• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.21-30
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• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.3
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• pp.265-271
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• 2008

TCP(Tape Carrier Package), COG (Chip On Glass), COF(Chip On Film) are three methods for connecting LDI(LCD Driver IC) with LCD panels. Especially COF is growing its portion of market place because of low cost and fine pitch correspondence. But COF has a problem of the lead broken failure in LCD module process and the usage of customer. During PCB (Printed Circuit Board) bonding process, the mismatch of the coefficient of thermal expansion between PCB and D-IC makes stress-concentration in COF lead, and also D-IC bending process during module assembly process makes the level of stress in COF lead higher. As an affecting factors of lead-broken failure, the effects of SR(Solder Resister) coating on the COF lead, surface roughness and grain size of COF lead, PI(Polyimide) film thickness, lead width and the ACF(Anisotropic Conductive Film) overlap were studied, The optimization of these affecting manufacturing processes and materials were suggested and verified to prevent the lead-broken failure.

• Polymer(Korea)
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• v.26 no.6
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• pp.737-744
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• 2002

Thermodynamic miscibility of the binary blends composed of semi-crystalline poly (butylene 2,6-naphthalate) (PBN) and amorphous poly (4-vinylphenol) (PVPh) was investigated using differential scanning calorimetry (DSC) and Fourier transform infrared (FTIR) spectroscopy. DSC scan results showed that there was a single glass transition temperature (T$\_$g/) for each blend. Crystalline melting temperature (T$\_$m/) depression of the PBN in the blends was also observed with the increase of PVPh content. Both results of the single T$\_$g/ and the depression of T$\_$m/ for the PBN/PVPh blends indicate that the blends are thermodynamically miscible at the molecular level. FTIR spectroscopic analysis confirmed that strong intermolecular hydrogen bonding interactions between the ester carbonyl groups of the PBN and the hydroxyl groups of the PVPh are occurred.

• Korean Journal of Materials Research
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• v.20 no.1
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• pp.1-6
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• 2010

Geopolymer materials are attractive as inorganic binders due to their superior mechanical and eco-friendly properties. In the current study, geopolymer-based cement was prepared using aluminosilicate minerals from fly-ash with KOH as an alkaline-activator and $Na_2SiO_3$ as liquid glass. Then, calcium carbonate powder from a clam shell was mixed with the geopolymer and the mixture was coated on a concrete surface to provide points of attachment for environmental organisms to grow on the geopolymers. We investigated the effect of the shell powder grain size on the microstructure and bonding property of the geopolymers. A homogeneous geopolymer layer coated well on the concrete surface via aluminosilicate bonding, but the adhesiveness of the shell powder on the geopolymer cement was dependent on the grain size of the shell powder. Superior adhesive characteristics were shown in the shell powder of large grain size due to the deep penetration into the geopolymer by their large weight. This kind of coating can be applied to the adhesiveness of eco-materials on the surface of seaside or riverside blocks.

• Proceedings of the KIEE Conference
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• 2007.11a
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• pp.150-151
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• 2007

We present an one-axis parallel-plate type of bulk micromachined torsional micromirror array with single crystalline silicon (SCS) fabricated on the glass substrate. Structurally, bottom electrodes (amophous silicon) in this mirror are DRIEed along the aluminum mirror patterns on SCS, which are self-aligned with mirror plates. Tracing the history of the micromirror study, we found that few papers have been published on research for uniform driving voltages based upon the tilting direction. If there is a slight misalignment during anodic bonding between top (mirror plate) and bottom electrodes, the non-uniformity of driving voltage will be led depending on two different tilting direction. This paper discusses how much the pull-in voltages can be different due to misalignment between two electrodes. Moreover, We achieve uniform pull-in voltage regardless of misalignments in photolithography and anodic-bonding between two individual layers.

• Journal of the Korean Ceramic Society
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• v.39 no.3
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• pp.265-271
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• 2002

Density, water resistance, Raman and infrared spectroscopy were used to investigate the change of structural characteristics with the composition of phosphate galss samples made by melting method. The structural abnormality of the density and water resistance were rapidly increased and shown near the 60mol% of $P_2O_5$. This result could be explained by the structural changes owing to the strong shrinkage of glass network by the coordination of DBO(Double-Bonded Oxygen) around $Mg^{2+}$ cations. In addition, it seems that the DBOs coordinating $Mg^{2+}$ cations lose its characteristics of double bonding and resonate with other NBOs(Non-Bonding Oxygen).

