• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2005년도 제17회 워크샵 및 추계학술대회
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• pp.656-659
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• 2005

Nanocrystalline ceria powders were prepared by hydrothermal treatment of cerium(IV) ammonium nitrate solution without a precipitating agent. A systematic investigation of the effect of hydrothermal temperature and react ion time on the physical properties of the product powders was carried out. When the hydrothermal temperature was increased, the product ceria powders exhibited larger crystallite size with higher yield. Increasing reaction time produced more crystalline ceria powders attributed to further hydrothermal reactions and structural rearrangement. The physical properties of ceria powders can be control led by adjusting the hydrothermal conditions.

• 한국세라믹학회지
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• 제35권6호
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• pp.610-618
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• 1998

Alumina were added to ceria based ceramic powders upto 9.7 vol% and composite powders were sprayed by plasma spraying process in order to improve the mechanical properties such as hardness fracture tough-ness and thermal shock resistance. The ceria based coating sprayed without alumina has the typical colum-nar and lamellar structure. Alumina addition has lowered the amount of columnar and lamellar sturcture Added alumina was segreagated in the grain boundary and grain of ceria based crystal accompanied with pore. The maximum value of density and the minimum value of porosity were observed at the sprayed coating with 4.8 vol% alumina. The hardness fracture toughness and thermal shock resistance were increased with alumina addition. The improvement of mechanical properties of plasma sparyed ceria based coatings result-ed from the disapperance of the columnar and lamellar sturcture by addition of alumina.

• 한국재료학회지
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• 제15권12호
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• pp.818-823
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• 2005

Sub-micron colloidal silica particles coated with nano-sized ceria were prepared by mixing of its silica and cerium salts hydrolysis, and modified by hydrothermal reaction. By using the slurries with and without hydrothermal modification containing above particles, oxide film coated on silicon wafer was polished. The modified slurries had higher polish rate due to increase of ceria fraction to silica through hydrothermal reaction. They revealed higher stability in wide range of pH $2\~10$ than ceria coated silica slurries without its modification.

• 분석과학
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• 제32권5호
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• pp.173-184
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• 2019

As the size of semiconductors becomes smaller, it is necessary to perform high precision polishing of nanoscale. Ceria, which is generally used as an abrasive, is widely used because of its uniform quality, but its stability is not high because it has a high molecular weight and causes agglomeration and rapid precipitation. Such agglomeration and precipitation causes scratches in the polishing process. Therefore, it is important to accurately analyze the size distribution of ceria particles. In this study, a study was conducted to select dispersants useful for preventing coagulation and sedimentation of ceria. First, a dispersant was synthesized and a ceria slurry was prepared. The defoamer selection experiment was performed in order to remove the air bubbles which may occur in the production of ceria slurry. Dynamic light scattering (DLS) and asymmetrical flow field-flow fractionation (AsFlFFF) were used to determine the size distribution of ceria particles in the slurry. AsFlFFF is a technique for separating nanoparticles based on sequential elution of samples as in chromatography, and is a useful technique for determining the particle size distribution of nanoparticle samples. AsFlFFF was able to confirm the presence of a little quantities of large particles in the vicinity of 300 nm, which DLS can not detect, besides the main distribution in the range of 60-80 nm. AsFlFFF showed better accuracy and precision than DLS for particle size analysis of a little quantities of large particles such as ceria slurry treated in this study.

• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2010년도 추계학술발표논문집 1부
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• pp.318-322
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• 2010

NaZSM 5 was synthesized in an alkaline medium and impregnated with cerium oxide by wet method using cerium nitrate as the source for cerium. There TGA results shows decomposition of nitrate at $200^{\circ}C$. The ceria impregnated ZSM 5 materials were designated as NaZSM 5 (X) where X is the percent ceria impregnated (3, 5, 7, 11, 19%). They were characterized by XRD, SEM, EDAX, BET techniques. XRD analysis showed decrease in intensity of the patterns with the increase in the ceria loading but crystallization of ceria to larger size is evident for 11 and 19% loading. The surface area and pore volume decreased with increase in ceria loading. The maximum adsorption capacity of NaZSM 5 (5%) is 100.2 mg/g of sorbent. The ceria impregnated NaZSM 5's were found to be regenerable, selective and recyclable.

