• Proceedings of the KIEE Conference
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• 1997.07d
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• pp.1472-1474
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• 1997

In this study, the $Nb_3Sn$ wire was tried to fabricate by internal tin process to investigate the relationship between the processing parameters in a cold working and the microstructure. The critical current densities of $Nb_3Sn$ wires were evaluated in magnetic fields at 4.2 K. $Nb_3Sn$ compound layer was found to be formed between Nb core and Cu-Sn. The Cu part in the wire transformed to Cu-Sn by the reaction with Sn and the Sn in the Cu-Sn part reacted with Nb.

• Bulletin of the Korean Chemical Society
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• v.23 no.4
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• pp.587-592
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• 2002

Photocrosslinkable chalcone-epoxy compound comprising 1,3-bis-(4-hydroxy-phenyl)-propenone was synthe-sized for fabricating the photo-alignment layer of liquid crystals. Chalcone group was introduced into the main chain unit of the epoxy oligomer. We observed a photodimerization behavior and an optical anisotropy of this material by irradiation of a linearly polarized UV(LP-UV) light. With a trace amount of cationic photoinitiator (TRS-HFA), polymerization of epoxy groups was also conducted at the similar wavelength range used for photodimerization. Linearly polarized UV irradiation on the chalcone-epoxy films with cationic photoinitiator induced optical anisotropy of the film and the resultant film can be used for alignment layers for low molecular weight nematic liquid crystals.

• The Korean Journal of Food And Nutrition
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• v.21 no.2
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• pp.143-147
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• 2008

To develop a new anti-wrinkle agent from medicinal plants, this study investigated the optimal conditions for extracting elastase inhibitor from Rheum undulatum L. Maximal extraction occurred by using 70% methanol at $50^{\circ}C$ for 24 hr; the elastase inhibitory activity was 60.4%($IC_{50}:6.7{\times}10^3{\mu}g/m{\ell}$). Systematic solvent extraction, thin layer chromatography, silica gel column chromatography, Sephadex LH-20 column chromatography, and reverse-phase high performance liquid chromatography were used in the partial purification of the elastase inhibitor. The compound was soluble in dimethylsulfoxide, methanol, and ethanol, and had maximum absorption spectra at 231.5 nm and 275.5 nm.

• Journal of the Korean institute of surface engineering
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• v.37 no.4
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• pp.215-219
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• 2004

We fabricated protein chip plates coated with silane carboxylate. The silane compound was immobilized by hydrogen bond and/or other chemical bonds on the surface of the plate. The plates were then prepared by binding $Ni^{2+}$ to surfaces terminated with silane carboxylate groups. The carboxylic acid surface was generated by chemical oxidation of the terminal double-bond functions of the silane-deposited layer. The $Ni^{2+}$ ions on the surface reacted readily to His-tagged proteins. A significant increase in His-tagged protein adsorption was achieved on the surface terminated with silane carboxylate with longer alkyl chain, suggesting better availability of these protein chip plates for proteomic studies.

• Korean Chemical Engineering Research
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• v.55 no.2
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• pp.275-278
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• 2017

Heterogeneous semiconductor composites have been widely used to establish high-performance microelectronic or optoelectronic devices. During a deposition of silicon atoms on silicon/germanium compound surfaces, germanium (Ge) atoms are segregated from the substrate to the surface and are mixed in incoming a silicon layer. To suppress Ge segregation to obtain the interface sharpness between silicon layers and silicon/germanium composite layers, approaches have used silicon hydride gas species. The hydrogen atoms can play a role of inhibitors of silicon/germanium exchange. However, there are few kinetic models to explain the hydrogen effects. We propose using segregation probability which is affected by hydrogen atoms covering substrate surfaces. We derived the model to predict the segregation probability as well as the profile of Ge fraction through layers by using chemical reactions during silicon deposition.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.60-65
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• 2005

