• Title/Summary/Keyword: compound failure

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Fracture Behavior of Cu-based leadframe/EMC joints (구리계 리드프레임/EMC 접합체의 파괴거동)

  • Lee, Ho-Young;Yu, Jin
    • Korean Journal of Materials Research
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    • v.10 no.8
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    • pp.551-557
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    • 2000
  • Cu-based leadframe sheets were oxidized ic a hot alkaline solution to black-oxide layer on the surface and molded with epoxy molding compound(EMC), and finally machined to form sandwiched double-cantilever beam(SDCB) and sandwiched Brazil-nut(SBN)specimers to measure the adhesion strength of leadframe-EMC interface. The SDCB and the SBN specimens were designed to measure the adhesion strength in terms fracture toughness under puasi-mode I and mixed mode loadinf, respectively. After the tests, fracture surfaces were analyzed paths were observed in the SDCB-tested speciments, failure paths varied with crack speed and loading conditions.

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A Study on Bonding Strength and Interfacial Structure of Copper-Stainless Steel Brazed Joint(ll) (동-스테인리스 강 브레이징 접합부의 계면조직과 접합강도에 관한 연구(ll))

  • Lee, U-Cheon;Gang, Chun-Sik;Jeong, Jae-Pil;Lee, Bo-Yeong
    • Korean Journal of Materials Research
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    • v.3 no.6
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    • pp.668-677
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    • 1993
  • The microstructural and shear tests of STS304/, STS430/ and low-C steel/Cu joints brazed using Cu-P, Cu-P-Sn(four type) and Cu-P-Sn-Ag(three type) filler metals at 1003 and 1033K for 1.2ks in Ar atomsphere were performed. Interfacial microstructures were divided into three type ; first, reaction layer contained cracks second, dispersed layer without cracks third, dispersed layer and reaction layer contained cracks. The joints composed only of dispersed layer without cracks have the high shear strength of above 40-60 MPa and result in failure in copper base metal. Low shear strength and joint failure result from the formation of reaction layer which induced cracks. The reaction layer is a Fe-P compound. This tendency of microstructure and shear strength depends on the existence and/or nonexistence of Sn in filler metals as well as Ni (and Cr) in base metals.

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Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity

  • Yim, Myung-Jin;Kim, Hyoung-Joon;Paik, Kyung-Wook
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.1 s.34
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    • pp.9-16
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    • 2005
  • This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

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Acute Respiratory Failure due to Fatal Acute Copper Sulfate Poisoning : A Case Report (급성 호흡부전으로 사망한 황산구리 중독 1례)

  • Kim, Gun Bea
    • Journal of The Korean Society of Clinical Toxicology
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    • v.13 no.1
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    • pp.36-39
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    • 2015
  • Copper sulfate is a copper compound used widely in the chemical and agriculture industries. Most intoxication occurs in developing countries of Southeast Asia particularly India, but rarely occurs in Western countries. The early symptoms of intoxication are nausea, vomiting, diarrhea, and abdominal cramps, and the most distinguishable clue is bluish vomiting. The clinical signs of copper sulfate intoxication can vary according to the amount ingested. A 75-year old man came to our emergency room because he had taken approximately 250 ml copper sulfate per oral. His Glasgow Coma Scale (GCS) score was 14 and vital signs were blood pressure 173/111 mmHg, pulse rate 24 bpm, respiration rate 24 bpm, and body temperature $36.1^{\circ}$ .... Arterial blood gas analysis (ABGa) showed mild hypoxemia and just improved after 2 L/min oxygen supply via nasal cannula. Other laboratory tests and chest CT scan showed no clinical significance. Three hours later, the patient's mental status showed sudden deterioration (GCS 11), and ABGa showed hypercarbia. He was arrested and his spontaneous circulation returned after 8 minutes CPR. However, 22 minutes later, he was arrested again and returned after 3 minutes CPR. The family did not want additional resuscitation, so that he died 5 hours after ED visit. In my knowledge, early deaths are the consequence of shock, while late mortality is related to renal and hepatic failure. However, as this case shows, consideration of early definite airway preservation is reasonable in a case of supposed copper sulfate intoxication, because the patients can show rapid deterioration even when serious clinical manifestation are not presented initially.

