• Proceedings of the Korean Magnestics Society Conference
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• 2010.06a
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• pp.79-79
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• 2010

Semimetallic bismuth (Bi) has been extensively investigated over the last decade since it exhibits very intriguing transport properties due to their highly anisotropic Fermi surface, low carrier concentration, long carrier mean free path l, and small effective carrier mass $m^*$. In particular, the great interest in Bi nanowires lies in the development of nanowire fabrication methods and the opportunity for exploring novel low-dimensional phenomena as well as practical application such as thermoelectricity[1]. In this work, we introduce a self-assembled interconnection of nanostructures produced by an on-film formation of nanowires (OFF-ON) method in order to form a highly ohmic Bi nanobridge. A Bi thin film was first deposited on a thermally oxidized Si (100) substrate at a rate of $40\;{\AA}/s$ by radio frequency (RF) sputtering at 300 K. The sputter system was kept in an ultra high vacuum (UHV) of $10^{-6}$ Torr before deposition, and sputtering was performed under an Ar gas pressure of 2m Torr for 180s. For the lateral growth of Bi nanowires, we sputtered a thin Cr (or $SiO_2$) layer on top of the Bi film. The Bi thin films were subsequently put into a custom-made vacuum furnace for thermal annealing to grow Bi nanowires by the OFF-ON method. After thermal annealing, the Bi nanowires cannot be pushed out from the topside of the Bi films due to the Cr (or $SiO_2$) layer. Instead, Bi nanowires grow laterally as a mean s of releasing the compressive stress. We fabricated a self-assembled Bi nanobridge (d=192 nm) device in-situ using OFF-ON through annealing at $250^{\circ}C$ for 10hours. From I-V measurements taken on the Bi nanobridge device, contacts to the nanobridge were found highly ohmic. The quality of the Bi nanobridge was also proved by the high MR of 123% obtained from transverse MR measurements. These results manifest the possibility of self-assembled nanowire interconnection between various nanostructures for a variety of applications and provide a simple device fabrication method to investigate transport properties on nanowires without complex patterning and etching processes.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.433-433
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• 2012

As the requirement in patterning geometry continuously shrinks down, the termination of etch process at the exact time became crucial for the success in nano patterning technology. By virtue of real-time optical emission spectroscopy (OES), etch end point detection (EPD) technique continuously develops; however, it also faced with difficulty in low open ratio etching, typically in self aligned contact (SAC) and one cylinder contact (OCS), because of very small amount of optical emission from by-product gas species in the bulk plasma glow discharge. In developing etching process, one may observe that coupon test is being performed. It consumes costs and time for preparing the patterned sample wafers every test in priority, so the coupon wafer test instead of the whole patterned wafer is beneficial for testing and developing etch process condition. We also can observe that etch open area is varied with the number of coupons on a dummy wafer. However, this can be a misleading in OES study. If the coupon wafer test are monitored using OES, we can conjecture the endpoint by experienced method, but considering by data, the materials for residual area by being etched open area are needed to consider. In this research, we compare and analysis the OES data for coupon wafer test results for monitoring about the conditions that the areas except the patterns on the coupon wafers for real-time process monitoring. In this research, we compared two cases, first one is etching the coupon wafers attached on the carrier wafer that is covered by the photoresist, and other case is etching the coupon wafers on the chuck. For comparing the emission intensity, we chose the four chemical species (SiF2, N2, CO, CN), and for comparing the etched profile, measured by scanning electron microscope (SEM). In addition, we adopted the Dynamic Time Warping (DTW) algorithm for analyzing the chose OES data patterns, and analysis the covariance and coefficient for statistical method. After the result, coupon wafers are over-etched for without carrier wafer groups, while with carrier wafer groups are under-etched. And the CN emission intensity has significant difference compare with OES raw data. Based on these results, it necessary to reasonable analysis of the OES data to adopt the pre-data processing and algorithms, and the result will influence the reliability for relation of coupon wafer test and whole wafer test.

