• Transactions on Electrical and Electronic Materials
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• v.10 no.3
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• pp.71-74
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• 2009

Electroplated Cu is a cost efficient metallization method in microelectronic packaging applications. Typically in 3-D chip staking technology, utilizing through silicon via (TSV), electroplated Cu metallization is inevitable for the throughput as well as reducing the cost of ownership (COO).To achieve a comparable film quality to sputtering or CVD, a pre-cleaning process as well as plating process is crucial. In this research, atmospheric plasma is employed to reduce the usage of chemicals, such as trichloroethylene (TCE) and sodium hydroxide (NaHO), by substituting the chemical assisted organic cleaning process with plasma surface treatment for Cu electroplating. By employing atmospheric plasma treatment, marginally acceptable electroplating and cleaning results are achieved without the use of hazardous chemicals. The experimental results show that the substitution of the chemical process with plasma treatment is plausible from an environmentally friendly aspect. In addition, plasma treatment on immersion Sn/Cu was also performed to find out the solderability of plasma treated Sn/Cu for practical industrial applications.

• The Korean Journal of Pesticide Science
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• v.8 no.1
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• pp.71-78
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• 2004

A promising hyperparasite, Ampelomyces quisqualis 94013(AQ94013) was selected as a biological control agent to cucumber powdery mildew caused by Sphaerotheca fusca. Effect of agrochemicals on mycelium growth and spore germination of AQ94013 and effect of spread stickers on hyperparasitical activity of AQ94013 to powdery mildew pathogen were evaluated. Finally it was confirmed that mycelial growth and spore germination of AQ94013 on potato dextrose agar amended with two fungicides for controlling powdery mildew, triadimefon and pyrazophos; five fungicides for controlling downy mildew, dimethomorph, kasugamycin+copper oxychloride, dichlofluanid+copper oxychloride and tribasic copper sulfate; three fungicides for controlling gray mold, iprodione, vinclozolin and procymidone; and six insecticides immidacloprid, teflubenzuron, bifenthrin, ethofenprox, deltamethrin and phenthoate were slightly reduced. Addition of mineral oil in the spore suspension of AQ94013 enhanced 7.9% control value to cucumber powdery mildew.

• Korean Journal of Materials Research
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• v.23 no.12
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• pp.695-701
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• 2013

To understand how reactivity between reinforcing nanoparticles and aqueous solution affects electrodeposited Cu thin films, two types of commercialized cerium oxide (ceria, $CeO_2$) nanoparticles were used with copper sulfate electrolyte to form in-situ nanocomposite films. During this process, we observed variation in colors and pH of the electrolyte depending on the manufacturer. Ceria aqueous solution and nickel sulfate ($NiSO_4$) aqueous solutions were also used for comparison. We checked several parameters which could be key factors contributing to the changes, such as the oxidation number of Cu, chemical impurities of ceria nanoparticles, and so on. Oxidation number was checked by salt formation by chemical reaction between $CuSO_4$ solution and sodium hydroxide (NaOH) solution. We observed that the color changed when $H_2SO_4$ was added to the $CuSO_4$ solution. The same effect was obtained when $H_2SO_4$ was mixed with ceria solution; the color of ceria solution changed from white to yellow. However, the color of $NiSO_4$ solution did not show any significant changes. We did observe slight changes in the pH of the solutions in this study. We did not obtain firm evidence to explain the changes observed in this study, but changes in the color of the electrolyte might be caused by interaction of Cu ion and the by-product of ceria. The mechanical properties of the films were examined by nanoindentation, and reaction between ceria and electrolyte presumably affect the mechanical properties of electrodeposited copper films. We also examined their crystal structures and optical properties by X-ray diffraction (XRD) and UV-Vis spectroscopy.

