• Title/Summary/Keyword: bonding glass

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Role of Added Metal Oxide in the Adherence Mechanism of Low Melting Glass to Several Metal Seals (저융점유리와 각종금속과의 봉착기구에 있어서 금속산화물의 역할)

  • 정창주
    • Journal of the Korean Ceramic Society
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    • v.11 no.1
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    • pp.3-9
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    • 1974
  • The role of added metal oxide in the adherence mechanism of low melting glass to several metal plates such as oxygen free high conducting copper, low carbon steel, chrominum galvanized on copper, and stainless steel was investigated. The metal oxide which added to glass were cupric oxide, ferric oxide, chromic oxide, and stainless steel oxide. The glass to that various metla oxide were added, sealed with several metal plates in the electric furnace at $650^{\circ}C$ for 5 minutes. The results as follows; 1) The interfacial reaction was promoted and strong chemical bonding with glass and metals by which the surface energy was decreased showed excellent sealing by addition of metal oxide. 2) When the interfacial reaction of glass and metals was promoted by addition of metal oxide found out that various adhernece mechanism were related to the sealing. 3) When the amount of metal oxide addition was 3-5% the excellent sealing was achieved.

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Improvement of Reliability of COG Bonding Using In, Sn Bumps and NCA (NCA 물성에 따른 극미세 피치 COG (Chip on Glass) In, Sn 접합부의 신뢰성 특성평가)

  • Chung Seung-Min;Kim Young-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.13 no.2 s.39
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    • pp.21-26
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    • 2006
  • We developed a bonding at low temperature using fine pitch Sn and In bumps, and studied the reliability of the fine pitch In-Sn solder joints. The $30{\mu}m$ pitch Sn and In bumps were joined together at $120^{\circ}C$. A non conductive adhesive (NCA) was applied during solder joining. Thermal cycling test ($0^{\circ}C-100^{\circ}C$, 2 cycles/h) of up to 2000 cycles was carried out to evaluate the reliability of the solder joints. The bondability was evaluated by measuring the contact resistance (Rc) of the joints through the four point probe method. As the content of filler increased, the reliability improved in the solder joints during thermal cycling test because the contact resistance increased little. The filler redistributed the stress and strains from the thermal shock over the entire joint area.

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Penetration Mechanisms of Ceramic Composite Armor Made of Alumina/GFRP

  • Jung, Woo-Kyun;Lee, Hee-Sub;Jung, Jae-Won;Ahn, Sung-Hoon;Lee, Woo-Il;Kim, Hee-Jae;Kwon, Jeong-Won
    • International Journal of Precision Engineering and Manufacturing
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    • v.8 no.4
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    • pp.38-44
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    • 2007
  • Combat vehicles are frequently maneuvered in battlefields when the lives of combatants are being threatened. These vehicles are important elements that influence the consequences of a battle. Their armor must be lightweight and provide excellent protection to ensure successful operations. Ceramic composite armor has recently been developed by many countries to fulfill these requirements. We reviewed previous research to determine an effective armor design, and then fabricated a composite armor structure using $Al_2O_3$ and glass fiber-reinforced polymer. Specimens were manufactured under controlled conditions using different backing plate thicknesses and bonding methods for the ceramic layer and the backing plate. The penetration of an armor-piercing bullet was evaluated from ballistic protection tests. The bonding method between the ceramic layer and the fiber-reinforced polymer influenced the ballistic protection performance. A bonding layer using rubber provided the best protection.

THE BOND STRENGTHS OF RESIN BONDING SYSTEM BASED ON GLASS IONOMER CEMENTS (글라스아이오노머계열의 상아질접착제의 결합강도에 대한 비교연구)

  • Kim, Kyung-Deok;Jeong, Tae-Sung;Kim, Shin
    • Journal of the korean academy of Pediatric Dentistry
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    • v.25 no.2
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    • pp.304-311
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    • 1998
  • The purpose of this study was to evaluate the shear bond strength on dentin of bonding agents based on glass ionomer cements, and to establish the appropriate method of bonding which has biological safety and decrease the pulpal damage. Fuji Bond LC, Advance, All Bond 2 and Scotchbond Multipurpose were applicated on occlusal dentin layer in acrylic resin block. Each group was composed of 10 specimens and the shear bond strenth between dentin layer and composite resin was measured with the Universal Testing Machine and analyzed. The result were as follows: 1. When using ANOVA and Scheffe' s multiple range test, there were not statistical differences among the four group. (P < 0.05) 2. The shear bond strength was high in the order of C, D, A. B and bond strength of group B showed relatively lower. 3. In digital image processing, there were not significant differences on morphology of failure surface.

