• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.251-254
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• 2001

This paper describes an efficiency improvement of buried contact solar cell (BSCS) with a structure of MgF$_2$/CeO$_2$/Ag/Cu/Ni grid/n$^{+}$ emitter/p-type Si base/p$^{+}$/Al. Theoretical and experimental investigations were performed on a double layer antireflection (DLAR) coating of MgF$_2$/CeO$_2$. We investigated CeO$_2$ films as an AR layer because they have a proper refractive index of 2.46 and demonstrate the same lattice constant as Si substrate. An optimized DLAR coating shewed a reflectance as low as 2.04 % in the wavelengths ranged from 0.4 ${\mu}{\textrm}{m}$ to 1.1 ${\mu}{\textrm}{m}$. BCSC cell efficiency was improved from 16.2 % without any AR coating to 19.9 % by employing DLAR coatings. Further details on MgF$_2$/CeO$_2$ DLAR coatings on the BCSC cells are presented in this paper.per.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.6 no.3
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• pp.424-430
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• 1996

The present processing sequence for solar cells is very elaborate and ads to the cost of the fabricated cells. This processing cost, which accounts for about 30% of the total cost, can be reduced if the many high temperature sequences can be reduced without significantly reducing the cells energy conversion efficiency. By using the spin-on glasses (SOG) in conjunction with the conventional tube furnace (CTF) or rapid thermal annealer (RTA), the many high temperature process can be reduced to only one. In order to achieve efficiencies similar to the standard high temperature sequences using the solid or liquid sources, some basic characterization of the groove diffusion is necessary to ascertain the its suitability. This paper describes the work done in diffusing the buried contact grooves using the phosphorus SOG.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.33-37
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• 2003

The new textured surface epitaxial base(TSEB) cell as a high efficiency Si solar cell was fabricated and its eletro-optical characteristics were investigated. The fabricated device showed the open circuit voltage of 0.62 V, the short circuit current of 40 mA, the fill factor of 0.7, and the efficiency of 16% under the incident light of AM-1 100 mW/$cm^2$. The TSEB cell proposed in this paper has the structural superiority in the fabrication of high efficiency solar cell due to the carrier drift transport in the optical absorption region and the formation of back surface field by $P^-/P^+$ epitaxial base, and the low emitter series resistance by insertion of $n^+$ buried contact.

• Steel and Composite Structures
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• v.26 no.1
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• pp.55-66
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• 2018

In this paper, the response of an underground fibreglass reinforced plastic (FRP) composite pipe system subjected to realistic loading scenarios that may be experienced by an actual buried pipeline is investigated. The model replicates an arbitrary site with a length of buried pipeline, passing through a $90^{\circ}$ bend and into a valve pit. Various loading conditions, which include effects of pipe pressurization, differences in response between stainless steel and fibreglass composite pipes and severe loss of bed-soil support are studied. In addition to pipe response, the resulting soil stresses and ground settlement are also analysed. Furthermore, the locations of potential leakage and burst have also been identified by evaluating the contact pressures at the joints and by comparing stresses to the pipe hoop and axial failure strengths.

• Archives of Plastic Surgery
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• v.36 no.5
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• pp.660-662
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• 2009

Purpose: There are several modalities to reattach the amputated auricle. Microvascular replantation can achieve the best outcome, but technically difficult. Conventional composite graft is technically easy, but uniformly unsuccessful. Our successful experience of reattachment using postauricular subcutaneous pocket is presented. Methods: The amputated tissue was placed in its anatomical position with buried sutures. The amputated part is dermabraded to remove the epidermis and outer layer of dermis(Fig. 1, Center, left). Postauricular skin flap was then raised and the reattached dermabraded ear was buried beneath the flap(Fig. 1, Center, right). Two weeks after the original surgery, the buried ear was removed from its pocket (Fig. 1, Below, left). Results: The ear was reepithelialized spontaneously in 7 days. At 3 months, the reattached ear has satisfactory appearance without contour deformity(Fig. 1, Below, right). Conclusion: This technique provides increase in contact surface between the amputated segment and the surrounding tissues which supply blood, serum, oxygen and nutrients, maximizing the probability of "take". Minimally injured dermis can be healed from spontaneous reepithelialization and provides minimal contour deformity. We have used this non-microsurgical technique with very satisfying outcome.

