• Journal of Adhesion and Interface
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• v.3 no.1
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• pp.37-42
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• 2002

Adhesives are becoming increasingly accepted for advanced engineering/boding tasks. Therefore the understanding of the basic principles and the benefits of elastic bonding and structural bonding respectively is of utmost importance. Structural bonding means adhesive performance in load-bearing environments. Furthermore. the time to achieve handling strength has an impact on the economics of an assembly line. The paper gives briefly a summary about the fundamentals of elastic bonding and discusses different adhesive systems in the context of handling strength. Hereby the focus lies on the Warm Melt Technology, and its potential is compared to standard adhesives (l-part, 2-part and Booster Technology, a special 2-C system). Examples illustrate their economical benefits. Main Points : ${\bullet}$ The basic principles and benefits of elastic bonding ${\bullet}$ Warm-melt Technology in comparison with standard adhesives ${\bullet}$ Handling strength an economic issue ${\bullet}$ Combination with Booster-Technology, a special 2-C PUR system ${\bullet}$ Presentation of real world applications Learning Objectives: ${\bullet}$ Fundamentals of elastic bonding ${\bullet}$ Warm-melt Technology: correlation between chain length and cristallinity ${\bullet}$ Handling strength and curing speed of various systems in comparison ${\bullet}$ Real world applications illustrate the potential of the Warm-melt Technology.

• Journal of Sensor Science and Technology
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• v.29 no.5
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• pp.354-359
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• 2020

The high vacuum hermetic sealing technique ensures excellent performance of MEMS resonators. For the high vacuum hermetic sealing, the customization of anodic bonding equipment was conducted for the glass/Si/glass triple-stack anodic bonding process. Figure 1 presents the schematic of the MEMS resonator with triple-stack high-vacuum anodic bonding. The anodic bonding process for vacuum sealing was performed with the chamber pressure lower than 5 × 10^-6 mbar, the piston pressure of 5 kN, and the applied voltage was 1 kV. The process temperature during anodic bonding was 400 ℃. To maintain the vacuum condition of the glass cavity, a getter material, such as a titanium thin film, was deposited. The getter materials was active at the 400 ℃ during the anodic bonding process. To read out the electrical signals from the Si resonator, a vertical feed-through was applied by using through glass via (TGV) which is formed by sandblasting technique of cap glass wafer. The aluminum electrodes was conformally deposited on the via-hole structure of cap glass. The TGV process provides reliable electrical interconnection between Si resonator and aluminum electrodes on the cap glass without leakage or electrical disconnection through the TGV. The fabricated MEMS resonator with proposed vacuum packaging using three-layer anodic bonding process has resonance frequency and quality factor of about 16 kHz and more than 40,000, respectively.

• Journal of the Korea institute for structural maintenance and inspection
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• v.15 no.2
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• pp.107-115
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• 2011

This research studies the behavior of the FRP-concrete interface subjected to two environmental substances. Frist is to investigate the behavior by the application of different bonding materials at the interface between FRP and concrete, second is to understand a long-term performance at the interface by Freeze-thaw actions. The parameters considered in this research are the maximum bonding strength and the effective bonding length at the FRP-concrete interface. In the first experimental phase, three types of specimens are fabricated and tested considering the number of applied bonding materials and the Freeze-thaw tests are performed to evaluate the behavior of the interface in the cycle range of 0 to 300 cycles. Finally, it is known that there is a 5~7% difference of the effective bonding length between applied bonding materials and the values for the maximum stress and the effective length under Freeze-thaw action are varied randomly as the freeze-thaw cycle is increased even though initial reduction of their capacities are occurred.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.22 no.1
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• pp.801-807
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• 2021

In various industrial fields and infrastructure based on electronic components, such as communication equipment, transportation, computer networks, and military equipment, the need for electromagnetic pulse shielding has increased. Two methods for applying electromagnetic pulse shielding are effective. The first is construction using shielding materials, such as shielding concrete, shielding doors, and shielding windows. The other is coating shielding paints on non-shielding structures. Electromagnetic pulse shielding paints are made using conductive materials, such as carbon nanotubes, graphite, carbon black, and carbon fiber. In this paint, electromagnetic pulse shielding performance is added to the commonly used water-based paint. In this study, the shielding effectiveness and bonding performance of paints using conductive graphite and carbon black as shielding materials were evaluated to develop electromagnetic pulse shielding inorganic paints. The shielding effectiveness and bonding performance were evaluated by applying six mixtures composed of different kinds and amounts of shielding material. The mixture of conductive graphite and carbon black at a weight ratio of 1:0.2 was the most effective in shielding as 33.6 dB. Furthermore, the mixture produced using conductive graphite only showed the highest bonding performance of 1.06 MPa.

