• Title/Summary/Keyword: contact interface

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Measurement of thermal contact resistance at Cu-Cu interface

  • Kim, Myung Su;Choi, Yeon Suk
    • Progress in Superconductivity and Cryogenics
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    • v.15 no.2
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    • pp.48-51
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    • 2013
  • The thermal contact resistance (TCR) is one of the important components in the cryogenic systems. Especially, cryogenic measurement devices using a cryocooler can be affected by TCR because the systems have to consist of several metal components in contact with each other for heat transferring to the specimen without cryogen. Therefore, accurate measurement and understanding of TCR is necessary for the design of cryogenic measurement device using a cryocooler. The TCR occurs at the interface between metals and it can be affected by variable factors, such as roughness of metal surface, contact area and contact pressure. In this study, we designed TCR measurement system at various temperatures using a cryocooler as a heat sink and used steady state method to measure the TCR between metals. The copper is selected as a specimen in the experiment because it is widely used as a heat transfer medium in the cryogenic measurement devices. The TCR between Cu and Cu is measured for various temperatures and contact pressures. The effect of the interfacial materials on the TCR is also investigated.

Frictionless contact problem for a layer on an elastic half plane loaded by means of two dissimilar rigid punches

  • Ozsahin, Talat Sukru
    • Structural Engineering and Mechanics
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    • v.25 no.4
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    • pp.383-403
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    • 2007
  • The contact problem for an elastic layer resting on an elastic half plane is considered according to the theory of elasticity with integral transformation technique. External loads P and Q are transmitted to the layer by means of two dissimilar rigid flat punches. Widths of punches are different and the thickness of the layer is h. All surfaces are frictionless and it is assumed that the layer is subjected to uniform vertical body force due to effect of gravity. The contact along the interface between elastic layer and half plane will be continuous, if the value of load factor, ${\lambda}$, is less than a critical value, ${\lambda}_{cr}$. However, if tensile tractions are not allowed on the interface, for ${\lambda}$ > ${\lambda}_{cr}$ the layer separates from the interface along a certain finite region. First the continuous contact problem is reduced to singular integral equations and solved numerically using appropriate Gauss-Chebyshev integration formulas. Initial separation loads, ${\lambda}_{cr}$, initial separation points, $x_{cr}$, are determined. Also the required distance between the punches to avoid any separation between the punches and the layer is studied and the limit distance between punches that ends interaction of punches, is investigated. Then discontinuous contact problem is formulated in terms of singular integral equations. The numerical results for initial and end points of the separation region, displacements of the region and the contact stress distribution along the interface between elastic layer and half plane is determined for various dimensionless quantities.

Interaction and mechanical effect of materials interface of contact zone composite samples: Uniaxial compression experimental and numerical studies

  • Wang, Weiqi;Ye, Yicheng;Wang, Qihu;Luo, Binyu;Wang, Jie;Liu, Yang
    • Geomechanics and Engineering
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    • v.21 no.6
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    • pp.571-582
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    • 2020
  • Aiming at the mechanical and structural characteristics of the contact zone composite rock, the uniaxial compression tests and numerical studies were carried out. The interaction forms and formation mechanisms at the contact interfaces of different materials were analyzed to reveal the effect of interaction on the mechanical behavior of composite samples. The research demonstrated that there are three types of interactions between the two materials at the contact interface: constraint parallel to the interface, squeezing perpendicular to the interface, and shear stress on the interface. The interaction is mainly affected by the differences in Poisson's ratio and elastic modulus of the two materials, stronger interface adhesion, and larger interface inclination. The interaction weakens the strength and stiffness of the composite sample, and the magnitude of weakening is positively correlated with the degree of difference in the mechanical properties of the materials. The tensile-shear stress derived from the interaction results in the axial tensile fracture perpendicular to the interface and the interfacial shear facture. Tensile cracks in stronger material will propagation into the weaker material through the bonded interface. The larger inclination angle of the interface enhances the effect of composite tensile/shear failure on the overall sample.

The Molecular Structures of Poly(3-hexylthiophene) Films Determine the Contact Properties at the Electrode/Semiconductor Interface

  • Park, Yeong Don
    • Bulletin of the Korean Chemical Society
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    • v.35 no.8
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    • pp.2277-2280
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    • 2014
  • The contact properties between gold and poly(3-hexylthiophene) (P3HT) films having either of two distinct molecular orientations and orderings were investigated. Thermal treatment increased the molecular ordering of P3HT and remarkably reduced the contact resistance at the electrode/semiconductor interface, which enhanced the electrical performance. This phenomenon was understood in terms of a small degree of metal penetration into the P3HT film as a result of the thermal treatment, which formed a sharp interface at the contact interface between the gold electrode and the organic semiconductor.

