• Journal of Adhesion and Interface
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• v.10 no.1
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• pp.30-34
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• 2009

The effect of pressure on the thermal conductivity in two-phase composite system was studied. Thermally conductive polypropylene (PP)/silicon carbide (SiC) composites were prepared by applying various pressures from 0 to 20 MPa. The thermal conductivity of the composite was 1.86 W/mK at 20 MPa, increased by 40% compared to the value of at 0 MPa. It was 9 times higher than that of unfilled polypropylene. It implies the pressure induces the easy path for phonon transport. Also, the experimental values were compared with Maxwell's prediction and Agari's prediction. Agari's prediction gave a better agreement compared to that of Maxwell's prediction due to the consideration of interactions between filler-filler and filler-polymer.

• Journal of Electrochemical Science and Technology
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• v.9 no.4
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• pp.301-307
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• 2018

The current study fabricated magnetic functional reduced graphene oxide (MFRGO) by relying on ${FeCl_4}^-$ magnetic anion confined to cationic 1-methyl imidazolium. Furthermore, for improving the electrochemical performance of conductive polymer, hybrid poly ortho aminophenol (POAP)/ MFRGO films have then been fabricated by POAP electropolymerization in the presence of MFRGO nanorods as active electrodes for electrochemical supercapacitors. Surface and electrochemical analyses have been used for characterization of MFRGO and POAP/ MFRGO composite films. Different electrochemical methods including galvanostatic charge discharge experiments, cyclic voltammetry and electrochemical impedance spectroscopy have been applied to study the system performance. Prepared composite film exhibited a significantly high specific capacity, high rate capability and excellent cycling stability (capacitance retention of ~91% even after 1000 cycles). These results suggest that electrosynthesized composite films are a promising electrode material for energy storage applications in high-performance pseudocapacitors.

• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.218-218
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• 2006

A number of new ideas have been implemented to control the droplet morphology and electrooptic properties of holographic polymer dispersed liquid crystal (HPDLC). Doping of conductive fullerene particles to the conventional HPDLC induced dual effects of reducing both droplet coalescence and operating voltage. Chain transfer agent gave higher gel content with lower crosslink density, less dark reactions and less grating shrinkage with much smooth LC-polymer interfaces. Addition of octanoic acid (OA) to the formulation of HPDLC gave a decrease in droplet size and monotonic increase of the off state diffraction throughout the OA content.

• Proceedings of the Korean Fiber Society Conference
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• 1998.10a
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• pp.53-56
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• 1998

Polypyrrole (PPy) is regarded as one of the most Promising intrinsically or naturally conductive polymer for practical applications due to its relatively high electrical conductivity, environmental stability and low toxicity. The typical PPy, which is insoluble and infusible, exhibits poor processability and lacks essential mechanical properties. A number of papers have concerned the efforts to overcome these drawbacks. (omitted)

• Polymer(Korea)
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• v.26 no.5
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• pp.644-652
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• 2002

This study aims at developing the conductive pastes consisting of room temperature vulcanizing (RTV) silicone and metal powder as matrix and filler, respectively. Electrical and rheological properties of metal - filled polymer composites are in general strongly affected by particle shape, side and dispersion state of the filler. In highly filled systems, particles tend to form very complex agglomerated structure which is easily changed when subjected to shear deformation. And the breakdown of agglomerated particles due to shear usually leads to the change of electrical conductivity of the composite. In this study, the effect of particle size and dispersion state of filler on the electrical conductivity of the composites are investigated to offer the selection criteria of conductive filler by measuring the rheological properties of uncured composites and the electrical conductivity of the cured composites. It was found that the type of metal filler systematically affected the rheological property, the susceptibility to shear and the degree of change of electrical conductivity of the composite. The effect of shear on the properties is more conspicuous in the composites containing large particle, indicating that both rheological and electrical properties can be improved by controlling the dispersion state at a given filler content.

• Composites Research
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• v.29 no.6
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• pp.401-407
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• 2016

IPMC is composed of thin ion conductive polymer film sandwiched between metallic electrodes plated on both surfaces. Ionic Polymer-Metal Composite (IPMC) generates voltages when bent by mechanical stimuli. IPMC has a potential for the variety of energy harvesting applications due to its soft and hydrophilic characteristics. However, the large-scale implementation is necessary to increase the output power. In this paper, the scale-up of surface area effect on voltage generation characteristics of IPMC was investigated using IPMC samples with different surface areas. Also, a circuit model simulating both the output voltage and its offset variations was designed for estimating the voltages from IPMC samples. The proposed model simulated the output voltages with offsets well corresponding to various frequencies of input bending motion. However, some samples showed that the increase of error between real and simulated voltages with time due to the nonlinear characteristic of offset variations.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.11a
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• pp.117-120
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• 2005

The relationship between strain and applied potential was derived for composite actuators consisting single-wall carbon nanotubes (SWNTs) and conductive polymers (CPs). During deriving the relationship, an electrochemical ionic approach is utilized to formulate the electromechanical actuation of the composite film actuator. The results show that the well-aligned SWNTs composite actuator can give good actuation responses and high actuating forces available. The actuation is found to be affected by both SWNTs and CPs components and the actuation of SWNTs component has two kinds of influences on that of the CPs component: reinforcement at the positive voltage and abatement at the negative voltage. CNT/EAP was fabricated successfully using the chemical polymerization method.

• Composites Research
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• v.35 no.3
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• pp.175-181
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• 2022

Due to the increasing number of wireless communication devices in mmWave frequency bands, there is a high demand for electromagnetic interference (EMI) shielding and heat dissipating materials to avoid device malfunctions. This paper proposes an EMI shielding composite film with a high heat dissipation characteristic. To achieve this, a conductive grid is integrated with a polymer-based composite layer including magnetic and heat dissipating filler materials. A high shielding effectiveness (>40 dB), low reflection shielding effectiveness (<3 dB), high thermal conductivity (>10 W/m·K), thin thickness (<500 ㎛) are simultaneously achieved with a tailored design of composite layer compositions and grid geometries in 5G communication band of 26.5 GHz.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.