• Molecules and Cells
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• v.37 no.2
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• pp.100-108
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• 2014

Salmonella enterica serovar Typhimurium (S. Typhimurium) is an intracellular pathogen that has evolved to survive in the phagosome of macrophages. The periplasmic copper-binding protein CueP was initially known to confer copper resistance to S. Typhimurium. Crystal structure and biochemical studies on CueP revealed a putative copper binding site surrounded by the conserved cysteine and histidine residues. A recent study reported that CueP supplies copper ions to periplasmic Cu,Zn-superoxide dismutase (SodCII) at a low copper concentration and thus enables the sustained SodCII activity in the periplasm. In this study, we investigated the role of CueP in copper resistance at a high copper concentration. We observed that the survival of a cueP-deleted strain of Salmonella in macrophage phagosome was significantly reduced. Subsequent biochemical experiments revealed that CueP specifically mediates the reduction of copper ion using electrons released during the formation of the disulfide bond. We observed that the copper ion-mediated Fenton reaction in the presence of hydrogen peroxide was blocked by CueP. This study provides insight into how CueP confers copper resistance to S. Typhimurium in copper-rich environments such as the phagosome of macrophages.

• Advances in Traditional Medicine
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• v.4 no.3
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• pp.211-214
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• 2004

The inhibitory effect of dl-puerol A as but-2-enolide isolated from Sophora japonica was investigated on copper ion-induced protein oxidative modification in vitro. It inhibited copper-induced protein oxidative modification. However, its inhibitory effect was a little weaker than that of $dl-{\alpha}-tocopherol$ as an antioxidant. The results demonstrated that dl-puerol A, one of but-2-enolides, might be of use in the oxidative stress.

• Journal of the Korean institute of surface engineering
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• v.46 no.4
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• pp.158-161
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• 2013

Recently, the weight reduction and miniaturization of the electronics have placed great emphasis. The miniaturization of PCB (Printed Circuit Board) as main component among the electronic components has also become progressed. The use of acid copper plating process for Via-Filling effectively forms interlayer connection in build-up PCBs with high-density interconnections. However, in the case of copper-via filled in a bath, which is greatly dependent on the effects of additives. This paper discusses effects of Cl ion on the filling of PCB vias with electrodeposited copper based on both electrochemical experiment and practical observation of cross sections of vias.

• Bulletin of the Korean Chemical Society
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• v.14 no.5
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• pp.594-598
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• 1993

The protonation constants of the 14-membered tetraaza macrocycles A(3,14-dimethyl-2,6,13,17-tetraazatricyclo$[l6.4.0^{1,18}.0^{7,12}]$docosane) and B(2,3,6,13,14,17-hexamethyl-2,6,13,17-tetraazatric yclo-[l6.4.$0^{1,18}.0^{7,12}$]docosane) were measured by potentiometry. The formation constants of each of these ligands with copper(II) and nickel(II) were determined by an out-of-cell spectrophotometric method. The results indicate that the per-N-methylated macrocycle B exhibits much higher selectivity for complex formation with copper(II) over nickel(II) ion than A and other related 14-membered tetraaza macrocycles. The effects of the N-and C-substituents on the basicity and the metal ion selectivity of the ligands are discussed. The synthesis and properties of copper(II) and nickel(II) complexes of B are also described.

• Journal of Plant Biology
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• v.30 no.3
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• pp.181-187
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• 1987

Copper inhibited PSII-mediated O2 evolution (H2OlongrightarrowDCIP, H2OlongrightarrowSiMo) but not PSImediated O2 uptake(DCIP. Asc.longrightarrowMV) in isolated Chinese cabbage chloroplasts. Copper toxicity on PSII-mediated O2 evolution was higher at alkaline condition than at acidic condition and was inhanced by light illumination after copper treatment. The increased toxicity by light illumination was not recovered by subsequent dark treatment. The inhibitory effect of copper on H2OlongrightarrowDCIP reaction was higher than that on H2OlongrightarrowSiMo reaction. This result suggests that there may be another inhibitory site of copper on PSII other than water oxidizing side of PSII.

