn$) composite salt solution. The composite $Cu/TiO_2$ powders were formed by drying the solution at $200{\sim}~400^{\circ}C$ in the hydrogen atmosphere. Photocatalytic characteristics was evaluated by detecting TOC (total organic carbon) amount with TOC analyzer (model 5000A Shimadzu Co). Phase analysis of $Cu/TiO_2$ composite powders was carried out by XRD, DSC and powder size was measured with TEM. The mean particle size of composite powders was about 100 nm and a few zinc and copper oxide phases was included. The reduction ratio of TOC amount was 60% by the composite $Cu/TiO_2$ powders under the UV irradiation for 8 hours.

The factors of dimensional change of Fe-Cu-C sintered objects

  • Fujinaga, Masashi;Suzuki, Yoshitomo
    • Journal of Powder Materials
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    • v.5 no.4
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    • pp.299-302
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    • 1998
  • Dimensional accuracy is one of the most important issues in the production of sintered parts. The iron-copper-carbon system is commonly used alloys in sintered structural parts production. The dimensional control of these alloys, however, is not easy because of their complex sintering behavior. This study is an effort to clarify the influence of common factors on dimensional change of Fe-Cu-C sintered structural parts. We determined the effect of such various parameters as chemical composition, particle diameter, compact density, sintering temperature and sintering time on dimensional changes. Consequently, we obtained a useful formula to predict the final dimension in function of these parameters. The effect of typical impurities in copper powder on the dimensional change of sintered parts has also been described.

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Microstructure and Synthesis of Ag Spot-coated Cu Nanopowders by Hydrothermal-attachment Method using Ag Colloid (수열흡착법을 이용한 은 점코팅된 구리 나노분말의 합성과 미세조직)

  • Kim, Hyeong-Chul;Han, Jae-Kil
    • Journal of Powder Materials
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    • v.18 no.6
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    • pp.546-551
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    • 2011
  • Ag spot-coated Cu nanopowders were synthesized by a hydrothermal-attachment method (HA) using oleic acid capped Ag hydrosol. Cu nano powders were synthesized by pulsed wire exploding method using 0.4 mm in diameter of Cu wire (purity 99.9%). Synthesized Cu nano powders are seen with comparatively spherical shape having range in 50 nm to 150 nm in diameter. The oleic acid capped Ag hydrosol was synthesized by the precipitation-redispersion method. Oleic acid capped Ag nano particles showed the narrow size distribution and their particle size were less than 20 nm in diameter. In the case of nano Ag-spot coated Cu powders, nanosized Ag particles were adhered in the copper surface by HAA method. The components of C, O and Ag were distributed on the surface of copper powder.

A Bonding Surface Behavior of Bi-metal Bar through Hydrostatic Extrusion (이중복합봉 정수압 압출시 접합면 거동에 관한 연구)

  • 박훈재;나경환;조남선;이용신
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 1997.03a
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    • pp.140-143
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    • 1997
  • The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding, the normal pressure and the contact surface expansion are selected as process parameters governing the bonding condition. The critical pressure required for the bonding at the interface is obtained by solving a "local extrusion" using a slip line meyhod. A viscoplastic finite element method is used to analyze the steady state extrusion process. The boundary profile of bi-metal rod is predicted by tracking a particle path adjacent to interface surface. The variations of contact surface area and the normal pressure along the interface profile are predicted and compared to those by experiments.

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Effects of Tungsten Particle Size and Nickel Addition in DC arc Resistance of Cu-W Electrode

  • Kim, Bong-Seo;Jeong, Hyun-Uk;Lee, Hee-Woong
    • KIEE International Transactions on Electrophysics and Applications
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    • v.4C no.2
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    • pp.68-72
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    • 2004
  • The performance of copper-tungsten for electrodes used in an ultra high voltage interruption system was evaluated by means of an interruption test, which requires a large-scale apparatus and high cost. In this study, prior to the interruption test, the characteristics of a Cu-W electrode were estimated through the DC arc test, which is a simple, low cost procedure. The DC arc characteristics of a 20wt%Cu-80wt%W electrode were investigated with the change of tungsten powder size distribution and the addition of nickel. In specimens containing a high volume fraction of large sized tungsten particles, the relative density and hardness of sintered Cu-W electrodes increased while the electrical conductivity and the DC arc resistance decreased. Furthermore, the relative density became enhanced with the increase of the amount of nickel while the hardness and electrical conductivity diminished and the DC arc resistance worsened.

