• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.455-458
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• 2001

The thin films of high pemitivity in ferroelectric materials using a capacitor are applied to DRAMs and FRAMs. (Ba, Sr)$TiO_3$ thin films as ferroelectric materials were prepared by the sol-gel method and made by spin-coating on the Pt/Ti/$SiO_2/Si$ substrate at 4,000 [rpm] for 10 seconds. The devices of BST thin films to composite $(Ba_{0.7},Sr_{0.3})TiO_3$ were fabricated by changing of the depositing layer number on $Pt/Ti/SiO_2/Si$ substrate. The thin film capacitor to be ferroelectric devices was investigated by structural and electrical properties. The thickness of BST thin films at each coating numbers 3, 4 and 5 times was $2500[\AA]$, $3500[\AA]$, $3800[\AA]$. The dielectric factor of thin film when the coating numbers were 3, 4 and 5 times was 190, 400 and 460 on frequency l[MHz]. The dielectric loss of BST thin film was linearly increased by increasing of the specimen area.

• Corrosion Science and Technology
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• v.10 no.6
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• pp.212-217
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• 2011

In this study, corrosion characteristics of TiN and ZrN film on the abutment screw by arc-ion plating were investigated using a potentiodynamic anodic polarization test in deaerated 0.9% NaCl solution at $36.5{\pm}1^{\circ}C$. The surface morphologies of the coating layers before and after corrosion test were investigated by a field-emission scanning electron microscope (FE-SEM) and a energy dispersive x-ray spectroscopy (EDS). The surfaces of the TiN and ZrN coated abutment screws showed the smooth surfaces without mechanical defects like scratches which can be formed during the manufacturing process, compared with those of the non-coated abutment screw. The corrosion and passive current densities of TiN and ZrN coated abutment screws were lower than those of the non-coated abutment screw.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.30 no.12 s.255
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• pp.1211-1217
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• 2006

This study is focused on oxidation prevention of STS430, which is generally used as solid oxide fuel cell(SOFC) interconnect at intermediate operating temperatures with oxidation-proof coatings. Inconel, $La_{0.6}Sr_{0.4}CoO_3(LSCo)$ and $La_{0.6}Sr_{0.4}CoO_3(LSCr)$ were chosen as coating materials. Using a radio frequency magnetron sputtering method, each target material was deposited as thin film on STS430 and was analyzed to find out favorable conditions. In this study, LSCr-coated STS430 can reduce electrical resistance to 1/3 level, compared with uncoated STS430. Also, long-term durability test at $700^{\circ}C$ for 1000 hours tells that LSCr thin layer performs an important role to prohibit serious degradations. Superior oxidation-resistant characteristic of LSCr-coated STS430 is attributed to the inhibition of spinel structure formation such as $MnCr_2O_4$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.12
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• pp.821-825
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• 2015

Anti-reflective (AR) thin film was fabricated on a glass substrate by sol-gel method. The coating solution was synthesized with TEOS (tetraethlyorthosilicate) and poly ethylene glycol (PEG, 4.0 wt%). As the withdrawal speed of coating was changed from 0.1 mm/sec to 0.3 mm/sec, the thickness and refractive index of prepared thin films were changed. The reflectance and transmittance of coating glass fabricated by the withdrawal speed of 0.1 mm/sec were 0.62% and 95.0% in visible light range. The refractive index and thickness of single layer thin film were n= 1.29 and ca. 99.0 nm.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.135-135
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• 2016

Recently flexible electrode materials have attracted attention in various electrical devices. In general, copper(Cu) is widely used electrical conductive material. However, Cu film showed drastically reduction of electrical conductivities under an applied tensile strain of 10%. These poor mechanical characteristics of Cu have difficulty applying in flexible electronic applications. In this study, mechanical flexibilities of Cu thin film were improved by hybridization with carbon nanotubes(CNTs) and laser sintering. First, thin carbon nanotube films were fabricated on a flexible polyethylene terephthalate(PET) substrate by using ultrasonic spray coating of CNT dispersed solution. After then, physically connected CNT-Cu NPs films were formed by utilizing ultrasonic spray coating of Cu nanoparticles dispersed solution on prepared CNT thin films. Finally, CNT-Cu thin films were firmly connected by laser sintering. Therefore, electrical stabilities under mechanical stress of CNT-Cu hybrid thin films were compared with Cu thin films fabricated under same conditions to confirm improvement of mechanical flexibilities by hybridization of CNT and Cu NPs.

