• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2009년도 추계학술대회 논문집
• /
• pp.717-718
• /
• 2009

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
• /
• pp.270-274
• /
• 2002

We have developed a new COG technique using flip chip solder joining technology for excellent resolution and high quality LCD panels. Using the eutectic Bi-Sn and the eutectic In-Ag solder bumps of 50-80 ${\mu}m$ pitch sizes, a ultrafine interconnection between IC and glass substrate was successfully made at or below $160^{\circ}C$. The contact resistance and reliability of Bi-Sn solder joint showed the superiority over the conventional ACF bonding.

• 한국주조공학회지
• /
• 제12권4호
• /
• pp.317-325
• /
• 1992

Diamond is the hardest material known to humans, also possesses the highest thermal conductivity and a very low thermal expansion coefficient. Therefore, these properties of diamond make them logical choices for many difficult grinding application. Bonding material is a very important factor to performance of a grinding wheel. Grinding glass constitutes one of the major application areas of diamond grinding wheels, and Cu-Sn tin bronze matrix is widely used as a metal bond of diamond wheel in grinding glass but these studies are rarely reported. The bronze test pieces excluding diamond are sintered by the method of hot sizing respectively at $600^{\circ}C$, $650^{\circ}C$, $700^{\circ}C$, with a composition(Cu-10wt%Sn) on ${\alpha}$ phase and two compositions(Cu-20wt%Sn and Cu-23wt%Sn) on ${\alpha}+{\beta}$ phase. The rupture strength of Cu-10wt%Sn is highest. The bronze bonded diamond wheels are manufactured by same conditions as the bronze test pieces. The results of grinding ratio of wheels are highest in case of Cu-10wt%Sn bonded wheel sintered at $650^{\circ}C$ and grinding power is highest in same composition sintered at $700^{\circ}C$.

• Current Photovoltaic Research
• /
• 제3권2호
• /
• pp.61-64
• /
• 2015

In solar industry, numerous researchers reported about cold spray method among various electrode formation technic, but there are no known a bonding mechanism of metal powder. In this study, a cross-section of copper electrode formed by cold spray method was observed and heterogeneous phase between silicon substrate and copper electrode was analyzed using morphology observation technic. SEM and TEM analysis were performed to analyze a crystallinity and distribution shape of heterogeneous copper phase. Molecular dynamics simulation was performed to calculate glass transition temperature of copper metal. In the result, amorphous copper phase was observed near interface between silicon substrate and metal electrode. The results of the molecular dynamics simulation show that an amorphous copper phase could be formed at a temperature below the melting point of copper because cold spraying resulted in a lower glass transition temperature.

• 마이크로전자및패키징학회지
• /
• 제8권2호
• /
• pp.1-7
• /
• 2001

저열팽창성 금속인 Kovar표면을 유리와 접합하기에 적합한 spinel을 주상으로 하는 균일한 산화막을 형성할 수 있도록 $N_2/H_2$에 $H_2O$가 첨가된 분위기에서의 산화 거동에 대하여 조사하였다. Kovar 산화는 확산에 의해 지배되는 공정이며, 이때 산화 활성화 에너지는 31.61 kacl/mol 이었다. $600^{\circ}C$에서 열처리한 결과 spinel을 주상으로 하는 0.5 $mu extrm{m}$ 이하의 연속적이고 균일한 외부 산화막을 얻을 수 있었다. TEM 분석 결과 격자 상수가 7.9 $\AA$인 spinel 임을 확인할 수 있었다. 그러므로, 가습된 $N_2/H_2$분위기에서 산화한 Kovar는 유리와 접합에 적용 가능할 것으로 판단된다.