Wear Debris Analysis using the Color Pattern Recognition (칼라 패턴인식을 이용한 마모입자 분석)

  • ;A.Y.Grigoriev
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2000.06a
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    • pp.54-61
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    • 2000
  • A method and results of classification of 4 types metallic wear debris were presented by using their color features. The color image of wear debris was used (or the initial data, and the color properties of the debris were specified by HSI color model. Particle was characterized by a set of statistical features derived from the distribution of HSI color model components. The initial feature set was optimized by a principal component analysis, and multidimensional scaling procedure was used for the definition of classification plane. It was found that five features, which include mean values of H and S, median S, skewness of distribution of S and I, allow to distinguish copper based alloys, red and dark iron oxides and steel particles. In this work, a method of probabilistic decision-making of class label assignment was proposed, which was based on the analysis of debris-coordinates distribution in the classification plane. The obtained results demonstrated a good availability for the automated wear particle analysis.

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A Study on Natural Convection Flows Using Particle Image Analysis (입자영상해석에 의한 자연대류 유동에 관한 연구)

  • Bae, D.S.;Kim, N.S.;Cho, W.H.
    • Journal of Power System Engineering
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    • v.4 no.2
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    • pp.11-16
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    • 2000
  • Simultaneous quantitative measurements are made of the velocity fields for two-dimensional natural convection in a rectangular enclosure using PIV(Particle Image Velocimetry). The experiments are performed at a Prandtl number of 6.62, an aspect ratio of 1.0, Rayleigh numbers from $1.294{\times}10^6\;to\;3.8841{\times}10^6$, and angles of inclination of $0^{\circ},\;30^{\circ}\;and\;60^{\circ}$ inside a $30mm{\times}30mm{\times}8mm$ cavity made of an acrylic glass 10mm, with two isothermal copper walls kept at a prescribed temperature. The experimental results agreed very well with the numerical results. It was found that the flow consisted of a large double convection cell at angle of inclination of $60^{\circ}$.

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Effect of Chemical Mechanical Cleaning(CMC) on Particle Removal in Post-Cu CMP Cleaning (구리 CMP 후 연마입자 제거에 화학 기계적 세정의 효과)

  • Kim, Young-Min;Cho, Han-Chul;Jeong, Hae-Do
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.33 no.10
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    • pp.1023-1028
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    • 2009
  • Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-step CMP consists of Cu and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the chemical mechanical cleaning(CMC) is performed various conditions as a cleaning process. The CMC process combined mechanical cleaning by friction between a wafer and a pad and chemical cleaning by CMC solution consists of tetramethyl ammonium hydroxide (TMAH) / benzotriazole (BTA). This paper studies the removal of abrasive on the Cu wafer and the cleaning efficiency of CMC process.

Variation of Carbonization Pattern and Crystal Structure of Polyvinyl Chloride Wire Under the Thermal Stresses (열 스트레스에 의한 비닐절연전선의 탄화 패턴 및 결정 구조의 변화)

  • Choi, Chung-Seog;Kim, Hyang-Kon
    • The Transactions of the Korean Institute of Electrical Engineers P
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    • v.57 no.3
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    • pp.332-337
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    • 2008
  • We analyzed carbonization pattern and crystal structure of polyvinyl chloride wire by thermal stress. Copper that is oxidized at normal temperature is a reddish brown. If under the thermal stress range of 500 to 700 [$^{\circ}C$], carbonization and exfoliation occurrence. Section structure of electric wire is same as arrangement of particle in metallograph analysis. But, as thermal stress increases, size of particle is enlarged. Electric wire displays elongation structure in SEM image analysis and elongation structure collapses when receive thermal stress at 300 [$^{\circ}C$]. In EDX analysis, we get the spectra of CuL, CuK, OK, and ClK. FT-IR analysis was shown new spectra with in range of $1,440{\sim}1,430\;[cm^{-1}]$, 1,340 [$cm^{-1}$], 1,240 [$cm^{-1}$].

Nanoparticle patterning using nanoparticle focusing mask (나노입자 집속 마스크를 이용한 나노입자 패턴 형성)

  • You, Suk-Beom;Lee, Hee-Chul;Kim, Hyoung-Chul;Choi, Man-Soo
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.1713-1717
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    • 2008
  • We have developed a nanoparticle focusing mask which can generate particle arrays directly on the large area with high resolution. Using this mask, nanomaterials are precisely deposited onto desired positions on a substrate surface. We obtained various sizes of arrays ranging from 80 nm to 6 ${\mu}m$ with silver and copper nanoparticles that are generated by a spark discharge and an evaporation-condensation method. The feather size is much smaller than that of mask openings due to the focusing effects, like electrostatic lens, caused by charge or electric potential on insulator mask surface, which also prevent a mask clogging. The particle array size depends on the size of mask open patterns and focusing effects near the mask relate to ion flow rate and electric potential. We have demonstrated that diverse size of arrays with high resolution could be obtained repeatedly using the same sized mask in atmosphere.

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