• The Korean Journal of Ceramics
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• v.2 no.2
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• pp.89-94
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• 1996

Aluminum and zinc titanium silicate sol-gel films were fabricated for application of waveguide and the effect of additions of ZnO and $Al_2O_3$ to binary titanium silicate films was investigated. During firing, the films are densified as they shrunk and their refractive index increases in the range of 1.58-1.83 depending on the film composition. The attenuation of the waveguides is not sensitive to changes in composition except for zinc titanium silicate waveguides which have substantially higher attenuation. However, the increase in the attenuation with aging of the waveguides depend upon the composition of waveuides. The addition $Al_2O_3$ or the reduced $SiO_2$ content in the composition appears to slow the deterioration of the waveguides due to the formation of more stable bonds and increased acidity on the film surface. Also, the wavelength dependence of the attenuation of the waveguides varies with composition. The attenuation of the waveguides except for the $65SiO_2{\cdot}35TiO_2$ composition are not Rayleigh scatter limited, suggesting the absorption loss of the waveguides due to the effects of residual carbon and structural defects in the films.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.455-458
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• 2001

The thin films of high permitivity in ferroelectric materials using a capacitor are applied to DRAMs and FRAMs. (Ba, Sr)TiO$_3$ thin films as ferroelectric materials were prepared by the sol-gel method and made by spin-coating on the Pt/Ti/SiO$_2$/Si substrate at 4,700 [rpm] for 10 seconds. The devices of BST thin films to composite (Ba$\_$0.7/Sr$\_$0.3/)TiO$_3$ were fabricated by changing of the depositing layer number on Pt/Ti/SiO$_2$/Si substrate. The thin film capacitor to be ferroelectric devices was investigated by structural and electrical properties. The thickness of BST thin films at each coating numbers 3, 4 and 5 times was 2500[${\AA}$], 3500[${\AA}$], 3800[${\AA}$]. The dielectric factor of thin film when the coating numbers were 3, 4 and 5 times was 190, 400 and 460 on frequency 1[MHz]. The dielectric loss of BST thin film was linearly increased by increasing of the specimen area.

• Journal of Sensor Science and Technology
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• v.28 no.4
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• pp.251-255
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• 2019

We propose a two-step lithography process to minimize edge-bead issues caused by thick photoresist (PR) coating. In the conventional PR process, the edge bead can be efficiently removed by applying an edge-bead removal (EBR) process while rotating the silicon wafer at a high speed. However, applying conventional EBR to the production of desired PR mold with unique negative patterns cannot be used because a lower rpm of spin coating and a lower temperature in the soft bake process are required. To overcome this problem, a two-step lithography process was developed in this study and applied to the fabrication of a polydimethylsiloxane (PDMS) film having super-hydrophobic characteristics. Following UV exposure with a first photomask, the exposed part of the silicon wafer was selectively removed by applying a PR developer while rotating at a low rpm. Then, unique PR mold structures were prepared by employing an additional under-exposure process with a second mask, and the mold patterns were transferred to the PDMS. Results showed that the fabricated PDMS film based on the two-step lithography process reduced the height difference from 23% to 5%. In addition, the water contact angle was greatly improved by spraying of hydrophobic nanosilica on the dual-scaled PDMS surface.

• Korean Journal of Metals and Materials
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• v.48 no.5
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• pp.401-409
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• 2010

This study was performed to develop an antibacterial film that can be dried at room temperature. A nanosized TiO$_2$ particle-dispersed solution was prepared by the hydrothermal treatment of peroxo-titanic acid at 160${^{\circ}C}$ for 4h. The binder was synthesized through the hydrolysis and condensation reactions of TEOS (10cc) and GPTS (3.5cc) in the mixture of H$_2$O (30cc) and EtOH (30cc). The synthesized binder was mixed with 0.1 M of TiO$_2$ solution in a volume ratio of binder/TiO$_2$ solution=0.25~0.5. The glass substrate was coated after using the dip coating method, which was then followed by drying for over 2h at room temperature. Although the TiO$_2$ particles did not chemically-bond to the binder, the coating layer strongly adhered to the substrate and displayed good antibacterial properties.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.107-112
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• 2022

In this study, a silver paste capable of UV curing without using any solvent was developed. The viscosity and viscoelasticity of the silver paste developed as a solvent-free type were measured. And after printing the pattern by screen printing, an electrode coating film was formed by UV curing. Conductivity, pencil hardness, and adhesive force of the formed electrode coating film were evaluated. Finally, the curing characteristics of the electrode coating film were evaluated by TGA and FT-IR. Summarizing these results, in terms of conductivity, adhesion, and curing characteristics, it was found that Paste (4), that is, silver paste obtained by mixing 1.2 ㎛ spherical silver powder and 50 nm silver powder at 72:8% had the best physical properties.