• Journal of the Korean Society for Precision Engineering
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• v.15 no.6
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• pp.124-138
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• 1998

Particles reinforced MMCs have many advantages over monolithic metals including a higher specific modulus, higher specific strength, better properties at elevated temperatures and better wear resistance. SiC$_p$/A16061 composites have good results in its mechanical properties. This work investigates SiC$_p$/A16061 composites in the microscopic view and compares the analytical results with the experimental ones. The discrepancy of the material properties between the reinforced particle, SiC$_p$, and the matrix material, A16061 appears to be so significant. Especially the coefficient of thermal expansion(CTE) of A16061 is 5 times larger than that of SiC$_p$. Thermal residual stress in MMCs is induced at high temperatures. The shape of particle is various but the theoretical model is not able to consider the nonuniform shape. Particle distribution is not homogeneous in experimental specimen. However, it is assumed to be homogeneous in simulation model. The shapes of particles are assumed to be not only perfect global but hexahedral shapes. The types of particle distribution are two - simple cubic array(SC array) and face-centered cubic array(FCC array).

• Advances in nano research
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• v.16 no.2
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• pp.127-140
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• 2024

Upon direct/indirect exposure to flame or heat, composite structures may burn or thermally buckle. This issue becomes more important in the natural fiber-based composite structures with higher flammability and lower mechanical properties. The main goal of the present study was to obtain an optimal eco-friendly composite system with low flammability and high thermal buckling resistance. The studied composite consisted of polypropylene (PP) and short abaca fiber (AF) with eggshell powder (ESP) and halloysite clay nanotubes (HNTs) additives. An optimal base composite, consisting of 30 wt.% AF and 70 wt.% PP, abbreviated as OAP, was initially introduced based on burning rate (BR) and the Young's modulus determined by horizontal burning test (HBT) and tensile test, respectively. The effects of adding ESP to the base composite were then investigated with the same experimental tests. The results indicated that though the BR significantly decreased with the increase of ESP content up to 6 wt.%, it had a very destructive influence on the stiffness of the composite. To compensate for the damaging effect of ESP, small amount of HNT was used. The performance of OAP composite with 6 wt.% ESP and 3 wt.% HNT (OAPEH) was explored by conducting HBT, cone calorimeter test (CCT) and tensile test. The experimental results indicated a 9~23 % reduction in almost all flammability parameters such as heat release rate (HRR), total heat released (THR), maximum average rate of heat emission (MARHE), total smoke released (TSR), total smoke production (TSP), and mass loss (ML) during combustion. Furthermore, the combination of 6 wt.% ESP and 3 wt.% HNT reduced the stiffness of OAP to an insignificant amount by maximum 3%. Moreover, the char residue analysis revealed the distinct differences in the formation of char between AF/PP and AF/PP/ESP/HNT composites. Afterward, dilatometry test was carried out to examine the coefficient of thermal expansion (CTE) of OAP and OAPEH samples. The obtained results showed that the CTE of OAPEH composite was about 18% less than that of OAP. Finally, a theoretical model was used based on first-order shear deformation theory (FSDT) to predict the critical bucking temperatures of the OAP and OAPEH composite plates. It was shown that in the absence of mechanical load, the critical buckling temperatures of OAPEH composite plates were higher than those of OAP composites, such that the difference between the buckling temperatures increased with the increase of thickness. On the contrary, the positive effect of CTE reduction on the buckling temperature decreased by raising the axial compressive mechanical load on the composite plates which can be assigned to the reduction of stiffness after the incorporation of ESP. The results of present study generally stated that a suitable combination of AF, PP, ESP, and HNT can result in a relatively optimal and environmentally friendly composite with proper flame and thermal buckling resistance with no significant decline in the stiffness.

• Composites Research
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• v.16 no.2
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• pp.41-47
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• 2003

This paper is concerned with the performance evaluation and comparison analysis fur several kinds of LIPCA (Lightweight Piezo-Composite Actuator) device system. LIPCA device system is composed of a piezoelectric ceramic layer and fiber reinforced light composite layers, typically a PZT ceramic layer was sandwiched by a top fiber layer with low CTE (coefficient of thermal expansion) and base layers with high CTE. To investigate the effect of lay-up structure of the LIPCA on the actuating performance, four kinds of actuator with different lay-up stacking sequence were designed, manufactured, and tested. The performance of each actuator was evaluated using an actuator test system consisted of an actuator supporting jig, a high voltage actuating power supplier, and a non-contact laser measuring system. From the comparison of the performance of the LIPCA prototypes, it was found that the actuator with higher coefficient of unimorph actuator can generate larger actuating displacement.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.1-7
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• 2006

A major failure mode for wafer level chip size package (WLCSP) is thermo-mechanical fatigue of solder joints. The mechanical strains and stresses generated by the coefficient of thermal expansion (CTE) mismatch between the die and printed circuit board (PCB) are usually the driving force for fatigue crack initiation and propagation to failure. In a WLCSP process peripheral or central bond pads from the die are redistributed into an area away using an insulating polymer layer and a redistribution metal layer, and the insulating polymer layer affects solder joints reliability by absorption of stresses generated by CTE mismatch. In this study, several insulating polymer materials were applied to WLCSP to investigate the effect of insulating material. It was found that the effect of property of insulating material on WLCSP reliability was altered with a solder ball layout of package.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.30 no.5
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• pp.94-100
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• 2002

This paper is concerned with the development, and performance test of LIPCA (Lightweight Piezo-composite Curved Actuator) that is lighter than other conventional piezo-composite type actuators. LIPCA is composed of top fiber composite layers with a high modulus and low CTE (Coefficient of Thermal Expansion), a middle PZT cermaic wafer, and base layers with a high modulus and high CTE. The performance of each actuator was evaluated using an actuator test system consisting of an actuator supporting jig, a high voltage actuating power supplier, and a non-contact laser measuring system. The simply supported condition actuator was excited by the power supplier with 1.0Hz cycle and up to $100\sim400V_{pp}$. The displacement at the center point of actuator was measured with non-contact laser displacement measuring system, It has been shown that the LIPCA-C2 can 34% decrease in mass and 13% increase in displacement compared to THUNDER.

