• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.365-370
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• 2004

Generally, component and FR-4 board are connected by solder joint. Because material properties of components and FR-4 board are different, component and FR-4 board show different coefficients of thermal expansion (CTE) and thus strains in component and board are different when they are heated. That is, the differences in CTE of component and FR-4 board cause the dissimilarity in shear strain and solder joint' failure. The first order Taylor series expansion of the limit state function incorporating with Tresca failure criterion is used in order to estimate the failure probability of solder joints under heated condition. Using shear stresses and shear strains appeared on the solder joint, we estimate the failure probability of solder joints with the Tresca failure criterion. The effects of random variables such as CTE, distance of the solder joint from the neutral point(DNP), temperature variation and height of solder on the failure probability of the solder joint are systematically studied by using the failure probability model with first order reliability method(FORM).

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.370-371
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• 2006

The particulate strengthened $Cu-MoSi_2$ composites were prepared by a PM process to develop novel copper based composites with reasonable strength, high thermal conductivity and low thermal expansion coefficient. Microstructure of the composites was investigated by SEM; the tensile strength, elongation, thermal conductivity and thermal expansion coefficient (CTE) of the composites were examined. A comparative analysis of mechanical and thermal properties of various Cu-matrix composites currently in use was given and the strengthening mechanisms for the $Cu-MoSi_2$ composites were discussed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.322-322
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• 2008

Low-temperature co-fired ceramics (LTCC) have turned out to be very promising technology in accordance with the rapid developments in semiconductor technology. The demands for compact electrical assemblies, smaller power loss as well as high signal density can be fulfilled by LTCC. And for the multi-layered ceramic devices with embedded passive components such as high dielectric constant decoupling capacitor, LTCC materials require the several conditions to avoid delamination and internal cracks. For the present study, diopside-based glass is chosen as the LTCC substrate material in view of its high coefficient of thermal expansion (CTE). From the experimental resultsn the influence of each element on the CTE change can be revealed.

• Carbon letters
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• 제4권3호
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• pp.117-120
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• 2003

Asbestos is being replaced throughout the world among friction materials because of its carcinogenic nature. This has raised an important issue of heat dissipation in the non-asbestos brake pad materials being developed for automobiles etc. It has been found that two of the components i.e. carbon fibres as reinforcement and graphite powder as friction modifier, in the brake pad material, can playa vital role in this direction. The study reports the influence of these modifications on the thermal properties like coefficient of thermal expansion (CTE) and thermal conductivity along with the mechanical properties of nonasbestos brake pad composite samples developed in the laboratory.

• Composites Research
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• 제27권2호
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• pp.52-58
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• 2014

사출 성형을 통해 제조된 단섬유 강화 복합재는 사출 성형 중 발생하는 수지 유동으로 인해 동일 시편 내에서도 다양한 섬유 배향을 갖는다. 이러한 섬유의 배향은 최종 복합재의 기계적, 열적 특성에 많은 영향을 주므로, 본 연구에서는 사출 성형된 탄소단섬유 강화 PA6/PPO 복합재의 섬유 배향을 광학 현미경 분석을 통하여 측정하고 섬유의 배향이 복합재의 충격강도 및 열팽창 계수에 미치는 영향을 분석하였다. 충격강도의 경우에 섬유의 배향이 크랙이 전파되는 방향에 수직으로 배향되어 있을수록 더 높은 충격강도를 보였으며, 이는 섬유의 배향에 따른 충격내성 강화 메커니즘과 밀접한 연관성을 보여주었다. 열팽창 계수의 경우에는 섬유가 열팽창률을 측정하는 방향과 동일한 방향으로 배향되어 있을수록 더 낮은 열팽창계수를 보였으며, 이 결과 역시 섬유의 배향이 열팽창 특성에 미치는 메커니즘과 밀접한 연관성을 보였다.

• 한국기계가공학회지
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• 제18권4호
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• pp.41-47
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• 2019

The advent of highly integrated, high-power electronics requires low a coefficient of thermal expansion performance to prevent delamination between the heat dissipation material and substrate. This paper reports a preliminary study on the manufacturing technology of gas reaction control composite material, focusing on the prediction of the thermal expansion coefficients of Al-AlN composite materials. We obtained numerical equivalent property values by using finite element analysis and compared the values with theoretical formulas. Al-AlN should become the optimal composite material when the proportion of the reinforcing phase is approximately 0.45.

• 반도체디스플레이기술학회지
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• 제18권4호
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• pp.6-11
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• 2019

For a wider application of laser direct patterning, selective laser ablation of indium tin oxide (ITO) film on transparent oxide semiconductor (TOS) thin film was carried out using a diode-pumped Q-switched Nd:YVO₄ laser at a wavelength of 1064 nm. In case of the laser ablation of ITO on indium gallium zinc oxide (IGZO) film, both of ITO and IGZO films were fully etched for all the conditions of the laser beams even though IGZO monolayer was not ablated at the same laser beam condition. On the contrary, in case of the laser ablation of ITO on zinc oxide (ZnO) film, it was possible to etch ITO selectively with a slight damage on ZnO layer. The selective laser ablation is expected to be due to the different coefficient of thermal expansion (CTE) between ITO and ZnO.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.99-100
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• 2006

Cold gas dynamic spray or cold-spray is a deposition process, which causes deformation of a thin substrate. The deformation is usually convex to the deposited side. In this research, the main cause of the deformation was investigated using 6061-T6 aluminum alloy. The effects or anisotropic coefficient or thermal expansion (CTE) or the deposited layer by cold-spray and residual stress were studied by experiments and finite element analysis. The Hole Drilling method was applied to measure residual stress in the cold-spray layer and substrate. The data obtained by the experiments were used for the analysis of substrate deformation. From the result of the analysis, it was concluded that compressive residual stress was the main reason of substrate deformation while CTE had little effect.

• 한국표면공학회지
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• 제47권6호
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• pp.293-296
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• 2014

Fe-Ni has been of great interest because it is known as one of low thermal expansion alloys as various application areas. This alloy was fabricated by electroforming process, and effect of heat treatment on thermal expansion and hardness was investigated. Nano-crystalline structure of 13.3 - 63.5 nm in size was observed in the as-deposited alloy. To investigate the effect of heat treatment on grain growth and mechanical/thermal properties, we conducted hardness and coefficient of thermal expansion (CTE). From this, we confirmed these properties were varied by heat treatment. In this nano-crystalline alloy, we could observe abnormal behavior in thermal expansion between $350-400^{\circ}C$. Additionally, an abrupt change in hardness has also been observed. However, once the grains grow up to micro-sized the mechanical and thermal properties mentioned above were stabilized similar to those of bulk alloys due to heat treatment.

• 마이크로전자및패키징학회지
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• 제24권1호
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• pp.35-43
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• 2017

The three-dimensional integrated circuit (3D-IC) is a general trend for the miniaturized and high-performance electronic devices. The through-silicon-via (TSV) is the advanced interconnection method to achieve 3D integration, which uses vertical metal via through silicon substrate. However, the TSV based 3D-IC undergoes severe thermo-mechanical stress due to the CTE (coefficient of thermal expansion) mismatch between via and silicon. The thermo-mechanical stress induces mechanical failure on silicon and silicon-via interface, which reduces the device reliability. In this paper, the thermo-mechanical reliability of TSV based 3D-IC is reviewed in terms of mechanical fracture, heat conduction, and material characteristic. Furthermore, the state of the art via-level and package-level design techniques are introduced to improve the reliability of TSV based 3D-IC.