• Title/Summary/Keyword: chipping

검색결과 180건 처리시간 0.028초

미세홈 가공시 고압공기분사에 의한 형상정밀도의 향상 (The Improvement of Form Accuracy by High Pressure Air Jet in Slot Grinding)

  • 이석우;이용찬;정해도;최헌종
    • 한국정밀공학회지
    • /
    • 제16권1호통권94호
    • /
    • pp.68-74
    • /
    • 1999
  • One of the recent changes in machining technology is rapid application of micro- and high precision grinding processes. A fine groove generation is necessary for the fabrication of optic, electronic and semiconductor parts, and achieved by chemical or mechanical processes. Slot grinding is very efficient for the generation of micro ordered groove with hard and brittle materials. As slot grinding is continuous, the ground depth become gradually shallow because of wheel wear. The form accuracy become worse from the increase of ground slot width by the loading phenomena at wheel side, results on chipping damage of the workpiece. The experiments achieve to the enhancement of the form accuracy and chipping free of the brittle materials using V shaped cast iron bonded diamond wheels. In this study we focused on the investigation of the effect of the high pressure air jet on the grinding characteristics. As a results, we found that the high pressure air jet is very effective on the reductions of the wheel wear, enhancement of the form accuracy.

  • PDF

텅스텐 카바이드 공구를 사용한 앤드밀 가공에서 Si3n4-hBN 머시너블 세라믹스의 표면특성과 공구마멸 (Surface Properties and Tool Wear of Si3n4-hBN Machinable Ceramics in Endmill Machining using Tungsten Carbide Tool)

  • 장성민;조명우
    • 한국기계가공학회지
    • /
    • 제3권1호
    • /
    • pp.15-21
    • /
    • 2004
  • The machining process of ceramics can be characterized by cracking and brittle fracture. In the machining of ceramics, edge chipping and crack propagation are the principal reasons to cause surface integrity deterioration. Such phenomenon can cause not only poor dimensional and geometric accuracy, but also possible failure of the ceramic parts. Thus, traditional ceramics are very difficult-to-cut materials. To overcome such problems, in this paper, h-BN powder, which gives good cutting property, is added for the fabrication of machinable ceramics by volume of 5, 10, 15, 20, 25 and 30%. The objectives of this paper is to evaluate the fracture phenomenon of the tungsten carbide tool and the variation of surface integrity of the manufactured machinable ceramics under various cutting conditions during end mill machining With CNC machining center.

  • PDF

A study on the rock fracture mechanism of cutter penetration and the assessment system of TBM tunnelling procedure

  • Baek, Seung-Han;Moon, Hyun-Koo
    • 한국지구물리탐사학회:학술대회논문집
    • /
    • 한국지구물리탐사학회 2003년도 Proceedings of the international symposium on the fusion technology
    • /
    • pp.162-169
    • /
    • 2003
  • Excavation by TBM can be characterized by a rock-machine interaction during the cutting process on a small scale, but on a large scale the interaction between the rock mass and TBM becomes very significant. For the planning and evaluation of TBM tunnelling it needs to understand rock fracture mechanism by a cutter or cutters on a small scale, and to estimate penetration rate, advance rate and utilization on a large scale. In this study rock chipping mechanism due to cutter-penetration is analysed by numerical simulation, showing that rock chipping is mainly occurred by tensile failure. Also, through the analysis of factors that affect on TBM procedures in various assessment systems, it is determined that the key elements that should be considered in the planning and evaluation of TBM tunnelling are classified into rock properties, the geological structures and properties of rock mass, and the structural and functional specifications of the machine. The user-friendly assessment tool is developed, so that penetration rate, advance rate and TBM utilization are evaluated from various input data. The tool developed in this study can be applied to a practical TBM tunnelling by understanding TBM tunnelling procedures.