Non-uniform virtual material modeling on contact interface of assembly structure with bolted joints

  • Cao, Jianbin;Zhang, Zhousuo;Yang, Wenzhan;Guo, Yanfei
    • Structural Engineering and Mechanics
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    • v.72 no.5
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    • pp.557-568
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    • 2019
  • Accurate modeling of contact interface in bolted joints is crucial in predicting the dynamic behavior for bolted assemblies under external load. This paper presents a contact pressure distribution based non-uniform virtual material method to describe the joint interface of assembly structure, which is connected by sparsely distributed multi-bolts. Firstly, the contact pressure distribution of bolted joints is obtained by the nonlinear static analysis in the finite element software ANSYS. The contact surface around bolt hole is divided into several sub-layers, and contact pressure in each sub-layer is thought to be evenly. Then, considering multi-asperity contact at the micro perspective, the relationship between contact pressure and interfacial virtual material parameters for each sub-layer is established by using the fractal contact theory. Finally, an experimental platform for the dynamic characteristics testing of a beam lap structure with double-bolted joint is constructed to validate the efficiency of proposed method. It is found that the theoretical results are in good agreement with experimental results by impact response in both time- and frequency-domain, and the relative errors of the first four natural frequencies are less than 1%. Furthermore, the presented model is used to examine the effect of rough contact surface on dynamic characteristics of bolted joint.

A Study on the Reduction the Thermal Contact Resistances at the Interface Between a Porous Metal Wick and Solid Heating Plate for a Circular Plate LHP (원판형 LHP 증발부의 소결 금속 윅에서의 접촉 저항에 관한 연구)

  • Jo, Jung-Rae;Choi, Jee-Hoon;Sung, Byung-Ho;Ki, Jae-Hyung;Ryoo, Seong-Ryoul;Kim, Chul-Ju
    • Proceedings of the KSME Conference
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    • 2008.11b
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    • pp.2357-2362
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    • 2008
  • LHP is different from a conventional heat pipes in design and heat and fluid flow passages. The situations of the former is much complex than the latter. In LHPs, evaporation occurs at the contact interface between the heating plate and the porous wick, so some micro channels machined at the contact interface serve to let the vapor flow out of the evaporator. This complexity of contact geometry was known to cause a high resistance to heat flow. The present work was to study the problem of heat passage across the contact surface for LHPs and determine those values contact resistance. For two cases of contact structures, the thermal contact resistances were examined experimentally, one being obtained through mechanical contact under pressure and the other through sintered bonding. Nickel powder wick and copper plate were used for specimens. The result showed that a substantial reduction of contact resistance of an order of degree could be obtainable by sintered bonding.

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A Study for the Ohmic Contact of High Resistivity p-Cd$_{80}Zn_[20}$Te Semiconductor (고 비저항 p-Cd$_{80}Zn_[20}$Te의 저항성 전극형성에 관한 연구)

  • 최명진;왕진식
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1997.04a
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    • pp.338-341
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    • 1997
  • According to reports, it is impossible to make Ohmic Contact with high resistivity p type CdTe or CdZnTe semiconductor theoretically. But it is in need of making Ohmic Contact to fabricate semiconductor radiation detector By electroless deposition method using gold chloride solution, we made Ohmic Contact of Au and p-Cd$_{80}$Zn$_{20}$Te which grown by High Presure Bridgman Method in Aurora Technologies Corporation. We investigated the interface with Rutherford Backscattering Spectrometry and Auger electron spectroscopy. And we evaluated the degree of Ohmic Contact for the Au/CdZnTe interface by the I/V characteristic curve. As a result, we concluded that it showed excellent Ohmic Contact property by tunneling mechanism through the interface.e.

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A Study on Head-Disk Interactions at Ultra-low Flying Height in Contact Start-Stop (Contact Start-Stop 방식에서의 극저부상 높이에서 Head-Disk Interface Interactions 연구)

  • 조언정
    • Tribology and Lubricants
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    • v.19 no.2
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    • pp.102-108
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    • 2003
  • The height of laser bumps has been considered as the limit of the minimum flying height in the contact start-stop (CSS) of hard disk drives. In this paper, tribological interactions at flying height under laser bumps are investigated in a spin stand for development of ultra-low flying head-disk interface. With the reduction of the spinning speed in a spin stand, the flying height is decreased under the height of laser bumps and, then, head-disk interactions are investigated using AE and stiction/friction signals. During seek tests and 20000 cycle-sweep tests, AE and stiction/friction signals are not significantly changed and there are no catastrophic failures of head-disk interface. Bearing analysis and AFM analysis show that there are signs of wear and plastic deformation on the disks. It is suggested that flying height could be as low as and, sometimes, lower than laser bump height.

Ultrasonic Evaluation of Interfacial Stiffness for Nonlinear Contact Surfaces

  • Kim, Noh-Yu;Kim, Hyun-Dong;Cho, Youn-Ho
    • Journal of the Korean Society for Nondestructive Testing
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    • v.28 no.6
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    • pp.504-511
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    • 2008
  • This paper proposes an ultrasonic measurement method for measurement of linear interfacial stiffness of contacting surface between two steel plates subjected to nominal compression pressures. Interfacial stiffness was evaluated by using shear waves reflected at contact interface of two identical solid plates. Three consecutive reflection waves from solid-solid surface are captured by pulse-echo method to evaluate the state of contact interface. A non-dimensional parameter defined as the ratio of their peak-to-peak amplitudes are formulated and used to calculate the quantitative stiffness of interface. Mathematical model for 1-D wave propagation across interfaces is developed to formulate the reflection and transmission waves across the interface and to determine the interfacial stiffness. Two identical plates are fabricated and assembled to form contacting surface and to measure interfacial stiffness at different states of contact pressure by means of bolt fastening. It is found from experiment that the amplitude of interfacial stiffness is dependent on the pressure and successfully determined by employing pulse-echo ultrasonic method without measuring through-transmission waves.