• 제목/요약/키워드: copper particle

검색결과 238건 처리시간 0.025초

동폐수용액으로부터 수소환원법에 의한 동의 회수 (Recovery of Copper from Waste Water by $H_2$Reduction)

  • 서영식;이종현;원창완
    • 자원리싸이클링
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    • 제3권3호
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    • pp.7-11
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    • 1994
  • $\alpha$-Etchent 부식액과 순수동액을 수소환원시킴으로 아래와 같은 결과를 얻었다. (1) 수소압 및 교반속도가 증가함에 따라 각각 300psi, 500rpm까지는 동의 회수율은 증가하다가 그 이상에서는 오히려 감소하였으나, 반응온도에는 거의 영향을 받지 않았다. 이때 동의 회수율은 순수동용액 및 $\alpha$-Etchent 용액에서 최대 각각 약 90% 및 60%이었다. 또한 모든 실험에 있어 순수동용액이 $\alpha$-Etchent 부식액에서 보다 약 30~40% 동의 회수율이 증가하였다. (2) 반응시간이 증가하면 약 30분까지는 동의 회수율이 증가하지만 그 이상에서는 거의 변화가 없었다. 이때 반응초기에는(30분까지) 침상형의 동분말이었지만 그 이상에서는 포도송이 모양의 noudle 형태로 성장되었고, 분말의 크기는 약 $2~3\mu\textrm{m}$이었다.

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밤나무 재활용에 의한 구리 이온의 생물흡착 (Biosorption of Copper Ions by Recycling of Castanea crenata)

  • 최석순
    • 공업화학
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    • 제25권3호
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    • pp.307-311
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    • 2014
  • 본 연구에서는 4종류의 목재 폐기물(밤나무, 소나무, 낙엽송, 아카시아) 중에서 구리 이온 제거 능력이 뛰어난 생물흡착제로서 밤나무를 도출하였으며, 또한, 이 밤나무를 이용하여 수중에 함유된 5, 10, 20, 40 mg/L 구리 이온의 제거 효율에 대하여 고찰하였다. 5 mg/L 구리 이온 제거를 위하여, $43{\sim}63{\mu}m$ 입자 크기의 밤나무 사용이 가장 효과적임을 알 수 있었다. 밤나무 주입 농도를 증가하였을 때, 구리 제거효율이 향상되었다. 또한, 0.8 g/100 mL 밤나무가 30 min 동안 사용되었을 때, 20, 40 mg/L 구리 이온 제거효율은 각각 99, 85% 제거효율을 나타내었다. 그리고 50 mg/L 구리 이온의 제거 능력을 향상시키기 위하여, 밤나무에 1 M 아세트산나트뮴의 화학적 처리가 필요함을 알 수 있었다. 한편, 개질된 밤나무를 재활용하기 위하여 최적의 탈착제로서 93% 구리 탈착 효율을 나타낸 1 M 염산을 선정하였다. 따라서 이러한 실험 결과들은 경제적이고 실용적인 공학 자료로서 구리 제거 공정 개발에 활용될 수 있을 것이다.

용접공에서 발생한 구리흄에 의한 금속열 1례 (A Case of Metal Fume Fever Associated with Copper Fume in a Welder)

  • 임현술;정해관
    • Journal of Preventive Medicine and Public Health
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    • 제31권3호
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    • pp.414-423
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    • 1998
  • Metal fume fever has been known as an occupational disease is induced by intense inhalation of fresh metal fume with a particle size smaller than $0.5{\mu}m\;to\;1{\mu}m$. The fumes originate from heating metals beyond their boiling point, as happens, for example, in welding operations. Oxidation usually accompanies this process. In most cases, this syndrome is due to exposure to zinc oxide fumes; however, other metals like copper, magnesium, cadmium, manganese, and antimony are also reported to produce such reactions. Authors report a case of metal fume fever suspected to be associated with copper fume inhalation. The patient was a 42-year-old male and was a smoker. He conducted inert gas tungsten arc welding on copper-coated materials without safety precautions such as a protective mask and adequate ventilation. Immediately after work, he felt metallic taste in his mouth. A few hours after welding, he developed headache, chilling sensation, and chest discomfort. He also complained of myalgia, arthralgia, feverish sensation, thirst, and general weakness. Symptoms worsened after repeated copper welding on the next day and subsided gradually following two weeks. Laboratory examination showed a transient increase of neutrophil count, eosinophilia, elevated erythrocyte sedimentation rate, and positive C-reactive proteinemia. Blood and urine copper level was also increased compared to his wife. Before this episode, he experienced above complaints several times after welding with copper materials but welding of other metals did not produce any symptoms. It was suggested that copper fume would have induced metal fume fever in this case. Further investigations are needed to clarify their pathogenic mechanisms.

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복합적 열분해법을 이용한 구리 나노분말의 합성 및 무전해 은도금에 관한 연구 (Synthesis of Copper Nanoparticle by Multiple Thermal Decomposition and Electroless Ag Plating)

  • 박정수;김상호;한정섭
    • 한국수소및신에너지학회논문집
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    • 제28권1호
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    • pp.70-76
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    • 2017
  • To synthesize copper nanoparticle a thermal decomposition was adopted. And to solve the problem of surface oxidation of the synthesized copper powder an electroless Ag plating method was used. The size and shape of synthesized Cu nanoparticle were affected by the size of copper oxalate used as a precursor, reaction solvent, reaction temperature and amount of reducing agent. Especially reaction solvent is dominant factor to control shape of Cu nano-particle which can have the shapes of sphere, polygon and rod. In case of glycerol, it produced spherical shape of about 500 nm in size. Poly ethylene produced uniform polygonal shape in about 700 nm and ethylene glycol produced both of polygon and rod having size range between 500 and 1500 nm. The silver coated copper powder showed a high electrical conductivity.

