• KSII Transactions on Internet and Information Systems (TIIS)
• /
• 제9권10호
• /
• pp.4034-4053
• /
• 2015

In order to meet various requirements for transmission quality of both primary users (PUs) and secondary users (SUs) in cognitive radio networks, we introduce a channel bonding mechanism for PUs and a channel reservation mechanism for SUs, then we propose a novel spectrum allocation strategy. Taking into account the mistake detection and false alarm due to imperfect channel sensing, we establish a three-dimensional Markov chain to model the stochastic process of the proposed strategy. Using the method of matrix geometric solution, we derive the performance measures in terms of interference rate of PU packets, average delay and throughput of SU packets. Moreover, we investigate the influence of the number of the reserved (resp. licensed) channels on the system performance with numerical experiments. Finally, to optimize the proposed strategy socially, we provide a charging policy for SU packets.

• Journal of Welding and Joining
• /
• 제13권4호
• /
• pp.147-154
• /
• 1995

In order to study the bonding mechanism of Ni/B/Ni transient liquid phase bonding system, width of liquid layers were calculated, where in this system melting point of insert material(B) is higher than bonding temperature and melting point of base metal(Ni). Caclulated values were compared with experimental ones which were measured by bonding Ni/B/Ni system at 1433-1474K under vacuum atmosphere. As results, the width of initial liquid layer of Ni/B/Ni system was calculated as $W_{IL}$ = $W_{o}$[1 + {2.100..rho.$_{S/}$ ( $X_{3}$ + $X_{4}$)..rho.$_{Ni}$ }-.rho.$_{S/}$.rho. Ni/], and it was nearly same with experimental values. Maximum width of liquid layer, width of liquid layer during isothermal solidification and isothermal solidification time were calculated also.o.o.o.

• 대한심미치과학회지
• /
• 제23권2호
• /
• pp.58-69
• /
• 2014

In case of esthetic restorative procedure with zirconia restoration, we have to use resin cement because of not only just for retention but also esthetic reason. In such a clinical situation, we have to consider two bonding interfaces, one is tooth surface to resin cement and the other is zirconia surface to resin cement. There is well established bonding protocol between tooth surface to resin cement, but bonding protocol of zirconia surface to resin cement is still controversial. In scientific point of view, there are two mechanism for bonding of zirconia restoration.. One is mechanical retention and the other is chemical adhesion. However, we have three different options for bonding of zirconia restoration in clinical situation; 1) Tribo-chemical coating with silica and silane coupling agent 2) Zirconia primer with phosphate chemistry 3) Self-adhesive resin cement with phosphate chemistry.

• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제48권9호
• /
• pp.656-661
• /
• 1999

As a fundamental study for FED tubeless packaging, sodalime-sodalime electrostatic bonding was performed by using on the developed bonding mechanism. Thebonding properties of the bonded sodalime-sodalime structure were investigated through SEM and SIMS analyses. Mo-tip FEA was vacuum-packaged by the developed bonding process and the packaged device generated the field emission current.

• 한국펄프종이공학회:학술대회논문집
• /
• 한국펄프종이공학회 2001년도 추계학술발표논문집
• /
• pp.60-66
• /
• 2001

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1999년도 하계학술대회 논문집 G
• /
• pp.3313-3315
• /
• 1999

Si direct bonding(SDB) technology is very attractive for both Si-on-insulator(SOI) electric devices and MEMS applications because of its stress free structure and stability. This paper presents on pre-bonding according to HF pre-treatment conditions in Si wafer direct bonding. The characteristics of bonded sample were measured under different bonding conditions of HF concentration, and applied pressure. The bonding strength was evaluated by tensile strength method. The bonded interface and the void were analyzed by using SEM and IR camera respectively. A bond characteristic on the interface was analyzed by using IT- IR. Si-F bonds on Si surface after HF pre-treatment are replaced by Si-OH during a DI water rinse. Consequently, hydrophobic wafer was bonded by hydrogen bonding of Si $OH{\cdots}(HOH{\cdots}HOH{\cdots}HOH){\cdots}OH-Si$. The bond strength depends on the HF pre-treatment condition before pre- bonding (Min:$2.4kgf/crn^2{\sim}Max:14.9kgf/crn^2$)

• 한국분무공학회지
• /
• 제13권4호
• /
• pp.193-199
• /
• 2008

Spray coating is a versatile surface modification technology in which coating is built-up based on the successive deposition of micron-scaled particles. Depending on the coating materials, the coatings can meet the required mechanical properties, corrosion resistance, and other properties of base materials. Spraying processes are mainly classified into thermal and kinetic spraying according to their bonding mechanism and deposition characteristics. Specifically, thermal spraying process can be further classified into many categories based on the design and mechanism of the process, such as frame spraying, arc spraying, atmospheric plasma spraying (APS), and high velocity oxygen-fuel (HVOF) spraying, etc. Kinetic spraying or cold gas dynamic spraying is a newly emerging coating technique which is low-temperature and high-pressure coating process. In this paper, overall view of thermal and kinetic spray coating technologies is discussed in terms of fundamentals and industrial applications. The technological characteristics and bonding mechanism of each process are introduced. Deposition behavior and properties of technologically remarkable materials are reviewed. Furthermore, industrial applications of spray coating technology and its potentials are prospected.

• Nuclear Engineering and Technology
• /
• 제34권3호
• /
• pp.202-210
• /
• 2002

The details of the electronic structure of the perfect crystal provides a critically important foundation for understanding the various defect states in uranium dioxide. In order to understand the local defect and impurity mechanism, the calculation of electronic structure of UO$_2$ in the one-electron approximation was carried out, using a semi-empirical tight-binding formalism(LCAO) with and without f-orbitals. The energy band, local and total density of states for both spin states are calculated from the spectral representation of Green’s function. The bonding mechanism in Perfect lattice of UO$_2$ is discussed based upon the calculations of band structure, local and total density of states.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2003년도 추계학술대회논문집
• /
• pp.225-228
• /
• 2003

This paper is concerned with pressure welding, which has been known as a main bonding mechanism for the cold and warm clad forming. Bonding characteristics of pressure welding between the copper and aluminum plates are experimentally investigated. Experiments are performed at the cold and warm temperature range with the variation of important factors such as magnitude of pressure, surface roughness of Cu and Al plates, and pressure holding time. It could be concluded that the bonding criterion might be given as a function of bonding pressure and surface roughness for the cold and warm temperature ranges.

• 대한치과교정학회지
• /
• 제19권2호
• /
• pp.155-163
• /
• 1989

Indirect bonding is done by placing the brackets on a model in the laboratory and using a template or tray to transfer the laboratory positioning to the teeth. The advantages of this technique are 1. decreased chair time 2. less patient discomfort 3. accuracy of a attachment placement 4. good adaptation of attachment to tooth contour 5. occlusal relationship of brackets and opposing teeth can be checked The disadvantages of the technique are 1. complex laboratory procedure 2. sometimes difficult on very short clinical crowns 3. teeth with crowns, large buccal restoration will not bond 4. may not be fitted close, if poor adaptation 5. likely to be disturbed setting Several indirect bonding techniques have proved reliable in clinical practice. However, they differ in the way the brackets are attached temporarily to the model, the type of transfer tray or other mechanism used, the adhesive or sealant employed, whether segmented or full bonding used, and the way the transfer is removed so as not to exert excessive force on a still maturing bond.