• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.112-112
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• 2009

In this study, the effect of a long post-deposition thermal annealing(600 and 1000 $^{\circ}C$) on the surface acoustic wave (SAW) properties of polycrystalline (poly) aluminum-nitride (AlN) thin films grown on a 3C-SiC buffer layer was investigates. The poly-AlN thin films with a (0002) preferred orientation were deposited on the substrates by using a pulsed reactive magnetron sputtering system. Experimental results show that the texture degree of AlN thin film was reduced along the increase in annealing temperature, which caused the decrease in the electromechanical coupling coefficient ($k^2$). The SAW velocity also was decreased slightly by the increase in root mean square (RMS) roughness over annealing temperature. However, the residual stress in films almost was not affect by thermal annealing process due to small lattice mismatch different and similar coefficient temperature expansion (CTE) between AlN and 3C-SiC. After the AlN film annealed at 1000 $^{\circ}C$, the insertion loss of an $IDT/AlN/3C-SiC/SiO_2/Si$ structure (-16.44 dB) was reduced by 8.79 dB in comparison with that of the as-deposited film (-25.23 dB). The improvement in the insertion loss of the film was fined according to the decrease in the grain size. The characteristics of AlN thin films were also evaluated using Fourier transform-infrared spectroscopy (FT-IR) spectra and X-ray diffraction (XRD), scanning electron microscopy (SEM), and atomic force microscopy (AFM) images.

• 마이크로전자및패키징학회지
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• 제6권4호
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• pp.41-48
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• 1999

실리카는 에폭시를 기지재로 하는 전자봉지재의 충진제로써 널리 사용되고 있는 재료이나 이의 낮은 방열성으로 인해 고방열성을 요구하는 부분에는 적용이 어렵다. 충진제 입자들의 지름비를 조합함으로써 최대충진 밀도를 높혀 고충진을 가능하게 하며 유동성도 향상된다는 점을 고려하여 높은 유동성을 가진 결정성 실리카(crystalline silica)를 큰 입자로 하고, 높은 열전도도와 낮은 열팽창계수를 가지지만 상대적으로 고각인 AlN을 작은 입자로 선정하여 혼합충진에 따른 EMC의 물성을 평가하였다. 실리카/AlN의 혼합비에 따른 EMC의 물성측정 결과, AlN의 투입분율을 0.3으로 하였을 때가 AlN의 투입에 따른 물성향상 효과가 가장 뛰어남을 확인 할 수 있었다. 따라서 AlN을 결정성 실리카와 최대 충진밀도에서 혼합하여 EMC에 적용할 경우에, 유동성의 저하없이 AlN의 소량투입만으로 뚜렷한 물성향상 효과를 얻을 수 있음을 확인할 수 있었다.

• 한국세라믹학회지
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• 제51권3호
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• pp.170-176
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• 2014

Effective glass frit compositions enabled to absorb laser energy, and to seal a commercial dye-sensitized solar-cell-panel substrate were developed by using $V_2O_5$-based glasses with various amounts of $TeO_2$ substitution. The latter was intended to increase the lifetime of the solar cells. Substitution of $V_2O_5$ by $TeO_2$ provided a strong network structure for the glasses via the formation of tetrahedral pyramids in the glass, and changed the various glass properties, such as glass transition temperature ($T_g$), dilatometric softening point ($T_d$), crystallization temperature, coefficient of thermal expansion (CTE), and glass flowage without any detrimental effect on the laser absorption property of the glasses. The thermal expansion mismatch (${\Delta}{\alpha}$) between the glass frit and the substrate could be controlled within less than ${\pm}5%$ by addition of 10 wt% of ${\beta}$-eucryptite. An 810 nm diode laser was used for the sealing test. The laser sealing test revealed that the VZBT20 glass frit with 10 wt% ${\beta}$-eucryptite was successfully sealed the substrates without interfacial cracks and pores. The optimum sealing conditions were provided by a beam size of 3 mm, laser power of 40 watt, scan speed of 300 mm/s, and 200 irradiation cycles.