• 한국세라믹학회지
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• 제35권12호
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• pp.1294-1300
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• 1998

Yttria-stabilized zirconia ceramics with irregular grain shapes and curved grain boundaries was prepared by ceria doping. The amount of ceria doped into zirconia compacts by a dipping method were at range of 2 to 20 mol% Irregular grain shapes and curved grain boundaries were formed only inspecimens doped with more than 8mol% cerial. Ceria-doped specimens showed large grain size and low sintered density compared with pure yttria-stabilized zirconia which was due to the increase in the contents of stabilizer and cubic phase. The amount of doped ceria was larger on the surface than the inside regions and therefore mi-crostructure and phase on the surface were different from those in the inside regions. Transgranular frac-ture mode was observed ion ceria doped specimens due to irregular large grain sizes.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.35-37
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• 2005

100, 200nm 크기의 colloidal silica 각각에 나노 ceria 입자를 수열합성법으로 코팅하였다. Colloidal silica 입자에 ceria를 코팅 시 slurry의 pH조절과 수열처리에 이용하여 silica에 ceria가 코팅됨을 TEM과 zeta-potential을 이용하여 확인하였다. 연마 슬러리의 분산 안정성과 연마효율을 높이기 위하여 슬러리의 pH 는 9로 하였으며, 이때의 zeta-potential 값은 -25 mV이었다. 1 wt%로 제조된 연마슬러리를 이용하여, 4 inch $SiO_2$, $Si_3N_4$ wafer를 압력변화에 따른 연마특성을 관찰 하였다. Ceria coated colloidal silica 100 nm, 200 nm와 commercial한 $CeO_2$입자를 연마압력 6 psi로 oxide film을 연마한 결과 연마율이 각각 2490 ${\AA}/min$, 4200 ${\AA}/min$, 4300 ${\AA}/min$으로 측정되었다. 또한 $SiO_2$, $Si_3N_4$ film의 6 psi압력에서 ceria coated colloidal silica 100 nm, 200 nm와 commercial 한 $CeO_2$입자의 선택비는 3, 3.8, 6.7 이었다. 입자크기가 클수록 연마율이 높으며, Preston equation을 따라 연마 압력과 연마율이 비례하였다.

• 한국재료학회지
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• 제23권12호
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• pp.695-701
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• 2013

To understand how reactivity between reinforcing nanoparticles and aqueous solution affects electrodeposited Cu thin films, two types of commercialized cerium oxide (ceria, $CeO_2$) nanoparticles were used with copper sulfate electrolyte to form in-situ nanocomposite films. During this process, we observed variation in colors and pH of the electrolyte depending on the manufacturer. Ceria aqueous solution and nickel sulfate ($NiSO_4$) aqueous solutions were also used for comparison. We checked several parameters which could be key factors contributing to the changes, such as the oxidation number of Cu, chemical impurities of ceria nanoparticles, and so on. Oxidation number was checked by salt formation by chemical reaction between $CuSO_4$ solution and sodium hydroxide (NaOH) solution. We observed that the color changed when $H_2SO_4$ was added to the $CuSO_4$ solution. The same effect was obtained when $H_2SO_4$ was mixed with ceria solution; the color of ceria solution changed from white to yellow. However, the color of $NiSO_4$ solution did not show any significant changes. We did observe slight changes in the pH of the solutions in this study. We did not obtain firm evidence to explain the changes observed in this study, but changes in the color of the electrolyte might be caused by interaction of Cu ion and the by-product of ceria. The mechanical properties of the films were examined by nanoindentation, and reaction between ceria and electrolyte presumably affect the mechanical properties of electrodeposited copper films. We also examined their crystal structures and optical properties by X-ray diffraction (XRD) and UV-Vis spectroscopy.