  • PDF

평 엔드밀 공구인선부 조도의 간접적인 측정법 (Indirect Method for Measurement of Tool Edge Roughness in flat End Mill)

  • 김전하;강명창;김정석
    • 한국정밀공학회지
    • /
    • 제19권10호
    • /
    • pp.92-98
    • /
    • 2002
  • End mill is an essential tool to generate complex surface in workpiece and it has been developed with various materials and tool shapes. The most important factor to evaluate the performance of end mill is still the wear characteristics of flank face. In addition to the flank wear, the tool edge roughness generated by the chipping is another important factor in aspects of material property and machinability evaluation and affects the quality of machined surface. Up to now, there is no direct method for measurement of tool edge roughness. In this study, the tool edge roughness of flat end mill is indirectly measured along the axial direction of workpiece. The theoretical equation is derived in consideration of tool geometry. Finally, the optimal conditions to measure the tool edge roughness by the proposed method are presented through the theoretical review and experimental identification.

리드 온 칩 패키징 기술을 이용하여 조립된 반도체 제품에서 패시베이션 박막의 TC 신뢰성에 영향을 미치는 요인들 (Factors to Influence Thermal-Cycling Reliability of Passivation Layers in Semiconductor Devices Utilizing Lead-on-Chip (LOC) Die Attach Technique)

  • 이성민;이성란
    • 한국재료학회지
    • /
    • 제19권5호
    • /
    • pp.288-292
    • /
    • 2009
  • This article shows various factors that influence the thermal-cycling reliability of semiconductor devices utilizing the lead-on-chip (LOC) die attach technique. This work details how the modification of LOC package design as well as the back-grinding and dicing process of semiconductor wafers affect passivation reliability. This work shows that the design of an adhesion tape rather than a plastic package body can play a more important role in determining the passivation reliability. This is due to the fact that the thermal-expansion coefficient of the tape is larger than that of the plastic package body. Present tests also indicate that the ceramic fillers embedded in the plastic package body for mechanical strengthening are not helpful for the improvement of the passivation reliability. Even though the fillers can reduce the thermal-expansion of the plastic package body, microscopic examinations show that they can cause direct damage to the passivation layer. Furthermore, experimental results also illustrate that sawing-induced chipping resulting from the separation of a semiconductor wafer into individual devices might develop into passivation cracks during thermal-cycling. Thus, the proper design of the adhesion tape and the prevention of the sawing-induced chipping should be considered to enhance the passivation reliability in the semiconductor devices using the LOC die attach technique.

레이저를 이용한 웨이퍼 다이싱 특성 (Characteristics of Laser Wafer Dicing)

  • 이용현;최경진;유승열
    • 반도체디스플레이기술학회지
    • /
    • 제5권3호
    • /
    • pp.5-10
    • /
    • 2006
  • This paper investigates cutting qualities after laser dicing and predicts the problems that can be generated by laser dicing. And through 3 point bending test, die strength is measured and the die strength after laser dicing is compared with the die strength after mechanical sawing. Laser dicing is chiefly considered as an alternative to overcome the defects of mechanical sawing such as chipping on the surface and crack on the back side. Laser micromachining is based on the thermal ablation and evaporation mechanism. As a result of laser dicing experiments, debris on the surface of wafer is observed. To eliminate the debris and protect the surface, an experiment is done using a water soluble coating material and ultrasonic. The consequence is that most of debris is removed. But there are some residues around the cutting line. Unlike mechanical sawing, chipping on the surface and crack on the back side is not observed. The cross section of cutting line by laser dicing is rough as compared with that by mechanical sawing. But micro crack can not be seen. Micro crack reduces die strength. To measure this, 3 point bending test is done. The die strength after laser dicing decreases to a half of the die strength after mechanical sawing. This means that die cracking during package assembly can occur.

  • PDF

AIN-hBN계 머시너블 세라믹스의 기계적 특성 및 엔드밀링 가공성 평가 (Mechanical Properties and End-milling Characteristic of AIN-hBN Based Machinable Ceramics)

  • 백시영;조명우;조원승
    • 한국세라믹학회지
    • /
    • 제45권1호
    • /
    • pp.75-81
    • /
    • 2008
  • In this study, machining characteristics of AIN-hBN composites were evaluated in end-milling process. As a first step, AIN-hBN composite specimens with various hBN contents were prepared using hot press method. Material properties of the composites, such as relative density, Young's modulus and fracture toughness, were measured and compared. Then, a series of end-milling experinients were performed under various cutting conditions by changing cutting speed, depth-of-cut and feed rate. Cutting force variations were measured using a tool dynamometer during the cutting experiments. Machined surfaces of the specimens were observed using SEM and a surface pro filer to investigate the surface integrity changes. The cutting force decreased with an increases of hBN content. The cutting process was almost impossible for monolithic AIN, owing to severe chipping. In contrast, at high content of hBN, surface damage and chipping decreased, and better surface roughness can be obtained.