• Carbon letters
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• v.5 no.4
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• pp.159-163
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• 2004

The polymer-ceramic hybrid, known as 'ceramer', was synthesized by a sol-gel process by incorporating different amount of alkoxide as source of silicon in resorcinol-formaldehyde in presence of basic catalyst to get different percentage of silicon in ultimate carbonized composites. FTIR of the ceramer confirms that it is a network of Si-O-Si, Si-O-$CH_2$ and Si-OH type groups linked with benzene ring. Different amount of silicon in the ceramer exhibits varying temperature of thermal stability and lower coefficient of thermal expansion as compared to pure resorcinol-formaldehyde resin. The lower value of CTE in ceramer is due to existence of silica and resorcinol -formaldehyde in co-continuous phase. Unidirectional composites prepared with ceramer matrix and high-strength carbon fibers show lower value of flexural strength at polymer stage as compared to those prepared with resorcinol-formaldehyde resin. However, after heat treatment to $1450^{\circ}C$, the ceramer matrix composites show large improvement in the mechanical properties, i.e. with 7% silicon in the ceramer, the flexural strength is enhanced by 100% and flexural modulus value by 40% as compared to that of pure resorcinol-formaldehyde resin matrix composites.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.74-80
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• 2014

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from their devices and system. Especially, reliability issue of lead-free solder joint is increasing in car electronics due to ELV (End-of-Life Vehicle) banning from 2016. We have prepared engine control unit (ECU) modules soldered with Sn-40Pb and Sn-3.0Ag-0.5Cu (SAC305) solders, respectively. Degradation characteristics of solder joint strength were compared with various conditions of automobile environment such as cabin and engine room. Thermal cycle test (TC, $-40^{\circ}C$ ~ ($85^{\circ}C$ and $125^{\circ}C$), 1500 cycles) were conducted with automotive company standard. To compare shear strength degradation rate with eutectic and Pb-free solder alloy, we measured shear strength of chip components and its size from cabin and engine ECU modules. Based on the TC test results, finally, we have known the difference of degradation level with solder alloys and use environmental conditions. Solder joints degradation rate of engine room ECU is superior to cabin ECU due to large CTE (coefficient of thermal expansion) mismatch in field condition. Degradation rate of engine room ECU is 50~60% larger than cabin room electronics.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.67-74
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• 2011

Keys to high wiring density semiconductor packages include flip-chip bonding and build-up substrate technologies. The current issues are the establishment of a fine pitch flip-chip bonding technology and a low coefficient of thermal expansion (CTE) substrate technology. In particular, electromigration and thermomigration in fine pitch flipchip joints have been recognized as a major reliability issue. In this paper, electromigration and thermomigration in Cu/Sn-3Ag-0.5Cu (SAC305)/Cu flip-chip joints and electromigration in Cu/In/Cu flip chip joints are investigated. In the electromigration test, a large electromigration void nucleation at the cathode, large growth of intermetallic compounds (IMCs) at the anode, a unique solder bump deformation towards the cathode, and the significantly prolonged electromigration lifetime with the underfill were observed in both types of joints. In addition, the effects of crystallographic orientation of Sn on electromigration were observed in the Cu/SAC305/Cu joints. In the thermomigration test, Cu dissolution was accelerated on the hot side, and formation of IMCs was enhanced on the cold side at a thermal gradient of about $60^{\circ}C$/cm, which was lower than previously reported. The rate of Cu atom migration was found comparable to that of electromigration under current conditions.

• Composites Research
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• v.27 no.6
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• pp.231-235
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• 2014

Autoclave processing has a good quality of product, but manufacturing cost is expansive. After curing of composite, the unwanted deformation and distortion increase the manufacturing cost by redesign of tool parts. Therefore, manufacturing cost down is a big issue in processing level. For the reduction of tool costs, it is important to investigate the effects of tool materials and tool surface conditions. In this paper, we organized user subroutine in ABAQUS to consider the thermal effects of part and tool, and the results are compared with commercial code, COMPRO. And this paper suggests reference point for the selection of tool materials to reduce manufacturing costs.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.6 no.4
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• pp.108-117
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• 1997

A continuum analysis has been performed for the application to the thermo-elasto-plastic behavior in a discontinuous metal matrix composite. an FEM (Finite Element Method) analysis was implemented to obtain the internal field quantities of composite as well as overall composite behavior and an experiment was demonstrated to compare with the numerical simulation . As the procedure, a reasonably optimized FE mesh generation, the appropriate imposition of boundary condition , and the relevant post processing such as elastoplastic thermomchanical analysis were taken into account. For the numerical illustration, an aligned axisymmetric single fiber model with temperature dependent material properties and precipitation hardening effect has been employed to assess field quantities. It was found that the residual stresses are induced substantially by the temperature drop during the thermal treatment and that the FEM results of the vertically and horizontally constrained model give a good agreement with experimental data.with non-woven carbon mat is about 24% higher than that of composite materials without non-woven carbon mat. Transverse tensile strength and torughness also increase by inserting non-woven carbon mat between layers.