• Elastomers and Composites
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• 제45권1호
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• pp.12-16
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• 2010

본 연구에서는 에폭시 나노복합재료의 수분 흡수, 열적 안정성 및 기계적 특성에 대한 소수성 실리카의 효과에 대해 고찰하였고, 에폭시 수지의 필러로는 디메틸디크로로실란에 의해 소수성으로 처리된 실리카를 사용하였다. 실험 결과, 실리카는 실란 커플링제의 첨가후 용융혼합법에 의하여 에폭시 수지내에서 균일하게 분산되었으며, 나노복합체의 수분 흡수율은 소수성으로 처리된 실리카의 함량 증가와 함께 감소하는 것을 확인하였다. 열분해 온도, 유리전이 온도, 그리고 열팽창 계수를 통한 나노복합재료의 열안정성은 실리카의 첨가와 함께 향상되는 것을 확인하였다. 또한, 인장강도 및 탄성율을 통한 나노복합재료의 기계적 특성은 실리카 함량 증가와 함께 증가하였고, 이는 에폭시 수지내에 고르게 분산된 실리카와 에폭시 수지 간의 강한 물리적 상호작용에 기인하는 것으로 판단된다.

• 마이크로전자및패키징학회지
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• 제13권3호
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• pp.39-45
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• 2006

다양한 에폭시 수지를 함유한 언더필의 열적 특성을 시차주사열량측정법, 열중량측정법, 동적-기계적 분석법, 열적-기계적 분석법과 같은 열 분석법을 이용하여 분석하였다. 또한, 언더필과 FR-4기판 사이의 접합 강도를 측정하였다. Cycolaliphatic 에폭시 수지를 함유한 언더필의 유리 전이 온도가 cycolaliphatic 에폭시 수지를 함유하지 않은 언더필의 유리 전이 온도보다 낮음을 확인할 수 있다. 대기로부터 유입된 산소와 열화된 폴리머 사이의 화학적 반응으로 인하여 언더필의 열적 감소 반응이 두 번 발생하는 것을 확인할 수 있다. Cycolaliphatic 에폭시 수지를 함유한 언더필의 열팽창 계수가 cycolaliphatic 에폭시 수지를 함유하지 않은 언더필의 열팽창 계수보다 높음을 확인할 수 있다. 과도한 경화 온도는 에폭시 수지의 경계면을 약하게 하여 에폭시 수지의 기계적 특성의 변화를 초래하게 되고 언더필과 FR-4 기판 사이의 접합 특성을 저하시키게 된다.

• 대한기계학회논문집A
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• 제25권10호
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• pp.1514-1519
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• 2001

This paper is concerned with design, manufacturing and performance test of LIPCA ( Lightweight Piezo- composite Curved Actuator) using a top carbon fiber composite layer with near -zero CTE(coefficient of thermal expansion), a middle PZT ceramic wafer and a bottom glass/epoxy layer with high CTE. The main point of this design is to replace the heavy metal layers of THUNDER by thigh tweight fiber reinforced plastic layers without losing capabilities to generate high force and large displacement. It is possible to save weight up to about 30% if we replace the metallic backing material by the light fiber composite layer. We can also have design flexibility by selecting the fiber direction and the size of prepreg layers. In addition to the lightweight advantage and design flexibility, the proposed device can be manufactured without adhesive layers when we use epoxy resin prepreg system. Glass/epoxy prepregs, a ceramic wafer with electrode surfaces, and a graphite/epoxy prepreg were simply stacked and cured at an elevated temperature (177 $^{circ}C$ after following an autoclave bagging process. It was found that the manufactured composite laminate device had a sufficient curvature after detached from a flat mold. The analysis method of the cure curvature of LIPCA using the classical lamination theory is presented. The predicted curvatures are fairly in agreement with the experimental ones. In order to investigate the merits of LIPCA, a performance test of both LIPCA and THUNDE$^{TM}$ were conducted under the same boundary conditions. From the experimental actuation tests, it was observed that the developed actuator could generate larger actuation displacement than THUNDERT$^{TM}$.

