• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.11
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• pp.19-31
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• 1996

Spread spectrum method gurantees good performance in digital communication system under multi-path interference and jamming signals. The purpose of this paper is to develop the wireless modem using DS/SS techinque. The transceiver consists of a spread spectrum DQPSK transmitter and a mtching receiver. The system operates with the chipping rate set to 4 Mcps and the number of chips/symbol at 64, making the data rate 62.5 Kbps using QPSK modilation. The receiver section uses a digital matched filter for fast acquisition of burst signals and uses the comparing the BER of proposed system iwth that of narrow bnd system under various additive white gaussian noises. It is showen that the proposed sysem has better performance than narrow band system. When jamming signals is added to the suggested DS/SS system, we also show that the experimental performance (BER) of the suggested wireless modem is almost same as theroretical performance.

• Proceedings of the KIEE Conference
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• 2006.04a
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• pp.327-329
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• 2006

In this paper, the cutting qualities by laser dicing and fracture strength of a silicon die is investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bend test and is compared with the die strength by mechanical sawing. As a results, die strength by laser dicing shows a decrease of 50% in compared with die strength by mechanical sawing.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.4
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• pp.24-29
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• 2017

This paper provides an experimental analysis on the breakage of the coated tool using the face-milling cutter of the machining center due to changes in the cutting speed and the feed rate. The experimental studies were conducted using STS 304 materials and the damage to the tool was analyzed according to the change in machining time. The experiments confirmed that the cutting speed and feed rate affected the tool damage and the mechanical impact and thermal shock were determined to severely damage the tool. From the production engineering point of view, it has been experimentally investigated that the increased feed rate significantly influences the material removal rate more than the increased cutting speed.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.6
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• pp.168-176
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• 1996

A diagnosis system which can monitor tool breakage and chipping in real time was developed using a DSP(Digital Signal Processor) board in face milling operation. AR modelling and band energy method were used to extract the feature of tool states from cutting force signals. Artificial neural network embedded on DSP board discriminates different patterns from features got after signal processing. The features extracted from AR modelling are more accurate for the malfunction of a process than those from band energy method, even though the computing speed of the former is slow. From the processed features, we can construct the real time diagnosis system which monitors malfunction by using a DSP board having a parallel processing capability.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1994.10a
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• pp.61-66
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• 1994

Tool condition monitoring is one of the most important aspects to improve productivity and quality and to achieve intelligent machining system. The tool state is classified into three groups as chipping, wear and fracture. In this study, wear of a ceramic cutting tool for hardened die material (SKD11) was investigated. Flank wear was occured more dominant than crarer wear. Therefore, to predict flank wear, the modeling of cutting force has been performed. The modeling of cutting force by an assumption that act the stress distribution on the tool face obtained through a numerical analysis. The relationships between the cutting force and the tool wear can be constructed by machining paraneters with cutting conditions. Experiments were performed under the various cutting conditions to ensure the validity of force models. The theoretical predictions of the flank wear is approximately in good agreement with experimental result.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.6
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• pp.926-931
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• 2012

Rotary bar was cutting tool being in use for deburring scale after welding metal and for eliminating sharp edges. It was necessary to develop exclusive 6-axis machine being possible to process machining continuously for making an cutting edge of rotary bar and to revise easily machining program. This study aimed at the structural analysis of strength according to the configuration of new made 6-axis machine and at the machining accuracy and durability of rotary bar. As a result of test, the runout of new rotary bar manufactured out of 6-axis machine was decreased from 0.385 mm to 0.027mm extensively than old one. And good cutting ability and durability was obtained equal quality compared with imported products.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.200-201
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• 2014

다이아몬드 마이크로 블레이드의 절삭 효율을 향상시키고 절삭 과정에서의 블레이드 측면 경질 박막이 절삭 성능에 미치는 영향을 연구하기 위해 Cu/Sn 금속 결합재에 $MoS_2$와 $WS_2$ 고체 윤활제를 각각 동일 분율 첨가한 후 PAPVD법으로 DLC 박막을 블레이드의 측면에 증착하였다. 실착 절삭 시험을 위해 마이크로 블레이드 시편을 제조하여 충분한 드레싱 과정 후 절삭 시험을 행하였으며 절삭 중 순간 소모 전력과 블레이드의 마모량을 비교 평가하였다. DLC 코팅은 절삭 중 측면에 안정적으로 존재하며 측면 지립의 돌출을 억제하고 마찰을 감소시켜 절삭 효율이 향상되었으며 결과적으로 수명이 증가하였다.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2006.05a
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• pp.251-254
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• 2006

In this paper, cutting qualifies and fracture strength of silicon dies by laser dicing are investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bending test and is compared with the die strength by mechanical sawing. As a results, die strength by the laser dicing shows a decrease of 50% in compared with die strength by the mechanical sawing.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.6
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• pp.1-8
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• 2011

Recently, super heat-resistant alloy Inconel 600 come into spotlight as the material of airplane parts but this material causes lots of problems that is, reduction of machinability and attritious wear and breakage of cutting tool during turning processing due to high temperature strength and cohesion between tool material and Inconel 600. Therefore, in this study, it was purposed to determine tool material kind and to select of proper cutting range when turning process was carried out for Inconel 600. In order to these Purpose, coated carbide tool and ceramic tool was used in this experiment and the machinability of Inconel 600 was investigated from perspective of the cutting force, chipping and wear of tool and deposition phenomenon of chip.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.10 no.5
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• pp.25-30
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• 2001

The purpose of this investigation is experimentally to clarify the machinability and optimum tool geometry on milling of hardened STD11 steel. In the finish process office milling of high hardened STD11 steel by CBN tool, the optimum tool shape is suggested, which can minimize the tool fracture and chipping by impact. It is measured that cutting farce, tool wear and surface roughness generated during single-insert face milling using various geometric CBN tools. It has been found that the optimal chamfer angle of CBN tool is about -$25^{\circ}C$ and the suitable chandler width is 0.2mm. The nose radius of tool is the most excellent at 1.2mm in the viewpoint of tool wear and surface roughness.