W-Cu 합금의 액상소결을 위한 새로운 공정의 개발:유동층 환원법 (A New Process for Liquid Phase Sintering of W-Cu Composite; Fluidized Beds Reductio Method)

  • 인태형;이석운;주승기
    • 한국재료학회지
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    • 제4권4호
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    • pp.393-400
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    • 1994
  • 1$\mu \textrm{m}$이하의 텅스텐 분말에 구리를 균일하게 코팅하는 공정을 새로이 개발했다. 구리가 코팅된 $\mu \textrm{m}$이하의 텅스텐 분말을 이용하여 액상소결하였으며, 구리가 균일하게 분포된 W-Cu합금을 얻을 수있었다. 본 연구에서 개발된 방법에 의해 구리의 함유량을 10wt.%이하로 낮추면서도 균일한 W-Cu합금을 얻을 수 있었으며, 특히 코발트를 같은 방식에 의해 첨가하면 구리액상이 형성된 후 급격히 치밀화하여 96% 이상의 상대밀도를 갖는 W-Cu 합금을 제작하는데 성공하였다. 코발트 첨가에 의한 급격한 치밀화의 증가는 텅스텐과 구리액상 사이의 접착성 향상에 기인하는 것으로 밝혀졌다.

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솔보써말 방법을 이용한 구리분말 제조 및 전자파 차폐제로의 응용 (The Preparation of Copper Powder Using Solvothermal Process and Its Application as EMI Shielding Agent)

  • 이효원;김수룡;권우택;최덕균;김영희
    • 한국재료학회지
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    • 제16권5호
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    • pp.285-291
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    • 2006
  • Copper powders have been widely used in electrically conductive coatings, electrode materials et al. and are very prospective since they are cheaper than noble metal powders such as silver or palladium. In this study, copper powders for metal filler of EMI shielding have been prepared using a solvothermal process from $CuSO_4$, NaOH, Glucose, mixed solvent ($H_2O$: Ethanol) and hydrazine which was used as a reducing agent at various reaction conditions. The prepared copper powders showed finely dispersed spherical shape without agglomerate, uniform morphology, narrow size distribution, high purity and were about 400-700 nm in size. The prepared powders were characterized using XRD, SEM, TGA, XPS, particle size measurement and EMI shielding efficiency.

흑연-금속동 복합분말제조에 관한 연구 (A Stydy on the Preparation of Cu-Graphite Composite Powders)

  • 오종기;김택훈;이화영
    • 한국재료학회지
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    • 제3권2호
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    • pp.103-110
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    • 1993
  • 금속동-흑연복합분말을 제조하기 위하여 염화동을 흑연주위에서 수소환원시킴으로써 흑연표면에 금속동을 석출시키는 새로운 방법으로 흑연-금속동 복합재료를 제조하고자 하였으며, 이를 위해 325 mesh이하의 KISH및 천연흑연을 모재로 하여 350-50$0^{\circ}C$의 환원온도에서 염화동을 환원시키는 실험을 실시하였다. 금속동의 분산도는 환원온도가 낮을수록 양호한 것으로 나타났으며, 금속동의 분산도를 높이기 위해서는 가능한한 환원온도를 낮게하는 것이 유리한 것으로 나타났다.

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Copper 막의 전기화학적 특성에 관한 연구 (A Study of Electrochemical Characteristics on Copper Film)

  • 한상준;박성우;이우선;서용진
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2006년도 제37회 하계학술대회 논문집 A
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    • pp.603-604
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    • 2006
  • We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. According to the CMP removal rates and particle size distribution, and the micro- structures of surface layer as a function of oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_{2}O_3$ abrasive particles in CMP slurry.

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구리 분말을 이용한 $SO_2$ 배기가스의 처리(I) (The Treatment of Flue SO$_2$ Gas by Cu Powder (I))

  • 정국삼;김학성;신창섭
    • 한국안전학회지
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    • 제1권1호
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    • pp.27-32
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    • 1986
  • To remove sulfur dioxide from flue gas by the method of metal oxide, copper powder of average diameter $2.4\mu\textrm{m}$and $51\mu\textrm{m}$ were used in a fixed bed reactor over a, temperature range of $300^{\circ}C-500^{\circ}C$. Copper oxide reacts with sulfur dioxide producing cupric sulfate and it can be regenerated from the latter by using hydrogen or methane. Experimental results showed that the reaction rate was increased by the increase of reaction temperature in the range of $300^{\circ}C-422^{\circ}C$ and the removal efficiency of sulfur dioxide was high in case of small size copper particle. However the removal efficiency was decreased at higher temperature due to decomposition of cupric sulfate. The rate controlling step of this reaction was chemical reaction and deactivating catalysts model can be applied to this reaction. The rate constants for this reaction and deactivation are as follows : k=8,367exp(-10,298/RT) Kd=2.23exp(-8,485/RT)

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Copper 막의 전기화학적 특성에 관한 연구 (A Study of Electrochemical Characteristics on Copper Film)

  • 한상준;박성우;이우선;서용진
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2006년도 제37회 하계학술대회 논문집 B
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    • pp.1269-1270
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    • 2006
  • We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. According to the CMP removal rates and particle size distribution, and the micro-structures of surface layer as a function of oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_2O_3$ abrasive particles in CMP slurry.

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