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THE EFFECT OF SURFACE TREATMENT ON FRACTURE STRENGTH OF DENTAL CERAMICS (도재와 상아질의 표면 처리가 도재의 파절 강도에 미치는 영향)

  • Lee, Shin-Won;Lee, Sun-Hyung;Yang, Jae-Ho;Chung, Hun-Young
    • The Journal of Korean Academy of Prosthodontics
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    • v.37 no.5
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    • pp.658-671
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    • 1999
  • The major influencing factors on the strength of all-ceramic crowns are types of dental ceramics, fabrication techniques, methods of abutment preparation and cementation modes of all-ceramic restorations. Zinc phosphate cement and glass-ionomer cement were used as an early lot-ing media for all-ceramic crowns. Recently many studies have reported that resin cements have more advantages in increasing the fracture strength of restorations comparing with zincphosphate cement and glass-ionomer cement. The purpose of this study is to investigate the effect of etching, silane treatment, sandblasting and dentin bonding agents on fracture strengths of dental ceramics. 40 flat dentin specimens and 40 ceramic discs of 1.5mm thickness and 8mm diameter were fabricated, and divided into 4 groups according to surface treatments. Surface treatments before cementation were as follows Group I : (ceramic) : HF etching - silane treatment - application of bonding resin (dentin) : application of dentin bonding agent Group II : (ceramic) : sandblasting - application of bonding resin (dentin) : application of dentin bonding agent Group III : (ceramic) : application of bonding resin (dentin) : application of dentin bonding agent Group IV : (ceramic) : HF etching - silane treatment - application of bonding resin (dentin) : no dentin bonding procedure Dentin specimens and ceramic discs were cemented with dual cure resin cement, and went through thermocycling. Compressive stress es were loaded on the centers of ceramic discs with Instron test-ing machine, and fracture strengths resistance for catastrophic fracture were measured The results were as follows. 1. The group I showed the highest fracture resistance. The next was group II And group III, IV followed. 2. There was a significant difference in the mean value of fracture strengths between group I and group III (p<0.05), but no significant differences between group I and group II, and group II and group III (p>0.05). 3. There was a significant difference in the mean value of fracture strengths between group I and group IV (p<0.05).

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Longitudinal Bonding Strength Performance Evaluation of Larch Lumber (낙엽송 소경각재의 종접합 성능평가)

  • Lee, In-Hwan;Pack, Ju-hyun;Song, Da-bin;Hong, Soon-Il
    • Journal of the Korean Wood Science and Technology
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    • v.46 no.1
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    • pp.85-92
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    • 2018
  • In order to use glued built up timber beam as a structural member for post and beam construction, it must be possible to manufacture long-span lumber. In this study, the researchers conducted a performance evaluation for longitudinal bonding of lumber (cross-section $89{\times}120mm$) made from larch. The specimens were prepared in six different forms using the longitudinal bonding method. The bonding strength of these specimens was tested through tensile strength tests and bending strength tests. The tensile strength test result of the longitudinally bonded parts was better than that of the double lap specimens. And, the tensile strength value of the scarf specimen was better than that of the hooked scarf specimen. The tensile strength of the GFRP (Glass Fiber Reinforced Plastic) rod insertion bonding specimen was 3.6 MPa, which was the highest. As for the bending strength test result of the longitudinally bonded part, the average MOR (modulus of rupture) of the specimen where a GFRP rod was inserted and bonded measured 29 MPa, while the specimens of other bonded parts showed a MOR no more than 11 MPa. Toughness destruction was observed in specimens where a GFRP rod was insertion-bonded. The rest of the specimens showed brittle destruction. The average MOR strength of the Rod + Lap specimen was 30.5 MPa, which was the highest among all longitudinally bonded specimens. The bending strength of the Rod + Lap specimens showed an effective strength that was 66% of that of the control group which were not longitudinally bonded.

