• Molecules and Cells
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• 제37권2호
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• pp.100-108
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• 2014

Salmonella enterica serovar Typhimurium (S. Typhimurium) is an intracellular pathogen that has evolved to survive in the phagosome of macrophages. The periplasmic copper-binding protein CueP was initially known to confer copper resistance to S. Typhimurium. Crystal structure and biochemical studies on CueP revealed a putative copper binding site surrounded by the conserved cysteine and histidine residues. A recent study reported that CueP supplies copper ions to periplasmic Cu,Zn-superoxide dismutase (SodCII) at a low copper concentration and thus enables the sustained SodCII activity in the periplasm. In this study, we investigated the role of CueP in copper resistance at a high copper concentration. We observed that the survival of a cueP-deleted strain of Salmonella in macrophage phagosome was significantly reduced. Subsequent biochemical experiments revealed that CueP specifically mediates the reduction of copper ion using electrons released during the formation of the disulfide bond. We observed that the copper ion-mediated Fenton reaction in the presence of hydrogen peroxide was blocked by CueP. This study provides insight into how CueP confers copper resistance to S. Typhimurium in copper-rich environments such as the phagosome of macrophages.

• Advances in Traditional Medicine
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• 제4권3호
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• pp.211-214
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• 2004

The inhibitory effect of dl-puerol A as but-2-enolide isolated from Sophora japonica was investigated on copper ion-induced protein oxidative modification in vitro. It inhibited copper-induced protein oxidative modification. However, its inhibitory effect was a little weaker than that of $dl-{\alpha}-tocopherol$ as an antioxidant. The results demonstrated that dl-puerol A, one of but-2-enolides, might be of use in the oxidative stress.

• 한국표면공학회지
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• 제46권4호
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• pp.158-161
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• 2013

Recently, the weight reduction and miniaturization of the electronics have placed great emphasis. The miniaturization of PCB (Printed Circuit Board) as main component among the electronic components has also become progressed. The use of acid copper plating process for Via-Filling effectively forms interlayer connection in build-up PCBs with high-density interconnections. However, in the case of copper-via filled in a bath, which is greatly dependent on the effects of additives. This paper discusses effects of Cl ion on the filling of PCB vias with electrodeposited copper based on both electrochemical experiment and practical observation of cross sections of vias.

• Bulletin of the Korean Chemical Society
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• 제14권5호
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• pp.594-598
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• 1993

The protonation constants of the 14-membered tetraaza macrocycles A(3,14-dimethyl-2,6,13,17-tetraazatricyclo$[l6.4.0^{1,18}.0^{7,12}]$docosane) and B(2,3,6,13,14,17-hexamethyl-2,6,13,17-tetraazatric yclo-[l6.4.$0^{1,18}.0^{7,12}$]docosane) were measured by potentiometry. The formation constants of each of these ligands with copper(II) and nickel(II) were determined by an out-of-cell spectrophotometric method. The results indicate that the per-N-methylated macrocycle B exhibits much higher selectivity for complex formation with copper(II) over nickel(II) ion than A and other related 14-membered tetraaza macrocycles. The effects of the N-and C-substituents on the basicity and the metal ion selectivity of the ligands are discussed. The synthesis and properties of copper(II) and nickel(II) complexes of B are also described.

• Journal of Plant Biology
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• 제30권3호
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• pp.181-187
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• 1987

Copper inhibited PSII-mediated O2 evolution (H2OlongrightarrowDCIP, H2OlongrightarrowSiMo) but not PSImediated O2 uptake(DCIP. Asc.longrightarrowMV) in isolated Chinese cabbage chloroplasts. Copper toxicity on PSII-mediated O2 evolution was higher at alkaline condition than at acidic condition and was inhanced by light illumination after copper treatment. The increased toxicity by light illumination was not recovered by subsequent dark treatment. The inhibitory effect of copper on H2OlongrightarrowDCIP reaction was higher than that on H2OlongrightarrowSiMo reaction. This result suggests that there may be another inhibitory site of copper on PSII other than water oxidizing side of PSII.