• 한국포장학회지
• /
• 제5권2호
• /
• pp.1-8
• /
• 1999

The state of compatability of poly(vinyl alcohol)(PVA) and methyl cellulose(MC), prepared by an aqueous solution casting, were investigated over the entire compositions by dynamical mechanical analyzer(DMA) and differential scanning calorimetry(DSC). The glass transition temperatures of the blends, estimated by DMA, indicate that the blends of PVA and MC showed a definite degree of partial miscibility by showing two glass transition temperatures below 80 wt % MC contents in the blends and one glass transition temperature above 80 wt % of MC contents. The DSC results show a depression of melting point and crystallization temperature of PVA in the blends containing more than 80 wt % MC. This indicates that a considerable compatibility in the blend above 80 wt % MC contents may be attribute to the presence of interaction of hydroxyl groups of component polymers through hydrogen bonding. The DMA study of the effect of plasticizer on the polymers showed that water was a good plasticizer for PVA and PEG400 for MC. The addition of water and PEG400 in the blends showed a synergic plasticizing effect on these blends, which resulted in the large extent of the improvement of the compatibility. The elongation of PVA, MC and blonds was found to increase with addition of PEG400 in the blends, but the tensile strength to decrease with addition of plasticizer.

• Journal of Welding and Joining
• /
• 제19권3호
• /
• pp.305-310
• /
• 2001

UBM-coated Si-wafer was fluxlessly soldered with glass substrate in $N_2$ atmosphere using plasma cleaning method. The bulk Sn-37wt.%Pb solder was rolled to the sheet of $100\mu\textrm{m}$ thickness in order to bond a solder disk by fluxless 1st reflow process. The oxide layer on the solder surface was analysed by AES(Auger Electron Spectroscopy). Through rolling, the oxide layer on the solder surface became thin, and it was possible to bond a solder disk on the Si-wafer with fluxless process in $N_2$ gas. The Si-wafer with a solder disk was plasma-cleaned in order to remove oxide layer formed during 1st reflow and soldered to glass by 2nd reflow process without flux in $N_2$ atmosphere. The thickness of oxide layer decreased with increasing plasma power and cleaning time. The optimum plasma cleaning condition for soldering was 500W 12min. The joint was sound and the thicknesses of intermetallic compounds were less than $1\mu\textrm{m}$.

• 한국세라믹학회지
• /
• 제23권4호
• /
• pp.27-34
• /
• 1986

In the present study an attempt was made to synthesize $10TiO_2$.$90SiO_2$ glass by Sol-Gel process. Tetra-ethyl-ortho-silane and titanium-iso-propoxide were used as precursors. As the mutual solvent ethanol and iso-propanol were used. TEOS was partially hydrolyzed with one-fold mole of $H_2O$ prior to the reaction with titanium-iso-propoxide to control the difference of hydrolysis rate of the two metal alkoxides. At gelling temperature higher than 6$0^{\circ}C$ it was difficult to obtain monolithic gels. At such a low temperature as 85$0^{\circ}C$ clear amorphous gel derived glass with Si-O-Ti bonding was obtained.

• 한국재료학회지
• /
• 제12권7호
• /
• pp.545-549
• /
• 2002

Potassium-Calcium-Phosphate glasses in range $XCaO\cdot(50-X)K_2O$ \cdot $50P_2$$O^{5}$were investigated. Glass transition temperature(Tg) of prepared glasses were below $520^{\circ}C$, thermal expansion coefficient from $270.3$\times$10^{7}$ to $604.5$\times$10^{7}$/$^{\circ}C$. The structure of XCaO.(50-X)$K_2$O\cdot$50P_2$$O^{5}$ glasses were examined by FT-IR spectroscopy indirectly. As CaO was increased, Ts, Tg, P-O-P bonding strength and chemical durability were increased. Glass surface change was observed with increasing dissolution time using bulk specimen, weight loss and pH change were measured as function of the dissolution time.

• 대한건축학회논문집:구조계
• /
• 제35권6호
• /
• pp.121-128
• /
• 2019

There is a big move to build zero-energy buildings in the form of passive houses that reduce energy waste worldwide. Korea has set a goal of reducing its greenhouse gas emissions by 37% by 2030 through the activation of green buildings, such as strengthening the energy levels of new buildings and improving the energy efficiency of existing buildings. The use of insulation with high insulation performance is one of the key technologies to realize this, and vacuum insulation is the next generation insulation that blocks the energy flow of the building. In this study, we measured the bonding structure of dry and wet processing glass fiber core materials and compared the insulation performance of vacuum insulation panel. In addition, the insulation performance of vacuum insulation panel was measured according to the thickness of the laminated core. It can be confirmed that the lamination structure of the core and the lamination thickness are important factors for the heat insulating performance of the vacuum insulating panel.