• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.499-502
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• 2005

A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal bar. Bonding mechanism between Cu and Ti was assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion for pressure welding was developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. Finite element analyses for extrusion of Cu-Ti bimetal bars were performed for various process conditions. The deformation history at the contact surface was traced and the proposed new bonding criterion was applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the extrusion of Cu-Ti bimetal bar is suggested.

• 소성∙가공
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• 제7권1호
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• pp.66-71
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• 1998

The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the bonding conditions as well as the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding the normal pressure and the contact surface expansion are selected as process parameters governing the bonding conditions, in this study the critical normal pressure required for the local extrusion-the protrusion of virgin surfaces by the surface expansion at the interface-is obtained using a slip line method and is then used as a criteron for the bonding. A rigid plastic finite element method is used to analyze the steady state extrusion process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-cent to interface surface. The contact surface area ration and the normal pressure along the interface are calculated and compared to the critical normal pressure to check bonding. It is found that the model predictions are generally in good agreement with the experimental observations. The compar-isons of the extrusion pressure and interface profile by the finite element with those by experi-ments are also given.

• 한국재료학회지
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• 제14권11호
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• pp.780-785
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• 2004

The degradation mechanism of soft magnetic properties of $Fe-Hf-N/Cr/SiO_2$ thin films reacted with a bonding glass was investigated. When $Fe-Hf-N/Cr/SiO_2$ films were annealed under $600^{\circ}C$ without the bonding glass, the compositions and the soft magnetic properties of Fe-Hf-N layers were not changed. However, after reaction with the bonding glass at $550^{\circ}C$, the soft magnetic properties of the film were degraded. At $600^{\circ}C$, the saturation magnetization of the reacted film decreased to 13.5 kG, and its coercivity increased to 4 Oe, and its effective permeability decreased to 700. It was founded that O diffused from the glass into the Fe-Hf-N layers during the reaction and generated $HfO_2$ phases. It was considered that the soft magnetic properties of the $Fe-Hf-N/Cr/SiO_2$ films reacted with the bonding glass were primarily degraded by the formation of the Fe-Hf-O-N layer of which the Fe content was below 60 $at\%$, and secondarily degraded by the Fe-Hf-O-N layer above 70 $at\%$.

• 소성∙가공
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• 제18권4호
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• pp.342-346
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• 2009

Forming characteristics for the bundle extrusion of Cu-Ti bimetal wires are investigated, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion for pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1946-1949
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• 1996

We have performed silicon-to-silicon anodic bonding using glass layer deposited by electron beam evaporation. Wafers can be bonded at $135^{\circ}C$ with an applied voltage of $35V_{DC}$, which enables application of this technique to the vacuum packaging of microelectronic devices, because its bonding temperature and voltage are low. From the experimental results, we have found that the evaporated glass layer more than $1\;{\mu}$ m thick was suitable for anodic bonding. The role of sodium ions for anodic bonding was also investigated by theoretical bonding mechanism and experimental inspection.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 추계학술대회 논문집
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• pp.393-397
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• 2005

A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion fur pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• 대한치과보철학회지
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• 제19권1호
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• pp.61-73
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• 1981

The effects of the opaque porcelain firing temperature, the bonding agent and the degassing prior to the opaque firing On the bond strength were investigated by means of the tensile shear stIe$. The diffusional behaviours at the interface of the porcelain and the alloy, and .the microstructures of the ceramic and metal composite were studied for understanding the bonding mechanism. The results obtained in this experiment were summarizd as follow; 1. With no application of bonding agent, the tensile shear strength of the specimen firing at $1840^{\circ}F$ was higher than that of the specimen firing at $1760^{\circ}F$. 2. The highest bond strength was obtained by application of bonding agent without degassing prior to the opaque firing. 3. Application of bonding agent after the degassing showed the lowest bond strength. 4. The greater number of pores were observed at the firing temperature of $1840^{\circ}F$ than that of $1760^{\circ}F$ in the porcelain and the interface respectively.