Quantity and Processing Characteristics of Potatoes for Chipping during Autumn Cultivation by Harvest Time

  • Gyu Bin Lee;Jang Gyu Choi;Do Hee Kwon;Jae youn Yi;Young Eun Park;Yong Ik Jin;Gun Ho Jung
    • 한국자원식물학회:학술대회논문집
    • /
    • 한국자원식물학회 2023년도 임시총회 및 춘계학술대회
    • /
    • pp.25-25
    • /
    • 2023
  • As the demand for processing potatoes increases, imports of raw potatoes and potato products are increasing, so it is necessary to expand potato production as raw materials for processing in Korea. Potato varieties for processing that can be grown in fall have been developed, but research on cultivation technology and processing quality management technology to improve chip processing quality is very insufficient. Therefore, this study was conducted to investigate the optimal harvest time by investigating the quantity and chipping characteristics of potato chips during autumn cultivation. As the test varieties, the chip processing varieties "Saebong", "Eunsun", and "Geumnaru" were used, and the potato cultivation site was the Seocheon-gun Test field (214 Gaeya-ri) of the Chungcheongnam-do. The test treatment was at harvest time after spring cultivation, and the potatoes were harvested at 70, 80, 90, and 100 days after sowing based on the sowing time. The investigation items were potato productivity (total yield, yield of standard processing, and number of tubers) and chip-processing characteristics (chip color, dry matter content, glucose content, etc.). As a result of examining the yield characteristics according to the harvest time, statistical significance was not found according to the treatment. The total yield (ton/ha) was 27.5 to 30.5, and there was no significant difference depending on the time of 70 to 100 days after harvest. The standard quantity for processing (yield of 81-250g potatoes per unit) also showed a similar trend. In chipping characteristics according to harvest time, statistical significance was high in specific gravity and glucose content. The specific gravity was highest at 1.077 at 70 days after harvest, and the glucose (mg/dL) content was the lowest at 37.5 at 80 days after harvest. Statistical significance was not recognized, but chip color (L value) was the highest at 64.4 at 70 days after harvest. Therefore, it is judged that the optimal harvesting time for chip processing is 70 to 80 days after sowing.

  • PDF

NURBS 가공을 위한 적응이송속도 보간기 (Adaptive feedrate interpolator for NURBS curve)

  • 마르첸코티혼;백대균;고태조;김희술
    • 한국공작기계학회:학술대회논문집
    • /
    • 한국공작기계학회 2002년도 춘계학술대회 논문집
    • /
    • pp.94-99
    • /
    • 2002
  • Increasing demands on precision machining of 3D free-form surface have necessitated the tool smoothly varying feedrates. This paper presents on of algorithm for adaptive feedrate on NURBS curve. Since the algorithm for calculating variable feedrate depends on the curvature of curve, it permits to get constant material tool can be protected un terms of tool chipping vibration, etc.

  • PDF

열처리 금형강의 볼엔드밀 고속가공 (High Speed Ball End Milling of Hardened Mold Steel)

  • 양진석;허영무
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 2004년도 추계학술대회 논문집
    • /
    • pp.1418-1423
    • /
    • 2004
  • High speed machining experiment on the heat-treated mold steel(STAVAX and CALMAX of hardness HRc 53) is carried using TiAlN coated ball endmill. Tool life and wear characteristics under the various machining parameters and cooling methods are investigated. Effect of cooling method on life and wear of the tool was compared. For most cases, tool life was not determined by the amount of wear but by th chipping on the cutting edge. It is found that tool manufacturer's cutting parameters generally agrees with the results of this experiment.

  • PDF