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Characteristics of Anaerobic Digestion using Food waste leachate under Increased Organic Loading rate (유기물부하량 증가에 따른 음폐수 혐기성소화의 특성 분석)

  • Jae-Hoon Jeung;Woo-Jin Chung;Soon-Woong Chang;Jin-Tea Kim;Seong-Yeob Jeong;Seung-Youn Yang
    • Journal of Environmental Science International
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    • v.31 no.12
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    • pp.1127-1134
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    • 2022
  • Herein , the effect of changes in the organic loading rate in anaerobic digestion was evaluated. The experiment was carried out by a laboratory -scale semi-continuous stirred tank reactor, and feedstock was food-waste leached. The organic loading rate was increased by 0.5 kgVS/m3 in each phase from 1.0 kgVS/m3 to 4.0 kgVS/m3. At the end of the operation, to check the failure of the reactor, the organic loading rate was increased by 1.0 kgVS/m3 in each phase and reached 6.0 kgVS/m3. This shows that the biogas yield decreased as organic loading rate increased. Biogas production seemed to be unstable at 3.5-6.0 kgVS/m3. Moreover, biogas production dramatically fell to approximately 0 mL at 6.0 kgVS/m3, which was decided as the operation failure on the 16th day of the las tphase. The result of the reactor analysis shows that the cumulation of volatile fatty acid increased as the organic loading rate increased. This seems to occur due to the decreasein pH in the reactor and led to extinction of anaerobic bacteria, which were the biogas products. Although the buffer compound (alkalinity) could prevent the decline in pH, the concentration of alkalinity was found to be lacking at a high organic loading rate

Bending Impact Properties Evaluation of Sn-xAg-Cu Lead Free Solder Composition and aging treatment (시효처리한 Sn-xAg-Cu계 무연솔더 조성에 따른 굽힘충격 특성평가)

  • Jang, Im-Nam;Park, Jai-Hyun;Ahn, Yong-Sik
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.2
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    • pp.49-55
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    • 2011
  • The failure of electronic instruments is mostly caused by heat and shock. This shock causes the crack initiation at the solder joint interface of PCB component which is closely related with the formation of intermetallic compound(IMC). The Ag content in Pb-free Sn-xAg-0.5Cu solder alloy used in this study was 1.0, 1.2 and 3.0 wt.%, respectively. After soldering with PCB component, isothermal aging was performed to 1000 hrs. The growth of IMC layer was observed during isothermal aging. The drop impact property of solder joint was evaluated by impact bending test method. The solder joint made with the solder containing lower Ag content showed better impact bending property compared with that with higher Ag content. On the contrary to this result, the solder joint made with solder containing higher Ag content showed better impact bending property after aging. It should be caused by the formation of fine $Ag_3Sn$, which relieved the impact. It showed consequently the different effect of fine $Ag_3Sn$ and coarse $Cu_6Sn_5$ particles formed in the IMC layer on the impact bending property.

Scuffing and Wear of the Vane/Roller Surfaces for Rotary Compressor Depending on Several Sliding Condition

  • Lee, Y.Z.;Oh, S.D.;Kim, J.W.;Kim, C.W.;Choi, J.K.;Lee, I.J.
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2002.10b
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    • pp.227-228
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    • 2002
  • One of the serious challenges in developing rotary compressor with HFC refrigerant is the prediction of scuffing times and wear amounts between vane and roller surface. In this study, the tribological characteristics of sliding surfaces using roller-vane geometry of rotary compressor were investigated. The sliding tests were carried out under various sliding speeds, normal loads and surface roughness. During the tests, friction force, wear scar width, time to failure, surface temperature, and surface roughness were monitored. Because severe wear was occurred on vane surface, TiN coating was applied on sliding surfaces to prolong the wear-life of vane-roller interfaces. From the sliding tests, it was found that there was the optimum initial surface roughness to break in and to prolong the wear life of sliding surfaces. Depending on load and speed, the protective layers, which were composed of metallic oxide and organic compound, were formed on sliding surfaces. Those would play an important role in the amount of friction and wear between roller and vane surfaces.