• Korean Journal of Materials Research
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• v.9 no.11
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• pp.1129-1136
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• 1999

TIN films were prepared on Si(100) substrate by ICP-CVD(inductive1y coupled plasma enhanced chemical vapor deposition) using TEMAT(tetrakis ethylmethamido titanium : Ti$[\textrm{N}\textrm{(CH)}_{3}\textrm{C}_{2}\textrm{H}_{5}]_{4}$) precursor at various deposition conditions. Phase, microstructure, and the electrical properties of TIN films were characterized by x-ray diffraction (XRD), x-ray photoelectron spectroscopy (XPS), high resolution transmission electron microscopy (HRTEM) and electrical measurements. Polycrystalline TiN films with B1 structure were grown at temperatures over $200^{\circ}C$. Preferentially oriented along TiN(111) films were obtained at temperatures over $300^{\circ}C$ with the flow rates of 10, 5, and 5 sccm for TEMAT, $\textrm{N}_{2}$ and Ar gas. The TiN/Si(100) interface was flat and no chemical reaction between TIN and $\textrm{SiO}_2$ was found. The resistivity, carrier concentration and the carrier mobility for the TiN sample prepared at $500^{\circ}C$ are 21 $\mu\Omega$cm, 9.5$\times\textrm{10}^{18}\textrm{cm}^{-3}$ and $462.6\textrm{cm}^{2}$/Vs, respectively.

• Elastomers and Composites
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• v.35 no.1
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• pp.63-70
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• 2000

Zinc plated steel tire cords were subjected to RF plasma etching of argon, followed by plasma polymerization coating of acetylene or butadiene in order to enhance adhesion to rubber compounds. Plasma polymerization was carried out under optimized conditions of 10 W, 30 sec, 30 mTorr for acetylene and butadiene gas, while plasma etching was performed at 90W, 10min and 30mTorr. The adhesion of tire cords was evaluated via Tire Cords Adhesion Test (TCAT) and the failure surfaces of the tested samples were analyzed by SEM. Polymer coating by plasma polymerization was also characterized by FT-IR, Alpha-Step and dynamic contact angle analyzer in order to elucidate the adhesion mechanism.

• Journal of Korean Society of Environmental Engineers
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• v.34 no.8
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• pp.541-548
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• 2012

The objective of this study was to investigate emission characteristics of odorous compounds from the pneumatic waste collection plants (namely, A and B sites). The air samples were collected from each site, at a carrier gas inside the plant and an exhaust gas, to analyze complex odor and 22 odorous compounds. Ammonia, sulfur compounds, and acetaldehyde were the critical odorous components generated in the plants studied. Characteristics of odor at exhaust outlet varied according to the type of odor control engineering. In the analysis of the odor contribution degree of odor components based on odor threshold, site A shows that the odor contribution of dimethyl sulfide was found to be 26%, acetaldehyde 18%, and methyl mercaptan 14%. For site B, methyl mercaptan was 56% and both hydrogen sulfide and dimethyl sulfide were 15%.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.308-309
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• 2016

Reducing surface recombination is a critical factor for high efficiency silicon solar cells. The passivation process is for reducing dangling bonds which are carrier. Tunnel oxide layer is one of main issues to achieve a good passivation between silicon wafer and emitter layer. Many research use wet-chemical oxidation or thermally grown which the highest conversion efficiencies have been reported so far. In this study, we deposit ultra-thin tunnel oxide layer by PECVD (Plasma Enhanced Chemical Vapor Deposition) using $N_2O$ plasma. Both side deposit tunnel oxide layer in different RF-power and phosphorus doped a-Si:H layer. After deposit, samples are annealed at $850^{\circ}C$ for 1 hour in $N_2$ gas atmosphere. After annealing, samples are measured lifetime and implied Voc (iVoc) by QSSPC (Quasi-Steady-State Photo Conductance). After measure, samples are annealed at $400^{\circ}C$ for 30 minute in $Ar/H_2$ gas atmosphere and then measure again lifetime and implied VOC. The lifetime is increase after all process also implied VOC. The highest results are lifetime $762{\mu}s$, implied Voc 733 mV at RF-power 200 W. The results of C-V measurement shows that Dit is increase when RF-power increase. Using this optimized tunnel oxide layer is attributed to increase iVoc. As a consequence, the cell efficiency is increased such as tunnel mechanism based solar cell application.

