• Title/Summary/Keyword: candidate bonding point

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The First Stage of Developing the Adolescent Friendship Social Capital Scale

  • Xu, Leilei
    • Child Studies in Asia-Pacific Contexts
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    • v.2 no.1
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    • pp.29-43
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    • 2012
  • The purpose of the study was to generate the candidate items for the Adolescent Friendship Social Capital Scale. Both inductive and deductive approaches were used to generate the scale items. Halpern's conceptual map of social capital served as the theoretical basis of this scale, and guided the development of items. Semi-structured interviews with adolescents in Sydney, Melbourne and Beijing generated the initial pool of scale items. Twenty-six items were generated for the Adolescent Friendship Social Capital Scale. The items are organised in four theoretical constructs: Bonding Networks, Bridging Norms, Bridging Sanctions, and Linking Networks. Each item is a short statement followed by a five-point Likert scale anchored by 1= "Strongly disagree" and 5= "Strongly agree". The scale has several advantages over previous measures of adolescent friendship networks and friendship social capital. The scale has a strong and clear theoretical structure, the scale items demonstrate initial construct and content validity, and the format of the scale enables the collection of continuous data. However, in order to ensure the validity and reliability of the scale, another two stages of research need to be conducted in the future: scale development and scale evaluation.

Heuristic Algorithm for Facility Layout Design with Fixed Input and Output Points (입력점과 출력점이 고정된 설비배치설계를 위한 휴리스틱 알고리즘)

  • Jeong, Dong-Hwa;Seo, Yoon-Ho
    • IE interfaces
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    • v.20 no.2
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    • pp.121-132
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    • 2007
  • The facility layout problem (FLP) involves the positioning of facilities within a given workplace in order to minimize the material flow distance between facilities. In this paper, we focus on the FLP in which the each facility has a rectangular shape and an input and output points. We develop a heuristic algorithm in which the facilities are arranged according to the layout algorithm using center of gravity and then simulated annealing algorithm is applied to improve the solution. A comparison of the computational results with exiting algorithms shows that the proposed algorithm provides better solutions in reasonable range of computational time.

Brazing of Aluminium Nitride(AlN) to Copper with Ag-based Active Filler Metals (은(Ag)계 활성금속을 사용한 질화 알미늄(AlN)과 Cu의 브레이징)

  • Huh, D.;Kim, D.H.;Chun, B.S.
    • Journal of Welding and Joining
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    • v.13 no.3
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    • pp.134-146
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    • 1995
  • Aluminium nitride(AlN) is currently under investigation as potential candidate for replacing alumium oxide(Al$_{2}$ $O_{3}$) as a substrate material for for electronic circuit packaging. Brazing of aluminium nitride(AlN) to Cu with Ag base active alloy containing Ti has been investigated in vacuum. Binary Ag$_{98}$ $Ti_{2}$(AT) and ternary At-1wt.%Al(ATA), AT-1wt.%Ni(ATN), AT-1wt.% Mn(ATM) alloys showed good wettability to AlN and led to the development of strong bond between brate alloy and AlN ceramic. The reaction between AlN and the melted brazing alloys resulted in the formation of continuous TiN layers at the AlN side iterface. This reaction layer was found to increase by increase by increasing brazing time and temperature for all filler metals. The bond strength, measured by 4-point bend test, was increased with bonding temperature and showed maximum value and then decreased with temperature. It might be concluded that optimum thickness of the reaction layer was existed for maximum bond strength. The joint brazed at 900.deg.C for 1800sec using binary AT alloy fractured at the maximum load of 35kgf which is the highest value measured in this work. The failure of this joint was initiated at the interface between AlN and TiN layer and then proceeded alternately through the interior of the reaction layer and AlN ceramic itself.

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