• 대한금속재료학회지
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• 제47권4호
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• pp.242-247
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• 2009

On the Transient Liquid Phase Bonding (TLPB) phenomenon with the MBF-50 insert metal at narrow gap (under 100), it takes long time for the bonding and the homogenizing. Typically, isothermal solidification is controlled by the diffusion of depressed element of B and Si. However, the amount of B and Si in the MBF-50 filler metal is large. This is reason of the long bonding time. Also, the MBF-50 filler metal did not contained Al and Ti which are ${\gamma}^{\prime}$ phases former. This is reason of the long homogenizing time. From the bonding phenomenon with the MBF-50 insert metal, we search main factors on the bonding mechanism and select several insert-metals for using the wide-gap TLPB. New insert-metals contained Al and Ti which are ${\gamma}^{\prime}$ phases former and decrease the B then the MBF-50. When the new insert-metal was used on the TLPB, the bonding time was decreased about 1/10 times and homogenizing heat treatment was no needed. In spite of the without homogenizing, the volume fraction of ${\gamma}^{\prime}$ phases in the boned interlayer was equal to homogenizing heat treated specimen which was TLPB with the MBF-50. Finally, the new insert metal named WG1 for the wide-gap TLPB is more efficient then the MBF-50 filler metal without decreasing the bonding characteristic.

• 한국정보전자통신기술학회논문지
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• 제11권4호
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• pp.331-339
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• 2018

IEEE 1588은 측정 및 제어 시스템에서 사용되는 네트워크의 정확한 시각 동기 표준(PTP, Precision Time Protocol)이다. Best Master Clock (BMC) 알고리즘은 PTP에서 최적의 마스터-슬레이브 계층을 선택하기 위해 사용한다. 슬레이브가 마스터와의 링크 장애 또는 현재의 시각 동기 에러가 발생하였을 때, BMC는 자동으로 다른 마스터 신호를 수신할 수 있도록 한다. 이때의 슬레이브 클럭은 마스터 신호의 장애 보상 시간 값에 따라 달라진다. 그러나 BMC 알고리즘에서는 마스터 클럭의 장애 발생에 따른 빠른 고장 복구 방안은 전혀 고려하지 않았다. 이에 본 논문에서는 네트워크 본딩 (Bonding) 기술을 적용하여 마스터 클럭의 장애에 따른 빠른 복구 방안을 제시하였다. 본 연구는 리눅스 시스템의 PTP livery 데몬(Ptpd)과 IEEE 1588의 특정 프로파일을 사용하였으며, 본딩 모드를 통해서 제어하도록 하였다. 네트워크 본딩 기술은 둘 이상의 네트워크 인터페이스 신호를 하나의 네트워크 인터페이스에 전송하기 위해 신호를 결합하는 과정에 대한 것으로, 네트워크의 이중화와 성능 향상을 제공한다. 본딩 기술은 만약 하나의 링크에서 장애가 발생하면, 본딩되어 있는 다른 링크를 통해서 즉각적으로 신호 전달이 가능하기에 네트워크의 이중화 또는 부하 분산 등에 사용한다. IEEE 1588만 적용한 것과 대비하여 IEEE 1588 기술과 네트워크 본딩 기술을 결합한 네트워크 복구 기술의 뛰어난 성능을 본 논문을 통하여 증명하였다.

• Composites Research
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• 제33권6호
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• pp.371-376
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• 2020

접착강도는 표면처리 기술을 통해 향상시킬 수 있다. 가장 일반적인 방법은 기계적인 결합력을 향상시킬 수 있는 접착 표면의 변화이다. 본 연구는 접착면의 레이저 표면 처리가 기계적 결합력에 미치는 영향과 탄소섬유 강화 복합재료(CFRP)의 접착 결합에 대해 설명한다. 1064 nm의 레이저를 활용하여 표면 조도를 패턴화했다. 레이저 샷의 수, 패턴의 방향, 길이가 CFRP/CFRP 단일 조인트의 접착력에 미치는 영향을 인장 시험을 통해 조사했다. ASTM D5868에 따른 시험을 수행하였으며, 파단 후 손상된 표면을 분석하여 결합 메커니즘을 결정했다. 접착 강도의 증가를 위해서는 CFRP 표면에 최적화된 레이저 샷의 수와 조도 깊이가 구성되어야 한다. 인장방향에서의 전단응력을 고려할 때, 접착층의 파단 경로를 길어지게 하는 45°의 방향의 조도가 접착강도의 증가를 야기했다. 그러나 레이저에 의한 조도의 길이는 접착 강도에 크게 영향을 주지 못했다. 레이저를 이용한 접착면의 표면처리는 기계적 결합 메커니즘을 확보하고 CFRP 접착 조인트의 접착 강도를 향상시키는 적합한 방법이라는 결론을 도출할 수 있다. 레이저 처리를 이용한 이점을 완전히 이용하기 위해서는 최적화된 레이저 공정 변수에 대한 연구가 반드시 필요하다.