• Computers and Concrete
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• 제7권5호
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• pp.437-453
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• 2010

CFRP has been widely used for strengthening reinforced concrete members in last decade. The strain transfer mechanism from concrete face to CFRP is a key factor for rigidity, ductility, energy dissipation and failure modes of concrete members. For these reasons, determination of the effective CFRP bonding length is the most crucial step to achieve effective and economical strengthening. In this paper, generalizations are made on effective bonding length by increasing the amount of test data. For this purpose, ANSYS software is employed, and an experimentally verified nonlinear finite element model is prepared. Special contact elements are utilized along the concrete-CFRP strip interface for investigating stress distribution, load-displacement behavior, and effective bonding length. Then results are compared with the experimental results. The finite element model found consistent results with the experimental findings.

• 한국세라믹학회지
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• 제20권1호
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• pp.70-78
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• 1983

This paper discusses the application of Si-Borosilicate glass sealing to a new sealing method which utilizes a large electrostatic field to pormote bound formation at relatively low temperature. Bonding mechanism and the effect of bonding time bonding temperature glass thickness and surface roughness on the bond strength were investigated. Application of a de voltage across bonded specimen gradually produced a layer of glass adjacent silicon which was depleted of mobile ions. As a consequence a n increasingly larger fraction of the applied voltage appeared across the depleted region and very large electric field resulted This field accompanyed by large electrostatic force acted as driving force the of strong bond. And stronger bond was formed with increasing bonding time and temperature. A low temperature preoxidation is advantageous for the Si surface having a rougher surface finish that 1 microinch.

• 콘크리트학회논문집
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• 제28권3호
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• pp.329-340
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• 2016

건설 시장에서는 기존의 건물을 철거하거나 보수하는 사례가 늘어나면서 막대한 양의 건설 폐기물이 발생되고 있다. 건설폐기물의 재활용은 자원절약과 환경보전 그리고 건설 산업의 지속적인 발전을 실현하는데 있어서 중요하다. 이에 따라, 폐콘크리트를 파쇄한 후 생산되는 순환 골재의 가치가 환경적, 경제적인 측면에서 대두되고 있다. 순환 골재를 사용한 콘크리트는 일반 골재를 사용한 콘크리트에 비해 성능이 저하한다고 알려져 있고, 성능 저하의 원인은 부착 이질재(시멘트 페이스트 및 모르타르)의 양과 부착 이질재에 내포하는 공극의 양에 따라 좌우된다고 보고되고 있다. 탄산화 메커니즘에 대한 보고에 따르면 탄산화의 진행에 의해 시멘트계 재료의 공극이 충전된다고 알려져 있다. 따라서, 본 연구에서는 순환 골재에 부착한 이질재의 공극 충전에 의한 품질향상을 목표로 하여 탄산화 메커니즘을 기반으로 순환 골재의 부착 이질재 두께에 적합한 최적 탄산화 개질 기간의 추정을 목적으로 한다. 이에 따라, 본 연구에서는 순환 골재의 입도분포에 대한 부착 이질재의 부착율과 부착 두께를 산정하여 부착 이질재를 가정한 모의시험체의 촉진 탄산화 재령에 따른 화학적 정량분석을 통해 재령 경과에 따른 탄산화 깊이를 도출하였다. 또한, 촉진 탄산화 재령과 탄산화 깊이에 대한 상관관계를 바탕으로 부착 이질재 두께에 적합한 순환 골재의 탄산화 개질 추정 기간을 제안하였다.