• Information Systems Review
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• v.19 no.4
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• pp.43-62
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• 2017

This study investigates the effect of bonding and bridging social capital on the technological innovation performance in the Pangyo Techno Valley. In particular, we consider the information technology (IT) usage in industrial cluster as an antecedent of social capital. IT instigates the intra and extra communication and information sharing between employees, thereby promoting the formation of a network of various members. Results show that the IT usage factor positively affects both bridging and bonding social capital, but an evident difference exists among the effects of social capital on the technological innovation performance. In case of Pangyo industrial cluster, bridging social capital exerts significant effect on the technological innovation performance, whereas bonding social capital shows insignificance. Bridging social capital is composed of the interactions of various networks. Bonding social capital is based on the strong tie from trust and internal cooperation. Results are related with the characteristics of Pangyo Techno Valley, where various IT ventures need active communication and information sharing with other organizations for technological innovation performance.

• Composites Research
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• v.24 no.6
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• pp.56-63
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• 2011

The objective of this study is to investigate appropriate bonding methods of solar cells in order to apply solar cells, which have been receiving particular attention as a renewable energy due to fossil energy depletion and environment issues, to composite structures. Back-contact solar cells with approximately 24.2% energy conversion efficiency were used in this study. Since silicon-based solar cells are mechanically fragile, the secondary-bonding methods using adhesive were examined in this study. The experiment was conducted with three kinds of bonding materials such as EVA film, Resin film and elastic adhesive. The performance of solar cells for three types of adhesives under mechanical loading on test specimens is conducted. In addition, the measuring equipment was designed to evaluate the performance of the solar cells under mechanical loading in real time and the fracture characteristics depending on bonding materials were evaluated. The reason decreasing solar cells efficiency were analyzed and considered by Fractography. The results show that the solar cell performance is largely affected by bonding techniques. Moreover, the bonding method using elastic adhesive shows best solar cell efficiency.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.2
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• pp.227-233
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• 2014

This study investigates the vibration characteristics of a wire-bonding piezoelectric transducer and ultrasonic horn for high-speed and precise welding. A ring-type piezoelectric stack actuator is excited at 136 kHz to vibrate a conical-type horn and capillary system. The nodal lines and amplification ratio of the ultrasonic horn are obtained using a theoretical analysis and FEM simulation. The vibration modes and frequencies close to the driving frequency are identified to evaluate the bonding performance of the current wire-bonder system. The FEM and experimental results show that the current wire-bonder system uses the bending mode of 136 kHz as the principal motion for bonding and that the transverse vibration of the capillary causes the bonding failure. Because the major longitudinal mode exists at 119 kHz, it is recommended that the design of the current wire-bonding system be modified to use the major longitudinal mode at the excitation frequency and to minimize the transverse vibration of capillary in order to improve the bonding performance.

• Journal of the Korea institute for structural maintenance and inspection
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• v.20 no.1
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• pp.25-32
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• 2016

The purpose of this study is to evaluate the performance on the compressive bonding shear strength of ultra-high strength steel fiber reinforced cementitous composites(UHSCC). As a result of compressive bonding shear strength through Direct shear test, It was found that the specimen($150{\times}150{\times}150mm$) of NC(Normal concrete) + NC showed similar compressive bonding shear strength at whole experimental level. On the other hand, the specimen of UHSCC + UHSCC showed decrease of compressive bonding shear strength from after 30 minutes of the retarded placement than 0 minute. As a result of analyzing failure mode of bonding interface, It was found that the specimen of NC + NC showed mixed failure at whole experimental level. In case of the specimen of UHSCC + UHSCC, it showed interface failure from the specimen that are 30 minutes, 60 minutes and 90 minutes of delay of concrete placing. As a result of analyzing XRD test in terms of the placement interface on the specimen of NC and UHSCC, relatively much amount of $SiO_2$ was detected from the specimen of UHSCC than that of NC. It is judged that the most of main components of coating film shown in the specimen of UHSCC is $SiO_2$. In conclusion, it is judged that UHSCC which is made from after 30 minutes of delay of concrete placing is unable to be used as structural member because of deterioration of bonding performance. From later study, it is judged that the improvement of bonding performance from the part of cold joint occurrence is necessary through the interface preparation method.

• Journal of Korea Society of Digital Industry and Information Management
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• v.9 no.3
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• pp.155-171
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• 2013

This research paper is focused on a theoretical study of the influences the structural factors and social capital within an industrial cluster have on innovative performance, and expanding the understanding of the influence through positive analyses based on public surveys. The study adopts a concept of social capital that can formulate a social relationship, and maintains that the social capital either works as a mediator for structural factors or independently exerts strong influences on innovative performance. In the research, the social capital is divided into two categories, bonding social capital and bridging social capital, and their influences are analyzed separately. The result of the analyses shows that unlike the traditional perception based on Korea's unique culture, the influence of bridging social capital is stronger than that of bonding social capital. It is also found that the structural factors exert influence by themselves on the contrary the previous study, simultaneously they still have influence upon innovative performance through bridging social capital calculated via the elements such as secondary relationships, network activity support and organizational openness.