• 제목/요약/키워드: chipping

검색결과 180건 처리시간 0.025초

사파이어 의료용 나이프의 연삭가공에서 지그의 탄성계수가 날 부 형상에 미치는 영향 : 제2보 탄성계수와 치핑 현상의 검증 (Effect of the Elasticity Modulus of the Jig Material on the Blade Edge Shape in the Grinding Process of Sapphire Medical Knife - Part 2 Verification of the Chipping Phenomenon and Elastic Modulus of the Jig Material)

  • 신건휘;강병욱;곽태수
    • 한국기계가공학회지
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    • 제16권5호
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    • pp.63-68
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    • 2017
  • This study determines the selection of an appropriate jig material for the blade edge of the medical sapphire knife. The physical properties of the jig material affects the edge shape and chipping phenomenon in machining of the medical sapphire knife. If a grinding wheel is used, brittle workpieces such as sapphire are easily damaged by the propagation of cracks because the grinding force significantly increases. It is important to constantly maintain the grinding force in the grinding process of the brittle materials. The grinding force can be kept constantly by inducing the elastic deformation of the Jig material because the elastic deformation of brittle work-piece is negligibly low. The chipping phenomenon may be reduced by selecting the proper Jig material. Aluminum, copper, stainless steels and carbon steel were used as Jig materials. The experiment was conducted using a cast iron grinding wheel, which was installed on a conventional grinding machine with the ELID grinding system. The thickness and width of the chipping area were measured using an optical microscope and FE-SEM to analyze the shape of the blade edge. According to the experiment result, the chipping phenomenon decreased, and the sharp edge was formed when the jig materials with low elastic modulus were used.

접합조건에 따른 콘크리트 접합부의 역학적 특성 (Mechanical Characteristics of Cementing Plane in Concrete Repair under Various Cementing Conditions)

  • 김재동;정요훈
    • 터널과지하공간
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    • 제13권5호
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    • pp.362-372
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    • 2003
  • 시멘트가 사용된 이래로 수많은 콘크리트 구조물들이 건설되어 왔으나 그 수명은 콘크리트의 특성으로 인해 한계가 있다고 할 수 있다. 이로 인하여 불가피하게 보수 보강의 필요성이 나타나며 최근까지 많은 방법들이 개발되어 적용되고 있다. 본 연구에서는 압축공기식 치핑머신과 앵커핀을 사용하여 노후화된 콘크리트를 보수 보강하는 새로운 방법을 적용하여 노후화된 콘크리트와 신선한 콘크리트의 접합면에 대한 역학적 특성을 밝히고자 하였다. 콘크리트 노후부를 제거하기 위한 방법으로 치핑머신을 사용한 경우와 브레이커를 사용한 경우를 비교한 결과 최대점착력에서는 치핑머신이, 잔류점착력에서는 브레이커를 사용한 경우가 높게 나타났다. 접합면에 치핑머신으로 요철을 준 결과, 최대점착력은 평평한 접합면의 경우에 비하여 30 mm 요철심도에서는 14%, 50 mm에서는 22%의 증가를 보였다. 앵커핀은 잔류점착력을 증가시키고 전단파단 이후 슬립을 억제하는 효과를 보였으며, 인장강도를 32% 정도 증가시키는 효과를 나타내었다. 요철과 앵커핀을 복합적으로 적용한 결과 최대점착력은 접합면이 없는 신선한 콘크리트의 77%에 이르렀고 잔류점착력은 신선한 콘크리트의 180%에 이르는 높은 효과를 보였다.

Edge chipping test (ECT)의 실험방법과 해석에 관한 문헌고찰 (Literature review on the experimental method and interpretation of the edge chipping test (ECT))

  • 송민규;고경호;허윤혁;박찬진;조리라
    • 대한치과보철학회지
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    • 제60권1호
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    • pp.9-18
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    • 2022
  • 임상에서 심미적 수복에 사용되는 세라믹 재료들은 성능에 대한 예측을 위해 실험실 연구가 필수적이다. 취성을 가진 세라믹의 물성 평가를 위해서는 파괴인성과 굽힘강도 등 전통적인 실험들이 사용되어 왔다. 하지만 이러한 실험은 실험의 하중조건, 실패 양상, 실패가 일어나는 하중 값이 사람의 교합력 범위나 임상에서의 실패와 유사하지 않다는 한계점이 있다. 반면 최근에 세라믹 부분파절을 연구하기 위해 도입된 edge chipping test (ECT)는 임상과 실패 양상이 비슷하고, 실패하중값도 사람의 교합력과 유사하여 세라믹 물성 연구에 유용하게 사용될 수 있다. 이 문헌고찰에서는 전통적인 세라믹 하중시험들의 의미와 한계점들을 살펴보고 ECT와 비교함으로써 보다 임상적으로 의미 있는 세라믹 재료들의 실험실 연구에 대해 고찰하고자 한다.

다이아몬드 코어드릴 공정의 구멍가공 특성과 모델링 (Drilling Characteristics and Modeling of Diamond Core Drilling Processes)

  • 윤관우;정성종
    • 한국공작기계학회논문집
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    • 제17권4호
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    • pp.95-103
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    • 2008
  • Diamond core drills are applied to drill difficult-to-cut materials. This paper proposes basic understanding of ceramic drilling mechanics and characteristics of main factors affecting tool life, tool wear, cutting force, and chipping thickness. In contrast to conventional drilling, the core drilling process make deep grooves on the workpiece. One difficulty of it is the evacuation of chips from the drilled groove. As the drilling depth increases, an increased amount of chips tend to cluster together and clog the groove. Eventually severe wear develops and diamond grits are separated from the drill body. To relieve the clogging problem and to evacuate chips from the groove easily, the helical drilling process is applied for the core drilling process. To analyze drilling characteristics and derive optimal drilling conditions, tool life, tool wear, cutting force, and chipping thickness are quantified through the monitoring system and the Taguchi method. Mathematical models for the tool life and chipping thickness are derived from the response surface method. Optimal drilling database has been constructed through the experimental models.