• 한국결정성장학회지
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• 제17권3호
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• pp.102-107
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• 2007

인산염계 유리를 사용하여 PDP 소자의 하판유전체 후막을 제작하였다. 유전체 후막의 제조는 soda-lime glass위에 silk screen printing 법을 사용하였다. 기판과 유전체후막의 열팽창계수를 맞추기 위하여 $TiO_2$와 $Al_2O_3$를 충진제로 사용하였다. 유전체의 결정화 거동은 DTA, XRD를 사용하였으며 광학적 열적 전기적인 특성을 알아보기 위하여 UV-spectrometer, Dilatometer, Impedance Analyser를 사용하였다. 실험결과 주 결정상은 메타인산아연과 피로인산아연으로 나타났다. $TiO_2$의 첨가로 인하여 반사율은 높아졌으나 상대적으로 유전상수는 높아졌다. 또한 $Al_2O_3$를 첨가한 경우 반사율은 크게 변화가 없었으나 유전상수 값은 낮아졌다. 또한 열팽창 계수는 약 $62{\times}10^{-7}/^{\circ}C$ 정도였다.

• International Journal of Aeronautical and Space Sciences
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• 제13권2호
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• pp.221-228
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• 2012

An active compensation method for the deformation of composite structures using additional controllable metal parts is proposed, and its feasibility is experimentally investigated in a simulated space environment. Composite specimens are tested in a vacuum chamber, which is able to maintain pressure on the order of 10-3 torr and interior temperature in the range of ${\pm}30^{\circ}C$. The displacement-measuring interferometer system, which consists of a heterodyne HeNe laser and an interferometer, is used to measure the displacement of the whole structure. Meanwhile, the strain of the composite part and temperature of both parts are measured by fiber Bragg grating sensors and thermistors, respectively. The displacement of the composite structure is maintained within a tolerance of ${\pm}1{\mu}m$ by controlling the elongation of the metal part, which is bonded to the end of the composite part. Also, the possibility of fiber Bragg grating sensors as control input sensors is successfully demonstrated using a proper corrective factor based on the specimen temperature gradient data.

• 한국세라믹학회지
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• 제48권6호
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• pp.604-609
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• 2011

Additives for low temperature sintering of mullite ceramics were investigated for matching Mo-Cu conducting paste with that ceramics at 1,400$^{\circ}C$. $SiO_2$, MgO and $Y_2O_3$ were chosen as the additives for low temperature sintering, and the amounts of those additives were varied with sintering temperature of 1,400$^{\circ}C$ to 1,500$^{\circ}C$. With additives of 1.0 wt% of $SiO_2$, 1.0 wt% of MgO, and 1.5 wt% of $Y_2O_3$, the densest sintered body of 3.12 g/$cm^3$ was obtained at 1,400$^{\circ}C$ in reducing atmosphere. The flexural strength of that was 325 MPa and the CTE (Coefficient of thermal expansion) was 4.33 ppm/$^{\circ}C$.

• 반도체디스플레이기술학회지
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• 제15권4호
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• pp.1-9
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• 2016

The warpage on mobile phone camera packages occurs due to the CTE(Coefficient of Thermal Expansion) mismatch between a thin silicon die and a substrate. The warpage in the optical instruments such as camera module has an effect on the field curvature, which is one of the factors degrading the optical performance and the product yield. In this paper, we studied the effect of die bonding epoxy on the package and optical performance of mobile phone camera packages. We calculated the warpages of camera module packages by using a finite element analysis, and their shapes were in good agreement showing parabolic curvature. We also measured the warpages and through-focus MTF of camera module specimens with experiments. The warpage was improved on an epoxy with low elastic modulus at both finite element analysis and experiment results, and the MTF performance increased accordingly. The results show that die bonding epoxy affects the warpage generated on the image sensor during the packaging process, and this warpage eventually affects the optical performance associated with the field curvature.