• 공업화학
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• 제9권4호
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• pp.574-578
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• 1998

전기화학적 이온교환전극을 양이온 교환수지 Amberlite IRP-64와 결합제로서 Stylen-Buthylene-Rubber (SBR)를 혼합하여 압축성형 방법으로 제작하여, 전극전위와 전해질의 pH에 따른 구리이온의 흡착과 용출특성을 고찰하였다. 흡착공정에서는 -1800 mV에서 최대 흡착속도를 나타내었으며 90분 경과 후,92%의 흡착율을 나타내었다. 용출공정의 경우, 본 실험영역에서는 전위의 증가에 비례하여 용출율은 증가되어 나타났으며, 3600 mV에서 50분 이후 88%의 용출율을 나타내었다. 전기화학적 이온교환 전극 근처의 국부적인 pH 변화는 흡착과 용출공정에 크게 영향을 미치는 것으로 사료되며, 전해질의 pH가 각각 염기성과 산성에서 높은 흡착율과 용출율을 나타내었다.

• 접착 및 계면
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• 제8권1호
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• pp.15-27
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• 2007

폴리이미드 필름과 구리의 접착력을 향상시키기 위하여 이온빔과 실란-이미다졸 커플링제를 사용하여 폴리이미드 표면개질을 실시하였다. 실란-이미다졸 커플링제는 구리와의 배위결합을 형성하는 이미다졸 그룹과 실록산 폴리머를 형성하는 메톡시 실란 그룹을 함유한다. 폴리이미드 필름표면은 아르곤/산소 이온빔으로 일차로 처리하여 친수성을 높인 폴리이미드 필름에 커플링제 수용액에 침지하여 폴리이미드 필름 표면에 커플링제를 그라프트시켜 표면개질을 실시하였다. XPS 스펙트럼 분석결과 아르곤/산소 플라즈마 처리는 폴리이미드 표면에 하이드록시 및 카르보닐 그룹과 같은 산소 기능성기를 형성함을 알 수 있었고 폴리이미드 필름 표면에 실란-이미다졸과의 커플링반응에 의하여 표면이 개질되었음을 확인하였다. 이온빔을 사용하여 그라프트된 폴리이미드 필름과 구리와의 접착력은 처리되지 않은 폴리이미드 필름과의 접착력 보다 높은 접착력을 나타내었다. 또한 커플링제로 그라프트된 폴리이미드 필름의 접착력 보다 아르곤/산소의 양자화 이온을 이용하여 개질한 그라프트된 폴리이미드 필름의 시편이 더 높은 접착력을 나타내었다. 구리-폴리이미드 필름의 계면으로부터 박리된 층은 분석결과 완전히 서로 다른 화학적 조성을 나타내었는데 이것으로부터 박리가 접합면의 커플링제 내에서 일어나는 것보다는 폴리이미드와 커플링제의 사이에서 일어남을 확인하였다.

• Journal of Electrochemical Science and Technology
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• 제2권4호
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• pp.204-210
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• 2011

Thin film electrodes have been intensively studied for active materials and current collectors to enhance the electrochemical performance. Here, porous structures of nickel-based oxide films, consisting of nickel oxide and copper (II) oxide, which was derived from the copper substrate during the annealing process, were deposited on metallic copper foils. The half-cell tests revealed excellent capacity retention after $80^{th}$ charge/discharge cycles. Some films showed an excess of the theoretical capacity of nickel oxides, which mainly originate from partially oxidized copper substrates during annealing. These results exhibit that both a preparation method of an active materials and partially oxidized current collectors could be important roles to apply thin film electrodes.

• 대한화학회지
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• 제63권3호
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• pp.209-212
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• 2019

• Bulletin of the Korean Chemical Society
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• 제26권6호
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• pp.882-886
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• 2005

Copper(II) ion-selective PVC membrane electrode based on 2-mercaptobenzoxazole as a new ionophore and o-nitrophenyl octyl ether (o-NPOE) as plasticizer is proposed. This electrode revealed good selectivity for $Cu^{2+}$ over a wide variety of other metal ions. Effects of experimental parameters such as membrane composition, nature and amount of plasticizer, and concentration of internal solution on the potential response of $Cu^{2+}$ sensor were investigated. The electrode exhibits good response for $Cu^{2+}$ in a wide linear range of 5.0 ${\times}$ 10−.6-1.6 ${\times}$ $10^{-2}$ mol/L with a slope of 29.2 ${\pm}$ 2.0 mV/decade. The response time of the sensor is less than 10 s, and the detection limit is 2.0 ${\times}$ $10^{-6}$ mol/L. The electrode response was stable in pH range of 4-6. The lifetime of the electrode was about 2 months. The electrode revealed comparatively good selectivities with respect to many alkali, alkaline earth, and transition metal ions.