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CONSERVATIVE CARE OF NONUNION OWING TO OSTEOMYELITIS ASSOCIATED WITH FRACTURE OF MANDIBLE;REPORT OF 3 CASES. (하악골절부 골수염에 의한 비유합의 보전적 처치;증례보고)

  • Kim, Jong-Bae;Yoo, Jae-Ha;Choi, Byung-Ho
    • Maxillofacial Plastic and Reconstructive Surgery
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    • v.23 no.5
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    • pp.471-477
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    • 2001
  • Failure to use effective methods of reduction, fixation, and immobilization may lead to nonunion with osteomyelitis, owing to the compound nature of most fractures of the mandible. Nonunion results in fibrous pseudoarthrosis at the fracture site with instability that, once formed, does not improve spontaneously. Once the nonunion with osteomyelitis secondary to fractures has become established, intermaxillary fixation and drainage of infected tissue should be instituted as early as possible, because the fixation & drainage enhances the patient comfort and hinders ingress of microorganisms & debris by movement of bone fragments. The authors treated three cases of nonunion with osteomyelitis by intermaxillary fixation, incision & persistent drainage on the previous fistula site and endodontic drainage of infected teeth in the fracture site of mandible. The localization & sequestration of the infected bone around the fracture was better performed persistently by natural homeostatic mechanism in $8{\sim}10$ weeks and the bony union was then attained without bone grafting.

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Rainfall and Performance of Soil-Reinforced Regtaining Wall - Investigation on Case Histories (강우와 보강토 옹벽의 거동 - 시공 및 붕괴사례 고찰)

  • Yoo, Chung-Sik;Jung, Hyuk-Sang
    • Journal of the Korean Geosynthetics Society
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    • v.5 no.3
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    • pp.17-24
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    • 2006
  • This paper presents the two field walls that demonstrate the effect of rainfall on the performance of soil-reinforced retaining wall. A field test wall constructed in Geotechnical Experimental Site at Sungkyunkwan University has been monitored for more than 8 months to study the long-term behavior of soil-reinforced retaining wall. The measured data showed a good correlation between rainfall and wall movement after wall completion. A case of failed soil-reinforced retaining wall also is presented to highlight the effect of rainfall on the performance of soil-reinforced retaining wall. Implications of the findings are discussed.

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Friction and Wear of the Vane/Roller Surfaces Depending on Several Sliding Condition for Rotary Compressor (여러 미끄럼 조건에 따른 로터리 압축기 베인/롤러 표면의 마찰 마멸 특성)

  • Lee, Young-Ze;Oh, Se-Doo;Kim, Jong-Woo;Kim, Cheol-Woo;Choi, Jin-Kyu;Cho, Sung-Ook
    • 유체기계공업학회:학술대회논문집
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    • 2002.12a
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    • pp.221-226
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    • 2002
  • One of the serious challenges in developing rotary compressor with HFC refrigerant is the prediction of scuffing times and wear amounts between vane and roller surfaces. In this study, the tribological characteristics of sliding surfaces using vane-roller geometry of rotary compressor were investigated. The sliding tests were carried out under various sliding speeds, normal loads and surface roughness. During the test friction force, wear depth, time to failure and surface temperature were monitored. Because severe wear was occurred on vane surface, TiN coating was applied on sliding surfaces to prolong the wear-life of vane-roller interfaces. From the sliding test it was found that there was the optimum initial surface roughness to break in and to prolong the wear life of sliding surfaces. Depending on the load and speed, the protective layers, which were composed of metallic oxide and organic compound, were formed on sliding surfaces. Those would play an important role in role amounts of friction and wear between miler and vane surfaces.

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