• Journal of the Computational Structural Engineering Institute of Korea
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• v.26 no.5
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• pp.351-358
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• 2013

In the electric power supplying industry, outdoor sealing end (pothead) is used and sometimes it is necessary to check the seismic qualification analysis or test which is intended to demonstrate that the equipment have adequate integrity to withstand stress of the specified seismic event and still performs their function. And since the pothead is mounted on the supporting jig, the avoidance of resonance between the pothead and jig is required. In order to design jig, three types of optimization are performed to get the minimum weight while satisfying the natural frequency constraint using ANSYS. Optimal array, position and thickness of truss members of the jig are obtained through topology, shape and sizing optimization process, respectively. And seismic analysis of the pothead on the jig for given RRS acceleration computes the displacement and stress of the pothead which shows the safety of the pothead. The obtained natural frequency, mass, and member thickness of the jig are compared with those of the reference jig which was used for seismic experimental test. The numerical results of the jig in the research is more optimized than the jig used in the experimental test.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.48 no.5
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• pp.383-390
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• 2020

Wedge locks have been widely used for spaceborne electronics for mounting or removal of a printed circuit board (PCB) during integration, test and maintenance process. However, it can basically provide a mechanical constraint on the edge of the board. Thus, securing a fatigue life of solder joint for electronic package by limiting board deflection becomes difficult as the board size increases. Previously, additional stiffeners have been applied to reduce the board deflection, but the mass and volume increases of electronics are unavoidable. To overcome the aforementioned limitation, we proposed an application of multi-layered PCB sheet with viscoelastic adhesive tapes to implement high-damping capability on the board. Thus, it is more advantageous in securing the fatigue life of package under launch environment compared with the previous approach. The basic characteristics of the PCB with the multi-layered sheet was investigated through free-vibration tests at various temperatures. The effectiveness of the proposed design was validated through launch vibration test at qualification level and fatigue life prediction of electronic package based on the test results.