• Journal of the Korean Geotechnical Society
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• v.15 no.3
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• pp.83-97
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• 1999

This paper presents the results of a parametric study on the interaction between buried pipes and surface load using the finite element method of analysis. A series of laboratory model tests were also performed in order to validate the adopted finite element model and to capture essential features of the physical behavior of buried pipes subjected to surface load. In the parametric study, a wide range of boundary conditions were analyzed with emphasis on the response of the buried pipes to surface load. The results of analysis such as contact stress distribution at the soil/pipe interface and axial thrust of the pipe were thoroughly analyzed, and a database on the response of buried pipe under surface load was established for future development of a semi-empirical design/analysis method. The results indicated that the degree of interaction between buried pipes and surface load significantly varies with the vertical and lateral location of pipe with respect to surface load, and that the current design method, which does not consider soil-structure interaction, cannot correctly capture the pipe response to surface loading. Furthermore, based on the results of analysis, a semi-empirical equation was suggested, which estimates the maximum pipe thrust due to surface load for flexible buried pipes.

• 한국태양에너지학회:학술대회논문집
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• 2009.04a
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• pp.235-240
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• 2009

Crystlline silicon solar cells markets are increasing at rapid pace. now, crystlline silicon solar cells markets screen-printing solar cell is occupying. screen-printing solar cells manufacturing process are very quick, there is a strong point which is a low cost. but silicon and metal contact, uses Ag & Al pates. because of, high contact resistance, high series resistance and sintering inside process the electric conductivity decreases with 1/3. and In pastes ingredients uses Ag where $80{\sim}90%$ is metal of high cost. because of low cost solar cells descriptions is difficult. therefore BCSC(Buried Contact Solar Cell) is developed. and uses light-induced plating, ln-line galvanization developed equipments. Ni/Cu matel contact solar cells researches. in Germany Fraunhofer ISE. In order to manufacture high-efficiency solar cells, metal selections are important. metal materials get in metal resistance does small, to be electric conductivity does highly. efficiency must raise an increase with rise of the curve factor where the contact resistance of the silicon substrate and is caused by few with decrement of series resistance. Ni metal materials the price is cheap, Ti comes similar resistance. Cu and Ag has the electric conductivity which is similar. and Cu price is cheap. In this paper, Ni/Cu/Ag metal contact cell with screen printing manufactured, silicon metal contact comparison and analysis.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.55-60
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• 2012

In order to develop electroless-plated Nickel Phosphate (Ni-P) as a contact material for high efficient low-cost silicon solar cells, we evaluated the effect of ambient thermal annealing on the degradation behavior of interfacial adhesion energy between electroless-plated Ni-P and silicon solar cell wafers by applying 4-point bending test method. Measured interfacial adhesion energies decreased from 14.83 to 10.83 J/$m^2$ after annealing at 300 and $600^{\circ}C$, respectively. The X-ray photoelectron spectroscopy analysis suggested that the bonding interface was degraded by environmental residual oxygen, in which the oxidation inhibit the stable formation of Ni silicide phase between electroless-plated Ni-P and silicon interface.

• Proceedings of the KIEE Conference
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• 2002.11a
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• pp.251-253
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• 2002

We have fabricated a novel Vertical Trench Hall-Effect Device sensitive to the magnetic field parallel to the sensor chip surface for non-contact angular position sensing applications. The Vertical Trench Hall-Effect Device is built on SOI wafer which is produced by silicon direct bonding technology using bulk micromachining, where buried $SiO_2$ layer and surround trench define active device volume. Sensitivity up to 150 V/AT is measured.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.6 no.3
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• pp.399-405
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• 1996

The present buried contact (BC) solar cell research at SAIT includes the development of a processing sequence suitable for production of the single sided (SS) BC solar cells. This paper presents some results for large area ($45cm^{2}$) SSBC cells fabricated on FZ and CZ silicon substrates. Cell efficiencies in excess of 18% fabricated on FZ, p-type, 0.5 ohm-cm, and over 16% on CZ p-type, 10~20 ohm-cm, wafers have been demonstrated. Both the FZ and CZ wafers were chemically textured. These results are preliminary and the exploration of double sided (DS) sequence, which is the future BC structure would lead to over 17% and 20% efficiency cells on CZ and FZ substrates respectively. The cost of solar cells can be reduced further if the many high temperature steps can be reduced to only one. This would be very advantageous to very poor quality substrates such as the CZ grown wafers.