Nowadays HCFCs refrigerant are restricted because it cause depletion of ozone layer. However, natural gases such as ammonia as an organic compound, propane and propylene as hydrocarbon are easy and cheap to obtain as well as environmental. Accordingly, this experiment apply the $NH_3$ and R22 to study the performance characteristic from the superheat control and compare the energy efficiency of two refrigerants from the high performance. The condensing pressure of refrigeration system is increased from 15bar to 16bar and degree of superheat is increased from 0 to $10^{\circ}C$ at each condensing pressure. As the result of experiment, when comparing the each COP, we knew the $NH_3$ is suitable as the alternative refrigerant of the R22.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.4
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• pp.31-34
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• 2002

For the mold die sticking mechanism, the major explanation is that the silica as a filler in EMC (epoxy molding compound) wears die surface to be roughened, which results in increase of adhesion strength. As the sticking behavior, however, showed strong dependency on the EMC models based on the experimental results from different semiconductor manufacturers, chemisorption or acid-base interaction is apt to be also functioning as major mechanisms. In this investigation, the plasma source ion implantation (PSII) using $O_2, N_2$, and $CF_4$ modifies sample surface to form a new dense layer and improve surface hardness, and change metal surface condition from hydrophilic to hydrophobic or vice versa. Through surface energy quantification by measuring contact angle and surface ion coupling state analysis by Auger, major governing mechanism for sticking issue was figured out to be a complex of mechanical and chemical factors.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.75-75
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• 2015

산업이 발달되고 제품이 소형화 및 고품질화됨에 따라 그에 따른 제품의 품질 조절이 용이하고 자동화하기 쉬울 뿐만 아니라 공해문제 및 후가공 문제 등이 없는 이온질화 열처리 기술의 보급이 급속도로 확산되고 있다. 특히 플라즈마 이온질화는 가스조성, 처리온도, 질화시간, 가스압력 및 인가전류를 조절함으로써 질화층은 물론 화합물의 상을 용이하게 조절할 수 있다. 위와 같은 변수들을 조절함으로써 PECVD 장비에서 DC pulse power를 사용하여 플라즈마 질화법으로 질화처리하였으며 AISI4140강에서 화합물층의 유무에 따른 기계적인 특성을 비교 조사하고자 하였다.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2001.06a
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• pp.49-54
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• 2001

Monolayers such as self-assembled monolayer (SAM) have received considerable attention to reduce stiction and friction in micro-devices and microelectromechanical systems (MEMS). Various organic molecular films were investigated to obtain better understanding of their tribological behaviors and adhesion property. The organic molecular films studied in this work are: epoxysilane SAMs, octadecyltricholosilane (OST), multi-layers composed of epoxysilane SAMs, poly〔styrene-b-(ethylene-co-butylene)-b-styrene〕(SEBS) and compound of epoxy resin and poly (paraphenylene) (EP/PPP). The pull-off forces of these films were also obtained from force-distance curves measured in static mode of operation of atomic force microscope (AFM). Tribological tests were conducted with a ball-on-flat reciprocating friction tester. The OST showed the lowest pull-off force, indicating its low adhesion property. It was revealed that, the OST, EP/PPP and the multi-layer of epoxysilane SAMs, SEBS and EP/PPP exhibited good tribological properties at the lower load (0.3 N) whereas the OST showed best performance at the higher load (1.8 N).

• Journal of Welding and Joining
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• v.20 no.1
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• pp.91-96
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• 2002

Three different kinds of substrate used in this study : bare Cu, electroless Ni/Cu substrate with a Nilayer thickness of $5\mu\textrm{m}$, immersion Au/electroless Ni/Cu substrate with the Au and Ni layer of $0.15\mu\textrm{m}$ and $5\mu\textrm{m}$ thickness, respectively. The wettability and interfacial tension between various substrate and Sn-3.5Ag solder were examined as a function of soldering temperature, types of flux. The wettability of Sn-3.5Ag solder increased with soldering temperature and solid content of flux. The wettability of Sn-3.5Ag solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and decreased wettability.