• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.1313-1314
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• 2013

• 한국수소및신에너지학회논문집
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• 제34권3호
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• pp.307-315
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• 2023

The physical and chemical changes exhibited by high density polyethylene (HDPE) after treatment with hydrogen at a pressure of 90 MPa followed by rapid release of the hydrogen were studied. X-ray diffraction, differential scanning calorimetry, thermo gravimetric analysis, and attenuated total reflectance (ATR)-fourier transform infrared (FTIR) were used for this purpose. As a result, it was found that the degree of crystallinity of HDPE decreased after hydrogen pressure treatment, while the average thickness of lamellae that constitute the crystals and the melting temperature of the crystalline region actually increased. The decomposition temperature also increased by about 3℃. In addition, it was found that the hydrogen bonding network between -OH groups in the HDPE sample was strengthened and partial chain scission occurred. These cut chains were found to be terminated by oxidative degradation such as cross-linking between chains, -C=O, -C-O, and -CHO, or by the formation of -CH₃ at the chain ends, as confirmed by ATR-FTIR.

• 한국자기학회지
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• 제13권1호
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• pp.6-14
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• 2003

열처리 온도에 따라 접합유리와의 화학적 반응이 Fe-Hf-N/SiO$_2$, 및 Fe-Hf-N/Cr/SiO$_2$ 박막의 물리적, 자기적 특성에 미치는 영향을 고찰하였다. 접합유리와 반응된 Fe-Hf-N/SiO$_2$ 박막의 연자기 특설은 온도가 증가함에 따라 크게 떨어졌으며, $600^{\circ}C$에서 포화자화값은 1 kG, 보자력이 27 Oe, 10MHz에서의 유효투자율이 70로 자기적 특성이 급격히 열화되었다. 이는 접합유리와의 화학적 반응에 의해 Fe-Hf-N 박막이 H$_{f}$ O$_2$, Fe$_3$O$_4$ 등으로 산화되기 때문인 것으로 나타났다. Fe-Hf-N/Cr/SiO$_2$ 박막의 경우, $600^{\circ}C$에서 포화자화값 13.5kG, 보자력은 4Oe, 10 MHz에서의 유효 투자율이 700으로 Fe-Hf-N/SiO$_2$ 박막보다 연자기 특성 열화가 덜 일어났다. 이는 Fe-Hf-N/Cr/SiO$_2$ 박막의 Cr 층이 Fe-Hf-N 박막의 산화를 억제하여. 일부에서만 HfO$_2$가 생성되고 나머지는 원래의 $\alpha$-Fe상을 유지하기 때문인 것으로 나타났다.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2017년도 제48회 춘계학술대회논문집
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• pp.168-171
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• 2017

X-ray photoelectron spectroscopy(XPS) 분석법을 이용하여 FKM O-ring의 대기중에서의 노화 메카니즘을 관찰하였다. FKM O-ring은 선경 3.53mm, 내경 91.67mm인 오링을 시편으로 사용하였다. 노화 후 FKM O-ring의 oxygen 원소의 농도가 20.39%로 증가하였으며, fluorine 원소는 각각 8.29%로 감소하는 경향을 나타내었다. 이를 통하여 산소에 의한 산화 반응이 FKM O-ring의 주요 노화 반응으로 나타났다. C1s와 F1s 피크 분석 결과, FKM O-ring의 주쇄중 C-F 결합에서 산화 반응이 주로 진행되는 것으로 나타났다. 또한 O1s 피크 분석 결과, 산화 반응을 통하여 C-OH, C=O, 그리고 O=C-O 구조를 형성하며, 주로 카르복실기가 생성되는 것으로 나타났다.

• 대한소아치과학회지
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• 제30권3호
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• pp.530-539
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• 2003

본 연구에서는 4종의 복합레진(Palpique Estelite, Filtek P 60, Spectrum, Charisma)을 선택하였다. 각 제품당 5개의 시편을 제작하여 무게 측정을 한 후, NaOH 용액에 2주 동안 보관하였고 1.23% HCl로 중화하고 세척, 건조시켜 무게 측정을 하였다. 주사전자현미경과 공초점 레이저 주사현미경으로 복합레진의 분해층 표면과 분해깊이를 관찰하였고, 분해 저항성은 용액내로 용출된 Si, Al, Ba의 농도를 근거로 평가하여 다음과 같은 결과를 얻었다. 1. 각 제품의 무게손실량은 Palpique Estelite가 가장 많았고, Filtek P 60, Charisma, Spectrum 순이었다. 2. 각 제품의 표면하 분해층 깊이는 Filtek P 60이 가장 깊었고, Charisma, Palpique Estelite, Spectrum 순이었다. 3. Si 용출량은 Charisma가 가장 많았고, Spectrum, Palpique Estelite, Filtek P 60 순이었다. 4. 무게손실과 분해층 깊이 사이에는 높은 상관관계를 보였다(r=0.704, p<0.05). 5. 주사전자현미경 관찰시 NaOH용액에 보관한 후 레진 기질과 충전제 사이의 결합의 파괴 양상인 분해층 표면을 관찰할 수 있었고 공초점 레이저 현미경 관찰시 레진의 분해층 깊이를 관찰할 수 있었다.

