• Proceedings of the KIEE Conference
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• 1997.07d
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• pp.1336-1338
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• 1997

Relations between the composites of SiC-$ZrB_2$ electro-conductive ceramic composites and their electrical resistivity, as well as their temperature, were investigated. The electrical resistivity of hot-pressed composites was measured by the Pauw method in the temperature of RT to $100^{\circ}C$. The electrical resistivity of the composites follow the electrical conduction model for a homogenous mixture of two kinds of particles with different conductivity. Also the electrical resistivity versus temperature curves indicate the formation of local chains of $ZrB_2$ particles. In the case of SiC-$ZrB_2$ composites containing above 30Vol.% $ZrB_2$ showed PTCR, whereas the electrical resistivity of SiC-15Vol.% $ZrB_2$ showed NTCR.

• Proceedings of the Korean Nuclear Society Conference
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• 2001.05a
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• pp.450-450
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• 2001

• Journal of Powder Materials
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• v.9 no.6
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• pp.409-415
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• 2002

In this review the methods for production and processing of isolated or agglomerated nanoscale metal particles embedded in organic liquids (nanosuspensions) and polymer matrix composites are elucidated. Emphasis is laid on the techniques of inert gas condensation (IGC) and high pressure sputtering for obtaining highly porous metal powders ("nanopowder") as well as on vacuum evaporation on running liquids for obtaining nanosuspensions. Functional properties and post-processing are outlined in view of applications in the fields of electrically conductive adhesives and anti-microbially active materials for medical articles and consumer goods.mer goods.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.05a
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• pp.258-262
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• 2001

The contact resistivity was correlated with IFSS and microfailure modes in conductive fiber/cement composites electro-pullout and AE. As IFSS increased, the number of AE signals increased and the contact resistivity increased latter to the infinity. In dual matrix composite (DMC) test and AE, the number of signals with high amplitude and energy in g]ass fiber composite is significantly larger than that of no-fiber composite. Many vertical and diagonal cracks were observed in glass fiber and no-fiber composite under tensile test, respectively. Electro-micromechanical technique and AE can be used efficiently for sensitive nondestructive (NDT) evaluation and to detect microfailure mechanisms in various conductive fibers reinforced brittle and nontransparent cement composites.

• The Korean Journal of Ceramics
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• v.5 no.4
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• pp.317-323
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• 1999

Si3N4-TiC composites have been known as electrically conductive ceramics. $Si_3N_4-TiC$ composites with 2 wt% $Al_2O_3$ and 4 wt% $Y_2O_3$ were hot pressed in $N_2$ environment. The mechanical properties including hardness, fracture toughness, and flexural strength and tribological properties were investigated as a function of TiC content. $Si_3N_4-40$ vol% TiC composite was hot pressed at $1,750^{\circ}C$, $1,800^{\circ}C$, and $1,850^{\circ}C$ for 1, 3 and 5 hours in $N_2$ gas. Mechanical and tribolgical properties depended on microstructures, which were controlled by hte TiC content, hot press temperature, and hot press holding time. However, mechanical properties and tribological behaviors were degraded by the chemical reaction between TiC and N. The chemically reacted products such as TiCN, SiC, and $SiO_2$ were detered by the X-ray diffraction analysis.

• Advances in aircraft and spacecraft science
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• v.4 no.6
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• pp.729-744
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• 2017

This investigation highlights rationale of electrically conductive nano adhesives for its essential application for Electromagnetic Interference (EMI) Shielding in satellites and Lightning Strike Protection in aircrafts. Carbon Nano Fibres (CNF) were functionalized by electroless process using Tollen's reagent and by Plasma Enhanced Chemical Vapour Deposition (PECVD) process by depositing silver on CNF. Different weight percentage of CNF and silver coated CNF were reinforced into the epoxy resin hardener system. Scanning Electron Microscopy (SEM) micrographs clearly show the presence of CNF in the epoxy matrix, thus giving enough evidence to show that dispersion is uniform. Transmission Electron Microscopy (TEM) studies reveal that there is uniform deposition of silver on CNF resulting in significant improvement in interfacial adhesion with epoxy matrix. There is a considerable increase in thermal stability of the conductive nano adhesive demonstrated by Differential Scanning Calorimetry (DSC) and Thermogravimetric Analysis (TGA). Four probe conductivity meters clearly shows a substantial increase in the electrical conductivity of silver coated CNF-epoxy composite compared to non-coated CNF-epoxy composite. Tensile test results clearly show that there is a significant increase in the tensile strength of silver coated CNF-composites compared to non-coated CNF-epoxy composites. Consequently, this technology is highly desirable for satellites and EMI Shielding and will open a new dimension in space research.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1512-1515
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• 1996

Dense $SiC-ZrB_2$ electro-conductive ceramic composites were obtained by hot pressing for high temperature structural application. The influences of the $ZrB_2$ additions an the mechanical and electrical properties of $SiC-ZrB_2$ composites were investigated. Samples were prepared by adding 15, 30, 45 vol.% $ZrB_2$ particles as a second phase to a SiC matrix. Sintering of monolithic SiC and $SiC-ZrB_2$ composites were achieved by hot pressing under a $10^{-4}$ torr vacuum atmosphere from 1000 to $2000^{\circ}C$ with a pressure of 30 MPa and held for 60 minutes at $2000^{\circ}C$. SiC and $SiC-ZrB_2$ samples obtained by hot pressing were fully dense with the relative densities over 99%. Flexural strength and fracture toughness of the samples were improved with the $ZrB_2$ contents. In the case of SiC sample containing 30vol.% $ZrB_2$, the flexural strength and fracture toughness showed 45% and 60% increase, respectively compared to those of monolithic SiC sample. The electrical resistivities of $SiC-ZrB_2$ composites were measured utilizing the four-point probe method and they decreased significantly with Increasing $ZrB_2$ contents. The resistivity of SiC-30vol.% $ZrB_2$ showed $6.50{\times}10^{-4}{\Omega}{\cdot}cm$.

• Journal of the Semiconductor & Display Technology
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• v.10 no.1
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• pp.107-111
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• 2011

Polypropylene(PP)/carbon fiber(CF)/multi-walled carbon nanotube(MWCNT) nanocomposites along with various CF and MWCNT contents were prepared in a Twin screw extruder. Electrical, mechanical property and morphology were investigated with a variation of CF and MWCNT contents. From the surface resistance of PP/CF/MWCNT composites, MWCNT can increase the conductivity of composites compared with PP/CF composites without MWCNT. It is suggested that MWCNT and CF can make the conductive network in the polymer matrix. Flexural modulus and Izod impact strength of the PP/CF/MWCNT composites were improved with the increase of CF contents. Morphology showed that length of CF in polymer matrix was shortened by torque during melt mixing with MWCNT. As a result of this phenomenon, the impact strength of composites was somewhat decreased.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.