• 제목/요약/키워드: characterization of adhesive layer

검색결과 4건 처리시간 0.018초

고무 접합이 후방복사된 리키 램파 프로파일에 미치는 영향 (Effects of Rubber Loading on the Ultrasonic Backward Radiation Profile of Leaky Lamb Wave)

  • 송성진;권성덕;정민호;김영환
    • 비파괴검사학회지
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    • 제22권5호
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    • pp.508-515
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    • 2002
  • 다층재료의 접합특성 평가는 오랫동안 많은 논의가 있어 왔는데, 본 연구에서는 후방복사 초음파 기술을 사용하여 여러 충이 있는 재료의 특성을 평가하기 위한 자동화된 시스템을 개발하고 스틸 판재와 고무가 접합된 스틸 판재의 후방복사 프로파일을 획득하였다. 후방복사의 rf 파형과 주파수 스펙트럼은 리키 램파 모드들의 특성을 나타내고 있다. 집합된 고무 두께의 증가에 따라 입사각이 $13.4^{\circ}$일 때의 후방복사 진폭이 지수적으로 감소함을 보이며 부분적으로 고무가 접합된 시편에서 선택되어진 입사각으로 입사위치를 바꾸어가며 스캐닝한 결과 정확하게 고무가 접합되어 있지 않은 지역을 결정할 수 있었다. 리키 램파에 의한 후방복사는 판재의 물성은 물론이고 다층 재료의 접합특성 평가에 활용할 수 있다.

DLC 코팅한 Fe-3.0%Ni-0.7%Cr-1.4%Mn-X강의 표면특성평가 (Characterization of DLC Coated Surface of Fe-3.0%Ni-0.7%Cr-1.4%Mn-X Steel)

  • 장재철;김송희
    • 한국표면공학회지
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    • 제47권1호
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    • pp.13-19
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    • 2014
  • The various surface treated conditions of Fe-3.0%Ni-0.7%Cr-1.4%Mn-X steel such as as-received, ion nitriding, DLC coated, DLC coated after nitriding for 3 hrs and 6 hrs were investigated to evaluate the beneficial effect for plastic mold steel. Micro Vickers hardness tester was used to estimate nitriding depth from the hardness profile and to measure hardness on the surface. Elastic modulus and residual stress were measured by a nanoindentator. Scratch test and SP (small ball punch test) were utilized to assess the adhesive strength of DLC coating. The depth of nitriding layer was measured as $50{\mu}m$ for the condition of 3 hrs nitriding and $90{\mu}m$ for that of 6 hrs nitriding. Hardness, elastic modulus, residual stress of DLC coating were 20.37 GPa, 162.78 GPa and -1456 MPa respectively. Residual stress on the surface of DLC coating after nitriding could increase to -3914 MPa by introducing nitriding before DLC coating. During the 'Ball-On-Disc' test ${\gamma}^{\prime}$ particles pulled out from the surface of nitrized layer tend to enhance abrasive wear mode since the fraction of ${\gamma}^{\prime}$ (Fe4N) in ion-nitrized layer is known to increases with nitriding time. Thus the specific wear rate of the nitriding layer increased. Comparing with nitriding the specific wear rate in work piece disc as well as ball decreased prominently in DLC coating due to the remarkable reduction in friction coefficient.

Characterization of Surface Layer Proteins in Lactobacillus crispatus Isolate ZJ001

  • Chen, Xueyan;Chen, Yang;Li, Xiaoliang;Chen, Ning;Fang, Weihuan
    • Journal of Microbiology and Biotechnology
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    • 제19권10호
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    • pp.1176-1183
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    • 2009
  • Lactobacillus crispatus (L. crispatus) ZJ001 is highly adhesive to epithelial cells and expresses S-layer proteins. In this study, S-S-layer layer genes were sequenced and expressed in E. coli to characterize the function of proteins with this particular strain. L. crispatus ZJ001 harbored two S-layer genes slpA and slpB, and only slpA gene was expressed in the bacterium, as revealed by RT-PCR and immunoassays. The mature SlpA showed 47% amino acid sequence identity to SlpB. The SlpA and SlpB of L. crispatus ZJ001 were highly homologous at the C-terminal region to other Lactobacillus S-layer proteins, but were substantially variable at N-terminal and middle regions. Electron microscopic analysis indicated that His-slpA expressed in E. coli was able to form a sheet-like structure similar to the natural S-layer, but His-slpB formed as disc-like structures. In the cell binding experiments, HeLa cells were able to bind to both recombinant His-slpA and His-slpB proteins to the extent similar to the natural S-layer. The cell binding domains remain mostly in the N-terminal regions in SlpA and SlpB, as shown by high binding of truncated peptides SlpA2-228 and SlpB2-249. Our results indicated that SlpA was active and high binding to HeLa cells, and that the slpA gene could be targeted to display foreign proteins on the bacterial surface of ZJ001 as a potential mucosal vaccine vector.

Characterization of Inkjet-Printed Silver Patterns for Application to Printed Circuit Board (PCB)

  • Shin, Kwon-Yong;Lee, Minsu;Kang, Heuiseok;Kang, Kyungtae;Hwang, Jun Young;Kim, Jung-Mu;Lee, Sang-Ho
    • Journal of Electrical Engineering and Technology
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    • 제8권3호
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    • pp.603-609
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    • 2013
  • In this paper, we describe the analysis of inkjet-printed silver (Ag) patterns on epoxy-coated substrates according to several reliability evaluation test method guidelines for conventional printed circuit boards (PCB). To prepare patterns for the reliability analysis, various regular test patterns were created by Ag inkjet printing on flame retardant 4 (FR4) and polyimide (PI) substrates coated with epoxy for each test method. We coated the substrates with an epoxy primer layer to control the surface energy during printing of the patterns. The contact angle of the ink to the coated epoxy primer was $69^{\circ}$, and its surface energy was 18.6 $mJ/m^2$. Also, the substrate temperature was set at $70^{\circ}C$. We were able to obtain continuous line patterns by inkjet printing with a droplet spacing of $60{\mu}m$. The reliability evaluation tests included the dielectric withstanding voltage, adhesive strength, thermal shock, pressure cooker, bending, uniformity of line-width and spacing, and high-frequency transmission loss tests.