• Journal of the Korean Magnetic Resonance Society
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• v.8 no.2
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• pp.127-138
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• 2004

We obtained the chemical shifts of amide protons (NHs) in helical peptides at various temperatures and trifluoroethanol (TFE) concentrations using 2-dimensional NMR spectroscopy. These NH chemical shifts and their temperature dependence exhibited characteristic periodicity of 3-4 residues per cycle along the helix, where downfield shifted NHs showed larger temperature dependence. In an attempt to understand these observations, we focused on hydrogen bonding changes in the peptides and examined the validity of two possible explanations: (1) changes in intermolecular hydrogen bonding caused by differential solvation of backbone carbonyl groups by TFE, and (2) changes in intramolecular hydrogen bonding due to disproportionate variations in the hydrogen bonding within the peptide helix. Interestingly, the slowly exchanging NHs, which were on the hydrophobic side of the helix, showed consistently larger temperature dependences. This could not be explained by the differential solvation assumption, because the slowly exchanging NHs would become more labile if the preceding carbonyl groups were preferentially solvated by TFE. We suggest that the disproportionate changes in intramolecular hydrogen bonding better explain both the temperature dependence and the exchange behavior observed in this study.

• Structural Engineering and Mechanics
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• v.84 no.6
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• pp.799-811
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• 2022

Adhesive bonding has seen rapid development in recent years, with emphasis to composite patch repairing processes of geometric defects in aeronautical structures. However, its use is still limited given its low resistance to climatic conditions and requirement of specialized labor to avoid fabrication induced defects, such as air bubbles, cracks, and cavities. This work aims to numerically analyze, by the finite element method, the failure behavior of a damaged plate, in the form of a bonding defect, and repaired by an adhesively bonded composite patch. The position and size of the defect were studied. The results of the numerical analysis clearly showed that the position of the defect in the adhesive layer has a large effect on the value of J-Integral. The reduction in the value of J-Integral is also related to the composite stacking sequence which, according to the mechanical properties of the ply, provides better load transfer from the plate to the repair piece through the adhesive. In addition, the increase in the applied load significantly affects the value of the J-Integral at the crack tip in the presence of a bonding defect, even for small dimensions, by reducing the load transfer.

• Transactions of Materials Processing
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• v.22 no.8
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• pp.463-469
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• 2013

In the previous work, a new forging process design, which included incremental upsetting, diffusion bonding and cogging, was suggested as a method to manufacture 1.9wt%C ultrahigh carbon workrolls. The previous study showed that incremental upsetting and diffusion bonding are effective in closing voids and healing of the closed void. In addition, compression tests of the 1.9wt%C ultrahigh carbon steel revealed that new microvoids form within the blocky cementite at temperatures of less than $900^{\circ}C$ and that local melting can occur at temperatures over $1120^{\circ}C$. Thus, the forging temperature should be controlled between 900 and $1120^{\circ}C$. Based on these results, incremental upsetting and diffusion bonding were used to check whether they are effective in closing and healing voids in a 1.9wt%C ultrahigh carbon steel. The incremental upsetting and diffusion bonding were performed using sub-sized specimens of 1.9wt%C ultrahigh carbon steel. The specimen was deformed only in the radial direction during the incremental upsetting until the reduction ratio reached about 45~50%. After deformation the specimens were kept at $1100^{\circ}C$ for the 1 hour in order to obtain a high bonding strength for the closed void. Finally, microstructural observations and tensile tests were conducted to investigate void closure behavior and bonding strength.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1995.03a
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• pp.155-161
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• 1995

Superplastic forming/diffusion bonding(SPF/DB) processes are analyzed using a rigid visco-plastic finite element method. The optimum pressure-time relationship for a target strain rate and thickness distributions were predicted using two-node line element based on membrane approximation for plane strain shapes. Material behavior during SPF/DB of the integral structures with complicated shapes are investigated. The tying condition is employed for the analysis inter-sheet contact problems. A movement of rib structure is successfully prodicted during the forming.

• Transactions of the Korean Society of Mechanical Engineers
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• v.14 no.2
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• pp.382-392
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• 1990

This study investigates the behavior of fatigue crack propagating between holes of holes filled with another materials. When holes of the holes filled with another materials are located symmetrically near a center crack, it is noted that the crack propagation rate is influenced by both the bonding force of the brazing part and the elastic modulus of another material. It is experimentally and analytically confirmed that the center crack stops when its tip reaches near the center line of the holes and a small crack is initiated from the boundaries of holes of the holes filled with another materials and it propagates to final fracture.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1211-1214
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• 2003

The film is prepared by electron cyclotron resonance chemical vapor deposition (ECRCVD) employing CH$_4$ and H$_2$ gases. It is deposited by the control of microwave plasma power, gas flow ratio, deposition pressure, and In-situ thermal treatment temperature. The structure of a-C:H (hydrogenated amorphous carbon) thin film is analysed by FT-IR spectroscopy. The fraction sp$^3$ versus sp$^2$ bonding is very important to clear up the surface and interrace of a-C:H film properties such as nano-scale friction behavior. The sp$^3$ versus sp$^2$ bonding of a-C:H thin film is dependent on the deposition conditions, therefore. nano-scale friction behavior is dependent on the deposition conditions.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.264-271
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• 2005

This study investigates the behavior of fatigue crack propagating between holes or holes filled with another materials. When holes or the holes bonded with another materials exist near center crack symmetrically, crack propagation rate is influenced by the bonding force of brazing part and the elastic modulus ratio of another material to matrix. It is experimentally and analytically confirmed that the center crack stops when its tip reaches near the center line of the holes and a small crack is initiated from the boundaries of holes or the holes filled with another materials and it propagates to final fracture. The mechanical behaviors of center crack near another materials are also investigated.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.14 no.6
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• pp.74-82
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• 2005

This study investigates the behavior of fatigue crack propagating between holes or holes filled with another materials. When holes or the holes bonded with another materials exist near center crack symmetrically, crack propagation rate is influenced by the bonding force of brazing part and the elastic modulus ratio of another material to matrix. It is experimentally and analytically confirmed that the center crack stops when its tip reaches near the center line of the holes and a small crack is initiated from the boundaries of holes or the holes filled with another materials and it propagates to final fracture. The mechanical behaviors of center crack near another materials are also investigated.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.14 no.3
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• pp.309-315
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• 2001

The Stress intensity factors for edge cracks located at the bonding interface between the elastic semiconductor chip and the viscoelastic adhesive layer have been investigated. Such cracks might be generated due to stress singularity in the vicinity of the free surface. The domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The overall stress intensity factor for the case of a small interfacial edge crack has been computed. The magnitude of stress intensity factors decrease with time due to viscoelastic relaxation.

• Journal of the Korean institute of surface engineering
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• v.55 no.4
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• pp.202-214
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• 2022

Internal connections between device, package and external terminals for connecting packaging and printed circuit board are normally manufactured by electroless Ni-P plating followed by immersion Au plating (ENIG process) to ensure the connection reliability. In this study, a new non-cyanide-based immersion and electroless Au plating solutions using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent was investigated on different underlayer electroless Ni-P plating layers. As a result, it was confirmed that the deposition behavior and film properties of electroless Au plating are affected by grain size and impurity of the electroless Ni-P film, which is used as the plating underlayer. Au plating on the electroless Ni-P plating film with a dense surface structure showed the highest bonding strength. In addition, the electroless Au plating film on the Ni-P plating film has a smaller particle size exhibited higher bonding strength than that on the large particle size.