• Advances in Energy Research
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• 제3권1호
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• pp.59-70
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• 2015

In India, continuous production of electricity and sweet/potable water from Solar power and desalination plant plays a major role in the industries. Particularly in Copper industry, Solar power adopts Solar field collector combined with thermal storage system and steam Boiler, Turbine & Generator (BTG) for electricity production and desalination plant adopts Reverse osmosis (RO) for sweet/potable water production which cannot be used for long hours of power generation and consistency of energy supply for industrial processes and power generation cannot be ensured. This paper presents an overview of enhanced technology for Solar power and Desalination plant for Copper industry making it continuous production of electricity and sweet/potable water. The conventional technology can be replaced with this proposed technique in the existing and upcoming industries.

• 동력기계공학회지
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• 제17권5호
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• pp.78-85
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• 2013

A high thermal conductivity material, namely graphene is treated by planetary ball milling machine to transport the heat by increasing the temperature. Experiments were performed to assess the heat transfer enhancement benefits of coating the bottom wall of copper substrate with graphene. It is well known that the graphene is unable to disperse into base fluid without any treatment, which is due to the several reasons such as attachment of hydrophobic surface, agglomeration and impurity. To further improve the dispersibility and thermal characteristics, planetary ball milling approach is used to grind the raw samples at optimized condition. The results are examined by transmission electron microscopy, x-ray diffraction, Raman spectrometer, UV-spectrometer, thermal conductivity and thermal imager. Thermal conductivity measurements of structures are taken to support the explanation of heat transfer properties of different samples. As a result, it is found that the planetary ball milling approach is effective for improvement of both the dispersion and heat carriers of carbon based material. Indeed, the heat transfer of the ground graphene coated substrate was higher than that of the copper substrate with raw graphene.

• 공업화학
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• 제2권3호
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• pp.193-198
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• 1991

후막 구리도체는 귀금속계 도체에 비하여 가격이 저렴하고 전기전도도, 납땜성, 땜납 침식저항, 와이어 본딩성등의 양호한 성질 때문에 매우 중요성을 갖는다. 그러나 우수한 후막 구리도체를 형성하는 것은 구리가 높은 온도에서 쉽게 산화하는 성질로 인해 상당히 복잡하다. 양호한 구리후막을 얻기 위하여 하이브리드 마이크로회로업계는 질소분위기, 반응성분위기 또는 공기분위기를 사용한다. 이 글에서는 후막 구리도체의 소성공정과 세종류의 소성분위기에 대하여 종합적으로 고찰하였다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2018년도 춘계학술대회 논문집
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• 펄프종이기술
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• 제40권5호
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• pp.42-46
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• 2008

The papers in preserved books and archives experience aging which was affected by a variety of factors. Thus, the studies concerning impacts of those factors on paper aging are required. In this research, a simulation of a short-time accelerated paper aging was conducted in order to examine the effects of acid and metals (alum, copper (II) sulfate, copper (II) chloride, and iron (III) chloride) on the natural paper aging for a long time. As a result of experiments, it is found that both acid and metals have impacts on paper aging. Alum resulted in the significant decrease of pH, brightness, folding endurance, and viscosity of paper. Both copper (II) chloride and iron (III) chloride also resulted in the decrease of brightness, folding endurance, and viscosity of paper. In more detail, paper aging by iron (III) chloride showed much more significant than that by copper (II) chloride. The paper aging in case of copper (II) sulfate coexisting sulfate ion, where metal absorbed moisture was higher than in case of paper treated only by alum. This result indicated that metal catalyzes paper aging by acid. Based on these results, it was revealed that both alum and metal are the major factors in paper aging. In particular, paper aging was far more accelerated in case when acid and metals existed in paper at the same time.

• 자원리싸이클링
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• 제28권1호
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• pp.62-72
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• 2019

일반적으로, 황산동을 제조하기 위한 원료는 $H_2SO_4$ 및 Cu 금속이 사용된다. 본 연구는 폐산, 폐염화동 폐기물부터 전해 채취법을 이용하여 황산동을 제조하는 방법에 관한 것이다. 황산구리의 용도는 공업용, 도금용, 사료용, 농업용, 전자급 PCB 동도금에 사용된다. 종래의 황산동 제조법은 다량의 폐수 및 에너지 비용이 높은 문제점이 있다. 구리(Cu) 화합물 중에서 가장 사용이 많이 되는 황산동($CuSO_4$)의 제조 방법에 관한 연구로서, 공정 운전비가 적고, 폐수 발생이 적으며, 제조 공정이 간단하다. 양이온 맴브레인을 이용하여 Na, Ca, Mg, Al을 불순물로서 제거하기 쉽다. 또한 동시에 전해 채취 방법으로 고 순도 구리 분말을 회수 할 수 있었다. 회수 된 구리 분말을 사용하여 고 순도 황산동을 제조 할 수 있었다.