MR Polishing을 이용한 커버글라스의 굽힘강도 향상에 관한 연구 (A study of minimizing edge chipping of coverglass using MR Polishing)

  • 이정우;김지훈;임동욱;하석재
    • Design & Manufacturing
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    • 제16권1호
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    • pp.50-54
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    • 2022
  • Coverglass of electronic equipments is thinner and slimmer, so the glass must have good bending strength. In these days, the polishing edge of glass is used by solid tool like grinding wheel. But solid tool leave micro crack or edge chipping in edge of glass. MR polishing is an optimal method by polishing edge of glass. MR polishing is used MR fluid that is a liquid tool. MR polishing doesn't leave tool path or residual stress, micro crack and edge chipping unlike grinding wheel polishing. In this paper, the results of grinding and MR polishing were compared and analyzed to improve bending strength by minimizing edge chipping of cover glass. It was derived that the depth and size of cracks have a significant influence on the bending strength of the glass edge. The edges of the glass using MR grinding were analyzed to have a better surface and higher bending strength than the glass using abrasive wheel grinding. It was confirmed that MR polishing had an effect on strength improvement by effectively removing cracks in the specimen.

실리콘 웨이퍼의 초정밀 절단가공에 관한 연구 (A Study on Ultraprecision Dicing Machining of Silicon Wafer)

  • 이은상;송지복;김성철
    • 한국정밀공학회지
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    • 제17권6호
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    • pp.185-191
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    • 2000
  • Recently, a slightest influence to the circuit can be a great damage because the size of semiconductor smaller. It must be controlled the chippingless dicing process and the precision dicing without any damage to tile circuit. In this study, the relationship between chipping effect and the force of dicing was analysed. The rate of chipping was decreased as the farce of dicing decreased. It was also examined that the farce of dicing decreased according to the lower feed rate and higher blade speed. The lower feed rate and the higher blade speed must be controlled to achieve the chippingless process.

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Slot Grinding시 전해 인프로세스 드레싱의 영향에 관한 연구 (Effect of Electrolytic In-process Dressing in Slot Grinding)

  • 유정봉;정해도;최헌종
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1995년도 추계학술대회 논문집
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    • pp.48-52
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    • 1995
  • Chipping is an unavidable phenomean in the slot grinding process of hard and brittle materials. However,it should be reduced for the improvement of surface integrity in the manufacture of optical and semiconductor components. Electrolytic In-process Dressing (ELID) technique for metal bonded superabrasive grinding wheel has been developed for mirror surface grinding of hard and brittle materials. Electrically dressed wheel surface has sharply exposed abrasives and results in lower grinding force, higher grinding efficiency in grinding. The paper deals with a newly developed method for slot grinding using ELID and was implemented to improve grooved surface quality and decreases chipping size on the edge of the groove. As a result, we accomplished shipping-free grooves and obtained the clear ground sufaces on glass and tungsten carbide.

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부분 피복 피니언 공구의 마멸에 관한 연구 (A Study on the Wear of partially coated Pinion Cutter)

  • 김상균;지용권;김인성;조용주
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1996년도 추계학술대회 논문집
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    • pp.74-79
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    • 1996
  • The wear of partially coated pinion cutters under several cutting conditions was studied. In the realm of this experiment, chipping was a dominant tool wear mechanism and flank wear was much larger than crater wear. Under the condition of relatively low rotary feed and low radial feed rate, the wear due to chipping was concentrated at the nose part of pinion cutter. Increasing of rotary feed and radial feed rate alleviated the concentration of chipping at nose and prolonged tool life.

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무 알칼리 유리의 연마 조건에 따른 영향 (Effect of Polishing Grinding Conditions on Alkali-free Glass)

  • 박영희;홍민성
    • 한국생산제조학회지
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    • 제25권6호
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    • pp.440-444
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    • 2016
  • Owing to the introduction of various IT devices with emphasis on portability and design, the TFT (thin film transistor liquid crystal display) panel applied to IT devices has the same shape as the product, and the portability requirement of IT devices has resulted in a need for panels with higher rigidity. In this study, the effect of grinding conditions such as the feed rate and edge speed of edge grinding on the surface roughness and chipping of the machined surface is investigated using a metal bond wheel. During edge grinding of alkari-free glass, weak mechanical property of glass results in big chipping owing to generation of tensile stress at the end of grining operation. The results of this study show that the grinding characteristics of alkali-free glass are obtained and meet industry requirements.

영상처리를 이용한 초정밀가공용 다이아몬드 공구의 마멸 측정 (Wear Mwarsurement of Single Crystal Diamond Tool Using Image Processing)

  • 양민양
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1996년도 춘계학술대회 논문집
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    • pp.135-139
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    • 1996
  • In this a paper, a new method to measure the wear of the single crystal diamond(SCD) tool using image processing is presented. To increase resoultion, high magnifying lens is used and to enlarge the measurement field of view, a image region matching method is applied. The shape of SCD tool is modeled by mathematical analysis. Cutting edge chipping and wear are calculated by the model. This method is proved to be efficient in detecting a few micron of wear and cutting edge loss by chipping along the whole cutting edge.

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