• Journal of Korean Society of Water and Wastewater
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• v.14 no.3
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• pp.231-239
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• 2000

Water treatment processes produce sludges resulting from water clarification. Sludge production amount increases each year and its treatment and disposal is growing to social problems according to water demand increase. Water treatment plant sludges can be modified to soil cover in sanitary landfill site through the lime treatment. Compression strength of $1.0kg/cm^2$ or more is recommended for soil cover material in municipal landfilling site. Compression and shear strength properties of modified sludges showed material property improvement applicable for soil cover alternatives. Solidification effect of the modified sludge was observed through the scanning electron microscope. Extraction tests for hazardous components in sludges revealed that extraction levels of cadmium, copper, and lead were below the regulated criteria. When adding 10% calcium hydroxide to water treatment plant sludges, the modified sludges can reach material properties for cover soil after 28 days solidification reaction.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.10
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• pp.1023-1028
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• 2009

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-step CMP consists of Cu and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the chemical mechanical cleaning(CMC) is performed various conditions as a cleaning process. The CMC process combined mechanical cleaning by friction between a wafer and a pad and chemical cleaning by CMC solution consists of tetramethyl ammonium hydroxide (TMAH) / benzotriazole (BTA). This paper studies the removal of abrasive on the Cu wafer and the cleaning efficiency of CMC process.

• Proceedings of the KIEE Conference
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• 1989.07a
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• pp.299-301
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• 1989

This study presents a method of preparing $YBa_2Cu_3O_{7-x}$ ceramic and chlorine doping in it for the purpose of Jc enhancement us ins sol-gel process.Tetramethylammonium-hydroxide and pottasium carbonate solution were added to the aqueous solution of Yttrium nitrate, Barium chloride and Copper nitrate for pH control as well as forming hydroxy-carbonate precipitation. Instead of Barium nitrate, Barium chloride was used for doping chloride impurities in the specimen. The resulted materal showed good high Tc-superconductivity after calcination. Tc and Jc value are 92 K and 120.8 $A/cm^2$ respectively.

• Fashion & Textile Research Journal
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• v.5 no.1
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• pp.82-88
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• 2003

This study was carried out to investigate combination dyeing of the cationized cotton with natural colorants extracted from Gardenia and Sappan wood extract using methanol. To improve dyeing properties of cotton with natural dye, cotton fabric was preheated with cationizing agent containing chlorohydrine group in aqueous solution of sodium hydroxide. On the whole the various medium colors were developed by repeat dyeing with different colorants after dyeing with one colorant in case of natural dyeing, In this study, however in order to obtain various colors on cationized cotton fabrics with natural dyes, pre-mordanting and combination dyeing were carried out. The various colors were obtained according to various metal compounds for pre-mordants and various mixing portion of Gardenia and Sappan wood. Metal compounds containing alum, copper and iron were used for pre-mordants.

• Journal of Industrial Technology
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• v.16
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• pp.169-174
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• 1996

Microstructural analyses of synthetic arsenic-containing heavy metal sludges solidified with Portland cement were performed. Heavy metal sludges containing 0.04M of cadmium, chromium, copper, lead, and arsenic were prepared by sodium hydroxide precipitation and successive vacuum filtration. The sludges mixed with cement were cured for 14 days. The solidified sample was characterized by 1) leaching test, 2) scanning electron microscopy and 3) X-ray diffractometry. Of the metals tested, only Pb concentration in the leachate exceeded the Korean regulatory limit. The level of lead in the leachate was as high as 10 times the regulatory limit. X-ray analysis suggested that the metal hydroxides might be present in complex or impure crystalline phases.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1880-1884
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• 2008

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-steop CMP consists of Cu CMP and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the buffing is performed various conditions as a cleaning process. The buffing process combined mechanical cleaning by friction between a wafer and a buffing pad and chemical cleaning by buffing solution consists of tetramethyl ammonium hydroxide (TMAH)/benzotriazole(BTA).

• The Plant Pathology Journal
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• v.16 no.3
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• pp.162-165
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• 2000

Screening of effective fungicides, determination of effective fungicide application time and investigation of the emergence of resistant isolates to fungicides were conducted to establish effective chemical control strategy of gray blight of tea (Camellia sinensis) in Korea. Systemic fungicides, such as bitertanol, were effective for controlling gray blight when the fungicides were sprayed within 3 days after cutting tea leaves for harvest. Sprayed immediately after cutting, contact fungicides such as chlorothalonil were also effective, but control efficacy rapidly decreased with lengthening of the intervals between cutting and spraying. Korean isolates of P. longiseta and P. theae were still sensitive to bitertanol or fluazinam. However, the isolates highly insensitive to copper hydroxide or thiophanate-methyl have already emerged in Korea. Therefore, careful attention should be paid to use of fungicides and spraying programs for the effective control of gray blight of tea in Korea.