• Transactions on Electrical and Electronic Materials
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• 제10권3호
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• pp.71-74
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• 2009

Electroplated Cu is a cost efficient metallization method in microelectronic packaging applications. Typically in 3-D chip staking technology, utilizing through silicon via (TSV), electroplated Cu metallization is inevitable for the throughput as well as reducing the cost of ownership (COO).To achieve a comparable film quality to sputtering or CVD, a pre-cleaning process as well as plating process is crucial. In this research, atmospheric plasma is employed to reduce the usage of chemicals, such as trichloroethylene (TCE) and sodium hydroxide (NaHO), by substituting the chemical assisted organic cleaning process with plasma surface treatment for Cu electroplating. By employing atmospheric plasma treatment, marginally acceptable electroplating and cleaning results are achieved without the use of hazardous chemicals. The experimental results show that the substitution of the chemical process with plasma treatment is plausible from an environmentally friendly aspect. In addition, plasma treatment on immersion Sn/Cu was also performed to find out the solderability of plasma treated Sn/Cu for practical industrial applications.

• 농약과학회지
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• 제8권1호
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• pp.71-78
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• 2004

흰가루병 방제를 위하여 다양한 작물에서 발생한 흰가루병균을 채집하여, 흰가루병균에 기생되어 있는 Ampelomyces quisqualis를 분리하여 오이흰가루병방제에 우수균주로 선발된 A. quisqualis 94013(AQ 94013)에 대하여 오이에 등록되어 있는 살균제와 살충제가 AQ94013의균사생장 및 포자발아율에 미치는 영향을 조사하였다. 그리고 AQ94013이 기생력을 증진시킬 수 있는 전착제를 선발하기 위하여 전착제와 혼용 시험을 수행하였다. AQ94013의 포자발아 및 균사생장정도는 공시한 34종의 살균제를 첨가한 배지에서 검정한 결과, 흰가루병 약 triadimefon, pyrazophos, 노균병약 dimethomorph, kasugamycin+copper oxychloride, dichlofluanid + copper oxychloride, copper hydroxide, tribasic copper sulfate, 이외에 잿빛곰팡이병약 iprodione, vinclozolin, procymidon 과 공시한 11종의 살충제중에서 immidacloprid, teflubenzuron, bifenthrin, ethofenprox, deltamethrin, phenthoate이 AQ94013의 포자발아와 균사생장에 영향을 적게 미쳤다. 오이흰가루병균에 대한 A. quisqualis 94013 의 기생력을 증진하는 전착제는 mineral oil로서 방제효과를 7.9%향상시켰다.

• 한국재료학회지
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• 제23권12호
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• pp.695-701
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• 2013

To understand how reactivity between reinforcing nanoparticles and aqueous solution affects electrodeposited Cu thin films, two types of commercialized cerium oxide (ceria, $CeO_2$) nanoparticles were used with copper sulfate electrolyte to form in-situ nanocomposite films. During this process, we observed variation in colors and pH of the electrolyte depending on the manufacturer. Ceria aqueous solution and nickel sulfate ($NiSO_4$) aqueous solutions were also used for comparison. We checked several parameters which could be key factors contributing to the changes, such as the oxidation number of Cu, chemical impurities of ceria nanoparticles, and so on. Oxidation number was checked by salt formation by chemical reaction between $CuSO_4$ solution and sodium hydroxide (NaOH) solution. We observed that the color changed when $H_2SO_4$ was added to the $CuSO_4$ solution. The same effect was obtained when $H_2SO_4$ was mixed with ceria solution; the color of ceria solution changed from white to yellow. However, the color of $NiSO_4$ solution did not show any significant changes. We did observe slight changes in the pH of the solutions in this study. We did not obtain firm evidence to explain the changes observed in this study, but changes in the color of the electrolyte might be caused by interaction of Cu ion and the by-product of ceria. The mechanical properties of the films were examined by nanoindentation, and reaction between ceria and electrolyte presumably affect the mechanical properties of electrodeposited copper films. We also examined their crystal structures and optical properties by X-ray diffraction (XRD) and UV-Vis spectroscopy.