• Applied Chemistry for Engineering
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• v.9 no.4
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• pp.574-578
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• 1998

Electrochemical Ion Exchang(EIX) electrode containing Amberlite IRP-64 as a cation ion exchange resin and Stylene-Buthylene-Rubber(SBR) as a binder was fabricated by the compressed diecasting method. The adsorption and elution characteristics in copper sulfate solution were investigated at the various electrode potentials and electrolyte pHs. In the adsorption process, it was found that the maximum adsorption rate of copper was obtained at -1800 mV and the ratio of adsorption was 92% during 90 min. In the elution process, the elution rate of copper was increased in proportion to anodic potential in the present experimental range and the ratio of elution was 88% during 50 mins at 3600 mV. The adsorption and elution processes were significantly affected by the variation of local pH in the vicinity of electrochemical ion exchange electrode. The higher performances of adsorption and elution were elution were obtained at basic and acidic eletrolytes.

• Journal of Adhesion and Interface
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• v.8 no.1
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• pp.15-27
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• 2007

Polyimide (PI) surface modification was carried out by ion-beam treatment and silane-imidazole coupling agent to improve the adhesion between polyimide film and copper. Silane-imidazole coupling agent contains imidazole functional groups for the formation of a complex with copper metal through a coordination bonding and methoxy silane groups for the formation of siloxane polymers. The PI film surface was first treated by argon (Ar)/oxygen ($O_2$) ion-beam, followed by dipping it into a modified silane-imidazole coupling agent solution. The results of X-ray photoelectron spectroscopy (XPS) spectra revealed that the $Ar/O_2$ plasma treatment formed oxygen functional groups such as hydroxyl and carbonyl groups on the polyimide film surface and confirmed that the PI surface was modified by a coupling reaction with imidazole-silane coupling agent. Adhesion between copper and the treated PI film by ion-beam and coupling agent was superior to that with untreated PI film. In addition, adhesion of PI film treated by an $Ar/O_2$ plasma to copper was better than that of PI film treated by a coupling agent. The peeled-off layers from the copper-PI film joint were completely different in chemical composition each other. The layer of PI film side showed similar C1s, N1s, O1s spectra to the original Upilex-S and no Si and Cu atoms appeared. On the other hand the layer of copper side showed different C1s and N1s spectra from the original PI film and many Si and Cu atoms appeared. This indicates that the failure occurs at an interface between the imidazole-silane and PI film layers rather than within the PI layers.

• Journal of Electrochemical Science and Technology
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• v.2 no.4
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• pp.204-210
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• 2011

Thin film electrodes have been intensively studied for active materials and current collectors to enhance the electrochemical performance. Here, porous structures of nickel-based oxide films, consisting of nickel oxide and copper (II) oxide, which was derived from the copper substrate during the annealing process, were deposited on metallic copper foils. The half-cell tests revealed excellent capacity retention after $80^{th}$ charge/discharge cycles. Some films showed an excess of the theoretical capacity of nickel oxides, which mainly originate from partially oxidized copper substrates during annealing. These results exhibit that both a preparation method of an active materials and partially oxidized current collectors could be important roles to apply thin film electrodes.

• Journal of the Korean Chemical Society
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• v.63 no.3
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• pp.209-212
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• 2019

• Bulletin of the Korean Chemical Society
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• v.26 no.6
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• pp.882-886
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• 2005

Copper(II) ion-selective PVC membrane electrode based on 2-mercaptobenzoxazole as a new ionophore and o-nitrophenyl octyl ether (o-NPOE) as plasticizer is proposed. This electrode revealed good selectivity for $Cu^{2+}$ over a wide variety of other metal ions. Effects of experimental parameters such as membrane composition, nature and amount of plasticizer, and concentration of internal solution on the potential response of $Cu^{2+}$ sensor were investigated. The electrode exhibits good response for $Cu^{2+}$ in a wide linear range of 5.0 ${\times}$ 10−.6-1.6 ${\times}$ $10^{-2}$ mol/L with a slope of 29.2 ${\pm}$ 2.0 mV/decade. The response time of the sensor is less than 10 s, and the detection limit is 2.0 ${\times}$ $10^{-6}$ mol/L. The electrode response was stable in pH range of 4-6. The lifetime of the electrode was about 2 months. The electrode revealed comparatively good selectivities with respect to many alkali, alkaline earth, and transition metal ions.