• Journal of Korean Ophthalmic Optics Society
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• v.5 no.2
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• pp.193-199
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• 2000

The a-C : H films have been grown on the glass substrate by PECVD method, where plasma was generated with a 60 Hz line power source. The growth rate of films is found to be dependent of the partial pressure of $C_2H_2$. This growth rate is a little higher than that in which $CH_4$ instead of $C_2H_2$ is used. The transmittance is also much higher(95%). The optical energy gap of films is in the range of 1.4~1.8eV depending on the partial pressure of $C_2H_2$. However, this energy gap, which is 1.8eV, is found to be independent of the partial pressure of $C_2H_2$ for the thick films above $2000{\AA}$. The carbonization is checked from peak intensities of D ($sp^3$) and G($sp^2$) peaks in Roman spectra. The hydronization and C-H bonding status in films can also be determined from FTIR results. Both the bonding strength of C-H and the ratio of $sp^3$ to $sp^2$ in bonding are found to be slightly dependent of partial pressure of $C_2H_2$. Judging from above results, we can conclude that the best value for partial pressure of $C_2H_2$ in growing process of thick films is about 13.8%.

• Korean Journal of Materials Research
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• v.18 no.11
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• pp.617-622
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• 2008

In this study, the additivity factors of compositions to density and glass transition point ($T_g$) in a $xLi_2O-(1-x)[(1-y)TeO_2-yZnO]$ (0$T_g$ was discussed. As a method for predicting the relation between glass structure and ionic conductivity, density was measured by the Archimedes method. The glass transition point was analyzed to predict the relation between ionic conductivity and the bonding energy between alkali ions and non-bridge oxygen (NBO). The relation equations showing the additivity factor of each composition to the two properties are as follows: Density(g/$cm^3$) = $2.441x_1\;＋\;5.559x_2\;＋\;4.863x_3\;T_g(^{\circ}C)$ = $319x_1\;＋\;247x_2\;＋\;609x_3\;－\;1950x_1x_3$ ($x_1$ : fraction of $Li_2O$, $x_2$ : fraction of $TeO_2$, $x_3$ : fraction of ZnO) The density decreased as $Li_2O$ content increased. This was attributed to change of the $TeO_2$ structure. From this structural result, the electric conductivity of the glass samples was predicted following the ionic conduction mechanism. Finally, it is expected that electric conductivity will increase as the activation energy for ion movement decreases.

• The korean journal of orthodontics
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• v.25 no.5 s.52
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• pp.605-611
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• 1995

The purpose of this study was to evaluate effects of time on shear bond strengths of a light-cured glass ionomer cement and chemically cured resin cement to enamel, and to observe the failure patterns of bracket bondings. Shear bond strength of a light-cured glass ionomer cement were compared with that of a resin cement. Metal brackets were bonded on the extracted human bicuspids. Specimens were subjected to a shear load(in an Instron machine) after storage at room temperature for 5 and 15 minutes; after storage in distilled water at $37^{\circ}C$ for 1 or 35 days. The deboned specimens were measured In respect of adhesive remnant index. The data were evaluated and tested by ANOVA, Duncan's multiple range test, and t-test, and those results were as follows. 1. The shear bond strength of light-cured glass ionomer cement is higher than that of resin cement at 5 and 15 minutes. 2. The shear bond strengths of both light-cured glass ionomer cement and resin cement increase with time. There was no significant difference in those of both 1 day group and 35 day group 3. Light-cured glass ionomer cement is suitable as orthodontic bracket adhesives

• The korean journal of orthodontics
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• v.35 no.6 s.113
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• pp.433-442
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• 2005

The purpose of this study was to evaluate and compare the shear bond strength of orthodontic brackets depending on the variety of adhesives and whether saliva exists, by using self-etching primer (SEP). Groups were divided according to the type of adhesive into resin adhesive (Trans bond XT) and resin-modified glass ionomer cement (Fuji Ortho LC). One group of resin adhesive used XT primer after etching with 37% phosphoric acid, and the other group used self-etching primer. One group of resin-modified glass ionomer cement only used etching for bonding, and the other group used SEP. Each of the groups were also classified by whether saliva was contaminated or not. and then the shear bond strength was measured. The results showed that when using resin adhesive, the shear bond strength of SEP was lower than the XT primer. In the resin-modified glass ionomer cement groups, the shear bond strength which depends on the priming method, did not have a meaningful difference statistically When saliva was contaminated, the group which used SEP, regardless of the adhesive variety, had a greater shear bond strength than the normal priming group. From these results, SEP showed a shear bond strength that is possible to be used clinically, regardless of the adhesive variety. It can especially be clinically useful to use SEP to bond brackets even on tooth surfaces contaminated with saliva, because it offers the appropriate bonding strength as well as shorter treatment time and easy application.