• 상하수도학회지
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• 제14권3호
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• pp.231-239
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• 2000

Water treatment processes produce sludges resulting from water clarification. Sludge production amount increases each year and its treatment and disposal is growing to social problems according to water demand increase. Water treatment plant sludges can be modified to soil cover in sanitary landfill site through the lime treatment. Compression strength of $1.0kg/cm^2$ or more is recommended for soil cover material in municipal landfilling site. Compression and shear strength properties of modified sludges showed material property improvement applicable for soil cover alternatives. Solidification effect of the modified sludge was observed through the scanning electron microscope. Extraction tests for hazardous components in sludges revealed that extraction levels of cadmium, copper, and lead were below the regulated criteria. When adding 10% calcium hydroxide to water treatment plant sludges, the modified sludges can reach material properties for cover soil after 28 days solidification reaction.

• 대한기계학회논문집A
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• 제33권10호
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• pp.1023-1028
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• 2009

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-step CMP consists of Cu and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the chemical mechanical cleaning(CMC) is performed various conditions as a cleaning process. The CMC process combined mechanical cleaning by friction between a wafer and a pad and chemical cleaning by CMC solution consists of tetramethyl ammonium hydroxide (TMAH) / benzotriazole (BTA). This paper studies the removal of abrasive on the Cu wafer and the cleaning efficiency of CMC process.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1989년도 하계종합학술대회 논문집
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• pp.299-301
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• 1989

This study presents a method of preparing $YBa_2Cu_3O_{7-x}$ ceramic and chlorine doping in it for the purpose of Jc enhancement us ins sol-gel process.Tetramethylammonium-hydroxide and pottasium carbonate solution were added to the aqueous solution of Yttrium nitrate, Barium chloride and Copper nitrate for pH control as well as forming hydroxy-carbonate precipitation. Instead of Barium nitrate, Barium chloride was used for doping chloride impurities in the specimen. The resulted materal showed good high Tc-superconductivity after calcination. Tc and Jc value are 92 K and 120.8 $A/cm^2$ respectively.

• 한국의류산업학회지
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• 제5권1호
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• pp.82-88
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• 2003

This study was carried out to investigate combination dyeing of the cationized cotton with natural colorants extracted from Gardenia and Sappan wood extract using methanol. To improve dyeing properties of cotton with natural dye, cotton fabric was preheated with cationizing agent containing chlorohydrine group in aqueous solution of sodium hydroxide. On the whole the various medium colors were developed by repeat dyeing with different colorants after dyeing with one colorant in case of natural dyeing, In this study, however in order to obtain various colors on cationized cotton fabrics with natural dyes, pre-mordanting and combination dyeing were carried out. The various colors were obtained according to various metal compounds for pre-mordants and various mixing portion of Gardenia and Sappan wood. Metal compounds containing alum, copper and iron were used for pre-mordants.

• 산업기술연구
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• 제16권
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• pp.169-174
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• 1996

Microstructural analyses of synthetic arsenic-containing heavy metal sludges solidified with Portland cement were performed. Heavy metal sludges containing 0.04M of cadmium, chromium, copper, lead, and arsenic were prepared by sodium hydroxide precipitation and successive vacuum filtration. The sludges mixed with cement were cured for 14 days. The solidified sample was characterized by 1) leaching test, 2) scanning electron microscopy and 3) X-ray diffractometry. Of the metals tested, only Pb concentration in the leachate exceeded the Korean regulatory limit. The level of lead in the leachate was as high as 10 times the regulatory limit. X-ray analysis suggested that the metal hydroxides might be present in complex or impure crystalline phases.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1880-1884
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• 2008

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-steop CMP consists of Cu CMP and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the buffing is performed various conditions as a cleaning process. The buffing process combined mechanical cleaning by friction between a wafer and a buffing pad and chemical cleaning by buffing solution consists of tetramethyl ammonium hydroxide (TMAH)/benzotriazole(BTA).

• The Plant Pathology Journal
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• 제16권3호
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• pp.162-165
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• 2000

Screening of effective fungicides, determination of effective fungicide application time and investigation of the emergence of resistant isolates to fungicides were conducted to establish effective chemical control strategy of gray blight of tea (Camellia sinensis) in Korea. Systemic fungicides, such as bitertanol, were effective for controlling gray blight when the fungicides were sprayed within 3 days after cutting tea leaves for harvest. Sprayed immediately after cutting, contact fungicides such as chlorothalonil were also effective, but control efficacy rapidly decreased with lengthening of the intervals between cutting and spraying. Korean isolates of P. longiseta and P. theae were still sensitive to bitertanol or fluazinam. However, the isolates highly insensitive to copper hydroxide or thiophanate-methyl have already emerged in Korea. Therefore, careful attention should be paid to use of fungicides and spraying programs for the effective control of gray blight of tea in Korea.