• 한국세라믹학회지
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• 제38권8호
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• pp.698-704
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• 2001

Doped ceria의 전기전도도는 도핑 원소의 종류와 양에 큰 의존성을 가지고 특정 조성에서 최대 전도도 값을 가지며 높은 dopant 농도에서는 전기전도도는 감소한다. 이런 현상은 dopant와 산소 빈자리 사이의 회합 형성과 관련이 있다고 알려져 있다. 그러나 Gd 이온이 도핑된 ceria의 경우 주된 회합종이 (2G $d_{Ce}$ $V_{o}$ )인지 (G $e_{Ce}$ $V_{o}$ ) 인지는 명확하게 알려져 있지 않다. 본 연구에서는 회합분포가 전기전도도에 미치는 영향을 연구하기 위해 결함의 회합종과 분포가 다른 3가지 경우에 대해서 시뮬레이션을 행하였다. 분자동력학법을 이용하여 다양한 온도와 다른 회합분포의 경우에 대해 산소 확산계수가 계산되어졌으며, 계산된 산소 확산계수는 실험적으로 결정된 bulk 전도도로부터 얻어진 산소 확산계수와 비교되어졌다. 그 결과 (2G $d_{Ce}$ $V_{o}$ )와 (G $e_{Ce}$ $V_{o}$ ) 회합이 공존하며 이들이 통계학적으로 이항 분포를 가지는 경우가 실험적으로 보고된 값과 가장 일치하는 결과를 얻을 수 있었다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 춘계학술발표대회
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• pp.37.2-37.2
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• 2011

반도체공정에서 Photo-lithography는 특정 광원을 사용하여 구현하고자 하는 패턴을 기판상에 형성하는 기술이다. 이러한 Photo-lithography 공정에서는 패턴이 형성되어 있는 마스크가 핵심적인 역할을 하며 반도체소자의 전체적인 성능을 결정한다. 이에 따라 Photo-lithography용 마스크에 사용되는 Blank 마스크는 Defect의 최소화 및 우수한 평탄도 등의 조건들이 요구되고 있다. 이러한 Blank 마스크 재료로 광원을 효율적으로 투과시키는 성질이 우수하고 다른 재료에 비해 열팽창계수가 작은 석영기판이 사용되고 있다. 석영 기반의 마스크는 UV Lithography에서 주로 사용되고 있으며 그 밖에 UV-NIL (Nano Imrpint Lithography), EUVL (Extreme Ultra Violet Lithography) 등에도 이용되고 있다. 석영기판을 가공하여 Blank 마스크로 제작하기 위해 석영기판의 Lapping/Polishing 등이 핵심기술이며 현재 일본에서 전량 수입에 의존하고 있어, 이에 대한 연구의 필요성이 절실한 상황이다. 본 연구에서는 Blank 마스크제작을 위한 석영기판의 Polishing 공정에 사용되는 Ceria Slurry의 특성 연구 및 이에 따른 연마평가를 실시하였으며 첨가제의 조건에 따른 pH/Viscosity/Stability 등의 물리적인 특성을 관찰하여 석영기판 Polishing에 효율적인 Ceria slurry의 최적조건을 도출했다. 또한, 조건에 따른 Slurry의 정확한 분석을 위해 Zeta Potential Analyzer를 이용하여 연마입자의 크기 및 Zeta Potential에 대한 평가를 실시한 후 연마제와 석영기판의 Interaction force를 측정하였다. 상기 실험에 의해 얻어진 최적화된 연마 공정 조건하에서 Ceria slurry를 사용하여 연마평가를 실시함으로써 Removal Rate/Roughness 등의 결과를 관찰하였다. 본 연구를 통해 반도체 photo mask 제작을 위한 Ceria slurry의 주요특성을 파악하고 석영기판의 Polishing에 효율적인 조건을 도출함으로써 Lithography 마스크를 효율적으로 제작할 수 있을 것으로 예상된다.