• Journal of Sensor Science and Technology
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• v.29 no.2
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• pp.128-132
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• 2020

Total organic carbon (TOC) analysis equipment, which was previously used to prevent eutrophication in advance, is heavy, bulky, and expensive; therefore, so it is difficult to be carried and has been used as an experimental unit. In this study, a through-carbon analysis chip that integrates pretreatment through photocatalytic oxidation and carbon dioxide measurement using a pH indicator was investigated. Both the total carbon - inorganic carbon method and the nonpurgeable organic carbon (NPOC) measurement method require an acidification part for injecting an acid solution for inorganic carbon measurement and removal, an oxidation part for total carbon or NPOC oxidation and a measurement part for Carbon dioxide (CO₂) measurement. Among them, the measurement of oxidation and CO₂ requires physical technology. The proposed TOC analysis chip decomposed into CO₂ as a result of the oxidizing of organic carbon using a photocatalyst, and the pH indicator that was changed by the generated CO₂ was optically measured. Although the area of the sample of the oxidation part and the pH indicator of the measurement part were distinguished in an enclosed space, CO₂ was quantified by producing an oxidation part and a measurement part that shared the same air in one chip. The proposed TOC analysis chip is less expensive and smaller, cost and size are disadvantages of existing organic carbon analysis equipment, because it does not require a separate carrier gas to transport the CO₂ gas in the oxidation part to the measurement part.

• Journal of Navigation and Port Research
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• v.30 no.1 s.107
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• pp.17-22
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• 2006

Recently, the demand for LNG(Liquefied Natural Gas) increases in our country and all over the world as well as building order for LNGC Because LNG is very dangerous cargo, the special know-how and attention for cargo handling to prevent an accident is required and big demand for deck officers in future is expected Thus, more specific and systematic education and training program by means of investigating the status of national LNGC officer's education and training. To accomplish this, IMO regulation and LNGC education program for Korea Institute of Maritime and Fisheries Technology, national shipping companies and Japanese T company were analyzed.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.23 no.11
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• pp.1379-1389
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• 1999

A new technique for control of size and shape of flame-made particles is Introduced. The characteristic sintering time can be controlled Independently of collision time by heating the particles with irradiation of laser because the sintering time strongly depends on temperature. A coflow oxy-hydrogen diffusion flame burner was used for $SiCl_4$ conversion to silica particle. Nanometer sized aggregates irradiated by a high power CW $CO_2$ laser beam were rapidly heated up to high temperatures and then were sintered to approach volume-equivalent spheres. The sphere collides much slower than the aggregate, which results in reduction of sizes of particles maintaining spherical shape. Light scattering of Ar ion laser and TEM observation using a local sampling device were used to confirm the above effects. When the $CO_2$ laser was irradiated at low position from the burner surface, particle generation due to gas absorption of laser beam occurred and thus scattering intensity increased with $CO_2$ laser power. At high irradiation position, scattering intensity decreased with $CO_2$ laser power and TEM image showed a clear mark of evaporation and recondensation of particles for high $CO_2$ laser power. When the laser was irradiated between the above two positions where small aggregates exist, average size of spherical particles obviously decreased to 58% of those without $CO_2$ laser irradiation with the spherical shape. Even for increased carrier gas flow rate by a factor of three, TEM photograph also revealed considerable reduction of particle size.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.315-315
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• 2013

We report the electronic structure modification in the swift heavy ion (SHI) irradiated N-doped ZnO thin films prepared by RF sputtering from ZnO target in different ratio of Ar/$N_2$ gas mixture using highly pure $N_2$ gas. The different N-ZnO thin lms were then irradiated with 120 MeV Ag ion beam with different doses ranging from $1{\times}10^{11}$ to $5{\times}10^{12}$ ions/$cm^2$ and characterized by XRD and near edge X-ray absorption ne structure (NEXAFS) at N and O K-edges. The NEXAFS measurements provide direct evidence of O 2p and Zn 3d orbital hybridization and also the bonding of N ions with Zn and O ions. The minimum value of resistivity of $790{\Omega}cm$, a Hall mobility of $22cm^2V^-1s^-1$ and the carrier concentration of $3.6{\times}10^{14}cm^{-3}$ were yielded at 75% $N_2$. X-ray diffraction (XRD) measurements revealed that N-doped ZnO films had the preferential orientation of (002) plane for all samples, while crystallinity start decreasing at 32.5% $N_2$. The average crystallite size varies from 5.7 to 8.2 nm for 75% and then decreases to 7.8 nm for 80% $Ar:N_2$ ratio.