• Journal of the Korean Crystal Growth and Crystal Technology
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• v.27 no.1
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• pp.34-41
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• 2017

In this study, the effect on the zinc nuclei crystallization caused by changes preprocessing of the zinc crystalline glaze preparation has been studied. The mechanism of the nuclei formation in the crystalline glaze and development of the nuclei by studying the preprocessing step was explained. The preprocessing step was improved by altering mixing process of the materials prior to sintering: number of sieving dispersion process and ultra-sonication prove tests with various duration of sonication. According to the result, the sieving and sonication of the starting materials facilitated the interface reactions of $ZnO-SiO_2$ from $680^{\circ}C$ where low temperature willemite is formulated, and altered Si bonding for the easier bonding between Zn-Si. In other words, solely sieving was enough to accelerate the formation of willemite in low temperature. When the particles were distributed evenly by sonication, the willemite formation was even more significant.

• Resources Recycling
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• v.27 no.2
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• pp.3-10
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• 2018

In this paper, Proposed bonding mechanism that can separate sole and upper for recycle and reuse of parts. It was confirmed that the PVC film with better physical properties than the existing parts was inserted between the sole and the upper. It was confirmed that the separation of the desired form can be induced. As a result of checking the performance of the proposed mechanism, it is confirmed that intentional separation is possible and the separated sole and upper can be recycled or reused.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.65-69
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• 2002

An Al film deposited on the Kovar alloy substrate was anodically-bonded to the borosilicate glass, and the bond interfaces was closely investigated by transmission electron microscopy. Al oxide was found to form a layer ~l0 nm thick at the bond interface, and fibrous structure of the same oxide was found to grow epitaxially in the glass from the oxide layer. The fibrous structure grew with the bonding time. The mechanism of the formation of this fibrous structure is proposed on the basis of the migration of Al ions under the electric field. Penetration of Al into glass beyond the interfacial Al oxide was not detected. The comparison of the amount of excess oxygen ions generated in the alkali depletion layer with that incorporated in the Al oxide suggests that the growth of the alkali-ion depletion layer is controlled by the consumption of excess oxygen to form the interfacial Al oxide.

• Journal of Welding and Joining
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• v.15 no.2
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• pp.43-53
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• 1997

The complete joining method for dissimilar press punch materials and its real-time evaluation method is not available at present. Brazing method has been used for joining them, but it is known that the welded joint by the brazing has the lower bonding efficiency and reliability than the diffusion welding. The friction welding with a diffusion mechanism in bonding was applied in this study. This work was carried out to determine the proper friction welding conditions and to analyze mechanical properties of friction welded joints of sintered carbide tool materials (SKNM50 for the blade part of press punch) to alloy steel (SCM440 for the shank part of press punch) using aluminum (A6061 for the interlayer material) as an insert material between the sintered carbide tool materials and the alloy steel. In addition, acoustic emission test was carried out during friction welding to evaluate the weld quality.

• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.131.3-131
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• 2001

A 2-dimensional scanner have been generally used for an office, but 3-dimensional one was seldom used in industry. A footwear bonding process has been operated manually by the skilled operators, but it is needed to be operated automatically. So we developed an automatic outsole profile scanner, which consists of PC, CCD camera, laser beam diode and moving mechanism, to scan automatically the 3-dimensional profile of outsole inner face to be bonded. Here the developed algorithm makes 2D image into 3D outsole profile. This profile will be used enough to bond automatically the outsole to something like leather or clothes.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.177-179
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• 2011

The purpose of this study is to enhance an adhesion between substrate and Diamond-like Carbon (DLC) film. DLC has many outstanding properties such as low friction, high wear resistance and corrosion resistance. However, it is difficult to achieve enough adhesion because of weak bonding between DLC film and the substrate. For improvement adhesion, a layer between DLC film and the substrate was prepared by dual post plasma. DLC film was deposited on nitrided layer by linear ion source. The composed compound layer between substrate and DLC film was investigated by Glow Discharge Spectrometer (GDS) and Scanning Electron Microscope (SEM). The synthesized bonding structure of DLC film was analyzed using a micro raman spectrometer. Mechanical properties were measured by nano-indentation. In order to clarify the mechanism for improvement in adhesive strength, it was observed by scratch test.

• Journal of Sensor Science and Technology
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• v.5 no.1
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• pp.51-56
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• 1996

Structural properties of rf sputtered boron nitride films were studied as a function of deposition parameters such as nitrogen pressure, substrate temperature and substrate bias using X-ray photoelectron spectroscopy and Auger electron spectroscopy. Composition and information on chemical bonding of resultant films was determined by XPS. XPS core level spectra showed that ratio of boron to nitrogen varied from 3.11 to 1.45 with respect to partial nitrogen pressure. Curve fitting of XPS spectra revealed three kinds of bonding mechanism of boron in the films. XPS peak positions of both B 1s and N 1s shifted to higher energy with higher nitrogen pressure as well as increase in substrate bias voltage. AES was used to see possible contamination of films by carbon or oxygen as well.

• Journal of Power System Engineering
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• v.4 no.4
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• pp.54-58
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• 2000

The complete joining method for dissimilar hot die punch materials and its real-time evaluation method are not available at present. Brazing method has been used for joining them, but it is known that the welded joint by the brazing has the lower bonding efficiency and reliability than the diffusion welding. The friction welding with a diffusion mechanism in bonding was applied in this study. So, this work was carried out to determine the optimal friction welding conditions and to analyze mechanical properties of friction welded joints of hot die punch materials (STD61 for the blade part of hot die punch) to alloy steel (SCM440 for the shank part of hot die punch) such as plunger. In addition, acoustic emission test was carried out during friction welding to evaluate the weld quality.

• 전자공학회논문지 IE
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• v.45 no.4
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• pp.42-46
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• 2008

LED's production does Die bonding and Wire bonding on L/F board, and do epoxy dispensing to protect LED Chip and improve brightness. In this paper, we propose and realize a x-y-z axis robot mechanism detecting automatically eopxy's amount being filled, control data of pressure and time by the quantity automatic revision, and epoxy of the schedule amount dispensing.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.173-176
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• 2000

In this paper, we investigated the surface degradation of HTV silicone rubber used for a polymeric insulator by UV irradiation. To study the surface ageing properties by W irradiation, we used the corona discharge charging and contact angle. Therefore, we observed the change of surface charge retention and decrease of surface hydrophobicity. Also, we discussed the chemical change in the surface range using the analytic equipment such as SEM, ATR-FTIR, ESCA. Therefore, it is found that the scissor of characteristic bonding and the reattachment of oxidant bonding was developed by UV rays radiation. As discussing the corona ischarge charging and the change of contact angle, it is found the effect of UV irradiation and the mechanism of chemical reaction