• 대한소아치과학회지
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• 제29권3호
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• pp.430-438
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• 2002

본 연구에서는 Prodigy(Kerr, USA), Vitalescence(Ultradent, USA), Z 250(3M, USA), Filtek flow(3M, USA)의 4종의 복합레진을 사용하여 각 제품의 분해저항성을 평가하고자 하였다. 무게손실, 표면하 분해층 깊이, 용출된 Si 농도를 기준으로 각 레진의 분해저항성을 평가하여 다음과 같은 결과를 얻었다. 1. 무게손실량은 Prodigy와 Vitalescence사이, Z 250과 Filtek flow사이에는 차이를 보이지 않았으며 전후 제품군 간에는 차이를 보였다(p<0.05). 2. 분해층 깊이는 Z 250, Filtek flow, Prodigy, Vitalescence순으로 감소하였으며, 네가지 제품간에는 유의한 차이를 보였다(p<0.05). 3. Si 용출량은 Filtek flow, Z 250, Prodigy, Vitalescence 순으로 감소하였으며, 각 제품 간에는 유의한 차이를 보였다(p<0.05). 4. 각 제품의 무게손실과 분해층 깊이 사이(r=0.714, p<0.05), 무게손실과 Si 용출량 사이(r=0.770, p<0.05), 분해층 깊이와 Si 용출량 사이 (r=0.930, p<0.05)에는 높은 상관관계를 보였다. 5. 주사전자현미경 관찰시 NaOH 용액에 보관한 후 레진 기질과 필러 사이의 결합의 파괴를 관찰할 수 있었다. 6. 공촛점 레이저 현미경 관찰시 NaOH용액에 보관한 후 레진의 분해층 깊이를 관찰할 수 있었다.

• Structural Engineering and Mechanics
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• 제48권5호
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• pp.643-660
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• 2013

Reinforced concrete structures are vulnerable to high temperature conditions such as those during a fire. At elevated temperatures, the mechanical properties of concrete and reinforcing steel as well as the bond between steel rebar and concrete may significantly deteriorate. The changes in the bonding behavior may influence the flexibility or the moment capacity of the reinforced concrete structures. The bond strength degradation is required for structural design of fire safety and structural repair after fire. However, the investigation of bonding between rebar and concrete at elevated temperatures is quite difficult in practice. In this study, bond constitutive relationships are developed for normal and high-strength concrete (NSC and HSC) subjected to fire, with the intention of providing efficient modeling and to specify the fire-performance criteria for concrete structures exposed to fire. They are developed for the following purposes at high temperatures: normal and high compressive strength with different type of aggregates, bond strength with different types of embedment length and cooling regimes, bond strength versus to compressive strength with different types of embedment length, and bond stress-slip curve. The proposed relationships at elevated temperature are compared with experimental results.

• 한국전기전자재료학회논문지
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• 제15권7호
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• pp.576-582
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• 2002

Nonvolatile semiconductor memory devices with reoxidized nitrided oxide(RONO) gate dielectrics were fabricated, and nitrogen distribution and bonding species which contribute to memory characteristics were analyzed. Also, memory characteristics of devices depending on the anneal temperatures were investigated. The devices were fabricated by retrograde twin well CMOS processes with $0.35\mu m$ design rule. The processes could be simple by in-situ process in growing dielectric. The nitrogen distribution and bonding states of gate dielectrics were investigated by Dynamic Secondary Ion Mass Spectrometry(D-SIMS), Time-of-Flight Secondary Ion Mass Spectrometry(ToF-SIMS), and X-ray Photoelectron Spectroscopy(XPS). As the nitridation temperature increased, nitrogen concentration increased linearly, and more time was required to form the same reoxidized layer thickness. ToF-SIMS results showed that SiON species were detected at the initial oxide interface which had formed after NO annealing and $Si_2NO$ species within the reoxidized layer formed after reoxidation. As the anneal temperatures increased, the device showed worse retention and degradation properties. It could be said that nitrogen concentration near initial interface is limited to a certain quantity, so the excess nitrogen is redistributed within reoxidized layer and contribute to electron trap generation.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.17-20
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• 2001

Nonvolatile semiconductor memory devices with reoxidized nitrided oxide(RONO) gate dielectric were fabricated, and nitrogen distribution and bonding species which contributing memory characteristics were analyzed. Also, memory characteristics of devices according to anneal temperatures were investigated. The devices were fabricated by 0.35$\mu\textrm{m}$ retrograde twin well CMOS processes. The processes could be simple by in-situ process of nitridation anneal and reoxidation. The nitrogen distribution and bonding state of gate dielectric were investigated by Dynamic Secondary Ion Mass Spectrometry(D-SIMS), Time-of-Flight Secondary ton Mass Spectrometry(ToF-SIMS), and X-ray Photoelectron Spectroscopy(XPS). Nitrogen concentrations are proportional to nitridation anneal temperatures and the more time was required to form the same reoxidized layer thickness. ToF-SIMS results show that SiON species are detected at the initial oxide interface and Si$_2$NO species near the new Si-SiO$_2$ interface that formed after reoxidation. As the anneal temperatures increased, the device showed worse retention and degradation properties. These could be said that nitrogen concentration near initial interface is limited to a certain quantity, so excess nitrogen are redistributed near the Si-SiO$_2$ interface and contributed to electron trap generation.

• 한국초전도ㆍ저온공학회논문지
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• 제24권4호
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• pp.16-24
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• 2022

Applications of REBa₂Cu₃O_7-δ tapes require joints with a simple manufacturing process, low resistance and good mechanical properties. In the present study, we successfully developed a copper diffusion joint between Cu-stabilized REBa₂Cu₃O_7-δ tapes that meets the above requirements without solder simply by applying flux, heat and pressurization. After a 3 min thermocompression process at approximately 150 δ and 336 MPa in air, two tapes were directly connected between Cu stabilizers by copper diffusion, which was proven by microstructure analysis. The specific resistivity of the copper diffusion joint reached 5.8 nΩ·cm² (resistance of 0.4 nΩ for a 306 mm splicing length) at 77 K in the self-field. The axial tensile stress reached 200 N without critical current degradation. The results show promise for the preparation of copper diffusion joints to be used in coils, attached tapes, and wire/cable terminals.