• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.469-474
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• 2002

Laser and hot air reflow soldering of PBGA solder ball was investigated. Experimental results showed that surface quality and shear strength of solder bumps reflowed by laser was superior than the solder bumps reflowed by hot air, and the microstructure inside the solder bumps reflowed by laser was much finer. Analysis on interfacial reaction showed that eutectic solder reacted with Au/Ni/Cu pad shortly after the solder was melted. Interface of solder bump reflowed by laser consists of a continuous AuSn$_4$ layer and remnant Au element. Needle-like AuSn$_4$ grew sidewise from interface, and then spread out to the entire interface region. A thin layer of Ni$_3$Sn$_4$ intermetallic compound was found at the interface of solder bump reflowed by hot air, AuSn$_4$ particles distributed inside the whole solder bump randomly. It is the combination effect of the continuous AuSn$_4$ layer and finer eutectic microstructure inside the solder bump reflowed by laser that resulted in higher shear strength.

• 한국유체기계학회 논문집
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• 제5권1호
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• pp.55-61
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• 2002

The feasibility of an oil-free, motor-driven, two-stage centrifugal compressor supported by air bump bearings is investigated. This centrifugal compressor is driven by a 75 kW motor at an operating speed of 39,000 RPM, and a pressure ratio of the compressor is set up to 4. The analysis is performed by using bearing equilibrium position, heaving stillness, Campbell diagram, unbalance response, and stability. It is demonstrated in this paper that air bump bearings can be adopted well to an oil-free, motor-driven, centrifugal compressor. Specially, Cu-coated bump bearings have enough damping force to reduce a synchronous unbalance for rigid modes of the two-stage compressor. Futhermore, this concept may be applied to the flexible rotor system such as high speed turbomachinery with a super critical speed.

• 동력기계공학회지
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• 제13권5호
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• pp.40-45
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• 2009

This article deals with the transient analysis using multi-flexible body dynamics of a trailer vehicle, which is passing a bump on the flat road. In order to investigate the transient dynamic behavior of the trailer, we developed an equivalent finite element model for the trailer and a vehicle dynamic model for the truck using multi-body dynamics. The driving condition considered here is set as the trailer vehicle passes a bump on the flat road in 7km/h. And we investigate the time histories of vertical load and deflections on connecting points between the trailer and truck during the vehicle passes a bump. Due to the dynamic load resulted from the driving condition, additional stress concentrations are found in the trailer and the suspension connecting points between the trailer and rear axles along with kingpin.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.68-71
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• 2003

The reaction of ultra-small eutectic 58Bl-42Sn solder bump with Au/Ni/Ti and Au/Cu/Ti UBMs during reflow was studied. The eutectic Bi-Sn solder bumps of $46{\mu}m$ diameter were fabricated by using the evaporation method and were reflowed using the rapid thermal annealing system. The intermetallic compound was characterized using a SEM, an EDS, and an XRD. The $(Cu_xAu_{1-x})_6Sn_5$ compounds formed at the interface between Bi-Sn solder and Au/Cu/Ti UBM. On the other hand, in the Bi-Sn solder bump on Au/Ni/Ti UBM, the faceted and rectangular intermetallic compounds were observed on the solder bump surface and inside the solder bump as well as at the UBM interface. These intermetallic compounds were Identified as $(Au_{l-x-y}Bi_xNi_y)Sn_2$ phase.

• 전자공학회논문지D
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• 제34D권7호
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• pp.30-36
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• 1997

Bump bonded piezoesistive silicon accelerometer was fabricated by the porous silicon micromachining and th eprocess technique of integrated circuit. The output voltage of the accelerometer fabricated on (111)-oreiented Si substrates with n/n$^{+}$n triple layers showed good linear characteristic of less than 1%. The measured sensitivity and the resonant frequency was about 743 .mu.V/g and 2.04 kHz, respectively. And the transverse sensitivity of 5.2% was measured from the accelerometer. Also, to investigate an influence on the output characteristics of the sensor due to bump bonding, the values of the piezoresistors were measured through thermal-cycling test in the temperature variation form -50 to 120.deg. C. Then, there was 0.014% resistance changes about 3.61 k.ohm., so sthe output charcteristics of the sensor was less affected by bump bonding.g.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2003년도 학술대회지
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• pp.267-272
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• 2003

This paper presents a performance analysis model of corrugated bump foil bearings. The analyses for not only 1st generation bump foil journal bearings but also bump foil thrust bearings are performed. Static performances such as load capacity, attitude angle, pressure distribution, foil deflection, and film thickness are accurately estimated by using soft elasto-hydrodynamic analysis technique and finite difference numerical method. Also dynamic performances such as stiffness coefficients and damping coefficients are estimated by perturbation method. The analysis technique may be appliable to rotordynamic analysis, stability analysis, and optimized bearing design.

• 한국소음진동공학회논문집
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• 제20권4호
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• pp.381-389
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• 2010

Modern military equipments are often required to be mounted on a truck for their survivability and operation performance. Special units installed on the truck at times experience serious shock vibration caused by obstacles of road and/or uncommon road shape. It is then essential to analyze the travel performance of truck-mounted special units for their survivability and performance. In this paper, shock responses of the equipments subjected to bump passing and wash board road are experimentally obtained and also analyzed via FEM. Modified bump configuration and road profile considering the interface with tire are suggested. Analytical results considering this modification show good agreement with test results.

• 한국방송∙미디어공학회:학술대회논문집
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• 한국방송∙미디어공학회 2020년도 하계학술대회
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• pp.266-268
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• 2020

본 논문에서는 dense point cloud 의 평면영역에서 발생하는 bump 을 줄이기 위한 방법을 제시한다. 이상적인 point cloud 의 평면영역에서 점의 위치의 차이가 균일하다는 특성을 이용하여 점의 위치를 재구성하는 방식을 제시한다. 또한 더 작은 개수의 점으로 물체를 나타낼 수 있으며, 더 작은 잡음이 나타나는 sparse point cloud 의 성질을 고려하여 dense point cloud 의 점의 개수 또한 감소시킨다. 따라서 제안하는 알고리즘을 적용하여 dense point cloud 의 잡음을 감소시키면 평면영역의 bump 감소 및 점 개수의 감소를 통한 데이터 전송 시 더 작은 크기로 보낼 수 있다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.257-258
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• 2013

• 한국재료학회:학술대회논문집
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• 한국재료학회 1995년도 추계 학술발표 강연 및 논문개요집
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• pp.82-82
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• 1995