• 대한치과교정학회:학술대회논문집
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• 대한치과교정학회 2004년도 제37회 학술대회
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• pp.83.3-84
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• 2004

• 대한치과교정학회:학술대회논문집
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• 대한치과교정학회 2004년도 제37회 학술대회
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• pp.34.2-34.2
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• 2004

• 한국재료학회지
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• 제16권2호
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• pp.99-105
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• 2006

This paper reports an improved bonding method using the IPA (isopropyl alcohol) assisted low-temperature bonding process for the PMMA (polymethylmethacrylate) micro CE (capillary electrophoresis) chip. There is a problem about channel deformations during the conventional processes such as thermal bonding and solvent bonding methods. The bonding test using an IPA showed good results without channel deformations over 4 inch PMMA wafer at $60^{\circ}C$ and 1.3 bar for 10 minutes. The mechanism of IPA bonding was attributed to the formation of a small amount of vaporized acetone made from the oxidized IPA which allows to solvent bonding. To verify the usefulness of the IPA assisted low-temperature bonding process, the PMMA micro CE chip which had a $45{\mu}m$ channel height was fabricated by hot embossing process. A functional test of the fabricated CE chip was demonstrated by the separation of fluorescein and dichlorofluorescein. Any leakage of liquids was not observed during the test and the electropherogram result was successfully achieved. An IPA assisted low-temperature bonding process could be an easy and effective way to fabricate the PMMA micro CE chip and would help to increase the yield.

• Journal of Advanced Marine Engineering and Technology
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• 제24권1호
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• pp.59-66
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• 2000

To investigate the optimum brazing condition, variation of bonded structure and mechanical properties of novel brazed pure Al with bonding condition (brazing temperature, time and Si/flux ratio) was studied. A basic study of the bonding mechanism was also examined. The optimum brazing condition was obtained at $590^{\circ}$ for 2 minutes and the bonded structure showed that it is composed of almost entirely eutectic Al-Si with near eutectic composition. At higher brazing temperature $630^{\circ}$, hypoeutectic Al-Si structure was observed in the bonded area and resulted in erosion of base metal. The thickness of eutectic layer formed in optimum brazing temperature increased linearly with the square root of time, showing a general diffusion controlled process. The ultimate tensile strength of bonded joint brazed at an optimum brazing condition was about 60% of base metal and its fracture surface showed a brittle mode.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1997년도 춘계학술대회논문집
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• pp.140-143
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• 1997

The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding, the normal pressure and the contact surface expansion are selected as process parameters governing the bonding condition. The critical pressure required for the bonding at the interface is obtained by solving a "local extrusion" using a slip line meyhod. A viscoplastic finite element method is used to analyze the steady state extrusion process. The boundary profile of bi-metal rod is predicted by tracking a particle path adjacent to interface surface. The variations of contact surface area and the normal pressure along the interface profile are predicted and compared to those by experiments.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1994년도 추계학술대회 논문집
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• pp.206-209
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• 1994

This paper has been researched bondability of electronic devices, such as lead frame and thick film of Ag/Pd on an alumina substrate by different heat sources. To obtain the bonds with high quality, it is very important to control both the thermal distribution of the bonds and it stability, because electronics components is consist of different materials. Therefore, this paper clarifies not only heat mechanism of micro parallel gap resistance bonding method and pulse heat tip bonding method but also investigates selection of heat sources with micro-electronic materials for bonding. Finally, it is realzed fluxless bonding process with filler metal such as plating layers.

• Bulletin of the Korean Chemical Society
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• 제35권8호
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• pp.2443-2447
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• 2014

A kinetic study is reported on nucleophilic substitution reactions of 4-nitrophenyl nicotinate (7) and 4-nitrophenyl isonicotinate (8) with a series of cyclic secondary amines in $H_2O$ containing 20 mol % DMSO at $25.0^{\circ}C$. The Br${\o}$nsted-type plots for the reactions of 7 and 8 are linear with ${\beta}_{nuc}=0.90$ and 0.92, respectively, indicating that the reactions proceed through a stepwise mechanism with expulsion of the leaving group occurring in the rate-determining step. Comparison of the reactivity of 7 and 8 with that of 4-nitrophenyl benzoate (2a) and 4-nitrophenyl picolinate (6) has revealed that their reactivity toward the amines increases in the order 2a < 7 < 8 < 6, although the reactions of these substrates proceed through the same mechanism. Factors that control reactivity and reaction mechanism have been discussed in detail (e.g., inductive and field effects, H-bonding interaction, solvent effect, etc.).