The Study of Alumina Ceramic to Metal Bonding (알루미나 소결체와 금속간의 접합에 관한 연구)

  • 김종희;김형준
    • Journal of the Korean Ceramic Society
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    • v.15 no.2
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    • pp.89-97
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    • 1978
  • The basic mechanism of adherence in sintered high purity alumina ceramic-to-metal bonding was studied. Emphasis was placed on flux composition, porosity of the fired ceramics, and metallizing mixtures. The study was conducted on 95 and 99.5% alumina, using molydbenum-manganese, molybdenum-manganese-silicon dioxide metallizing compositions. Metallizing was performed in wet hydrogen (dew point, +17$^{\circ}C$) at 145$0^{\circ}C$ for 45min. This experiment indicated that adhernece mechanism of ultra high purity alumina ceramic was attributed to formation of $MnAl_2O_$4, and in the case of 95% alumina containing glass, the migration of glass from the interface into the void of the metal coating was the main role to the adhrence. It showed also that greater the bond-strength was resulted as porosity was increased.

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Fabrication of Copper Electrode Array and Test of Electrochemical Discharge Machining for Glass Drilling (유리의 미세 구멍 가공을 위한 구리 전극군 제작 및 전기 화학 방전 가공 시험)

  • Jung, Ju-Myoung;Sim, Woo-Young;Jeong, Ok-Chan;Yang, Sang-Sik
    • Proceedings of the KIEE Conference
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    • 2003.10a
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    • pp.297-299
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    • 2003
  • In this paper, we present the fabrication of copper electrode array and test of electrochemical discharge machining for the fabrication of microholes on Borofloat33 glass. Copper electrode array is fabricated by the bonding of silicon upper substrate and lower substrate and copper electroplate. The silicon upper electrode having microholes fabricated by ICP-RIE is the mold of copper electroplate. The lower substrate is used as the seed layer for copper electroplate after Au - Au thermocompression bonding with the upper substrate.

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Effect of Transition Metal on the Thermal Stability and Mechanical Property of Fe-based Amorphous Alloys (Fe기 비정질합금의 열적안정성 및 기계적 성질에 미치는 천이금속의 영향)

  • Gook, Jin Seon;Yoon, Dong Joo
    • Journal of the Korean Society for Heat Treatment
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    • v.14 no.6
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    • pp.345-349
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    • 2001
  • This study has investigated the effect of thermal stability and mechanical property of $Fe_{80-X}P_{10}C_6B_4M_X$(X=2, 4, 6, M=transition metal) amorphous alloys fabricated by the melt-spun process. The glass transition temperature($T_g$), crystallization temperature($T_x$) and hardness increase with decreasing electron concentration (e/a) from about 7.38 to 7.18. The decrease of e/a implies the increase in the attractive bonding state between the M elements and other constituent element. The decrease in a/e leads to the enhancement of the attractive bonding state among the constituent elements which is favorable for the increase in $T_g$, $T_x$ and hardness.

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A study on glass/glass wafer bonding and bonding strength for micro fluidic device (미세유체소자용 유리/유리 웨이퍼 접합 및 접합강도 평가)

  • Shin, Kyu-Sik;Park, Jun-Shik;Jang, Suk-Won;Park, Hyo-Derk;Kang, Sung-Goon;Song, Young-Hwa
    • Proceedings of the KIEE Conference
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    • 2003.07c
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    • pp.1917-1919
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    • 2003
  • 본 연구에서는 바이오 및 환경 분야에 적용 가능한 미세 유체소자 제작에 있어서 4" 유리 / 유리 웨이퍼접합을 시도하였으며, 접합결과 90%이상의 접합면적을 보였다. 접합된 샘플을 산 및 알카리 조건에 따른 인장시험결과 모든 조건에서 약 $2kgf/mm^2$ 이상의 접합강도를 보였으며 파괴는 접합면이 아닌 모재에서 발생되었다. 또한 미세유체소자 제작에 있어서 초음파를 이용하여 유리를 가공하였으며, 폭 $300{\mu}m$, 깊이 $200{\mu}m$의 미세채널을 제작하였다.

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