• Current Photovoltaic Research
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• 제3권2호
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• pp.61-64
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• 2015

In solar industry, numerous researchers reported about cold spray method among various electrode formation technic, but there are no known a bonding mechanism of metal powder. In this study, a cross-section of copper electrode formed by cold spray method was observed and heterogeneous phase between silicon substrate and copper electrode was analyzed using morphology observation technic. SEM and TEM analysis were performed to analyze a crystallinity and distribution shape of heterogeneous copper phase. Molecular dynamics simulation was performed to calculate glass transition temperature of copper metal. In the result, amorphous copper phase was observed near interface between silicon substrate and metal electrode. The results of the molecular dynamics simulation show that an amorphous copper phase could be formed at a temperature below the melting point of copper because cold spraying resulted in a lower glass transition temperature.

• 전기학회논문지
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• 제56권8호
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• pp.1436-1440
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• 2007

Beryllium copper has been known to be an important material for the various fields of industry because it can be used for mechanical and electrical/electronic components that are subjected to elevated temperatures (up to $400^{\circ}C$ for short times). Blade type tip for probing the cells of liquid crystal display(LCD) was fabricated using beryllium copper foil. The dry film resist was employed as a mask for patterning of the blade type tip. The beryllium copper foil was etched using hydrochloric acidic iron-chloride solution. The concentration, temperature, and composition ratio of hydrochloric acidic iron-chloride solution affect the etching characteristics of beryllium copper foil. Nickel with the thickness of $3{\mu}m$ was electroplated on the patterned copper beryllium foil for enhancing its hardness, followed by electroplating gold for increasing its electrical conductivity. Finally, the dry film resist on the bridge was removed and half of the nickel was etched to complete the blade type tip.

• 한국응용과학기술학회지
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• 제30권3호
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• pp.472-479
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• 2013

The conductive polymer composites recently became increasingly to many fields of industry due to their electrical properties. To understand these properties of composites, electrical properties were measured and were studied relatively. Electrical conductivity measurements showed percolation phenomena. Percolation theories are frequently applied to describe the insulator-to-conductor transitions in composites made of a conductive filler and an insulating matrix. It has been showed both experimentally and theoretically that the percolation threshold strongly depends on the aspect ratio of filler particles. The critical concentration of percolation formed is defined as the percolation threshold. This paper was to study epoxy resin filled with copper. The experiment was made with vehicle such as epoxy resin replenished with copper powder and the study about their practical use was performed in order to apply to electric and electronic industry as well as general field. The volume specific resistance of epoxy resin composites was 3.065~13.325 in using copper powder. The weight loss of conductive composites happened from $350^{\circ}C{\sim}470^{\circ}C$.

• 환경생물
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• 제42권1호
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• pp.1-14
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• 2024

This study evaluated the risk of single and combined exposure to microplastics in zebrafish (Danio rerio) through biomarkers, such as survival rate, excretion rate, and histological alterations of organ systems. The experimental groups were the control(Cont.), single microplastics exposure group(MPs, 1.83%/fish total weight(g)), the copper group(Cu, 21.6 ㎍ L^-1), and a group with combined exposure to MPs and copper (MPs^*Cu). The experiment was conducted with individual exposure (7 days) for MP excretion rate analysis and group exposure (14 days) for biomarker analysis. The daily excretion rate of MPs tended to decrease in a time-dependent manner. The copper concentration in the body was not significantly different between single and combined copper exposure. The degeneration of mucous cells in the skin, capillary dilation of the gill lamella, increased intestinal mucous, hepatocyte hypertrophy, and the degeneration of glomeruli and renal tubules were observed in all exposure groups. These histological alterations showed the highest tendency in the MPs^*Cu group. In this study, the changes in biomarkers were attributed to the single effect of copper or the combined effect of copper and MPs rather than being solely influenced by MPs.