• Title/Summary/Keyword: bonded system

검색결과 468건 처리시간 0.028초

Study of Cresol-Novolac Epoxy Systems on Fusion Bonded Epoxy Coatings for Pipeline Protection

  • Chung, Chi Wook;Lee, Sang Sun;Chai, Soo Gyum;Lim, Jong Chan
    • Corrosion Science and Technology
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    • 제2권4호
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    • pp.202-206
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    • 2003
  • Fusion Bonded Epoxy(FBE) systems have been widely used to protect pipelines for over 30 years. Numerous attempts have so far been made to improve the properties of FBE coatings such as chemical resistance, adhesion, water resistance, cathodic disbondment resistance, impact resistance, and flexibility to protect pipelines at a wet and a high temperature condition. But these attempts have not been successful in reducing some weakness, for instance, in pipeline operating at high temperature due to poor hot water resistance and cathodic protection. The purpose here is to build a basis for getting better corrosion resistance of FBE systems. Cresol-novolac epoxy coating systems were studied compared to bisphenol A type epoxy systems. After the immersion of the film in water at a high temperature for a long period, good adhesion to metal substrate and excellent cathodic disbond resistance were observed in the cresol-novolac epoxy resin systems. It is well known that the adhesion of organic coatings to metal substrate might be decreased due to the disruption of a chemical bond across the film and metal interface induced by water molecules. A high crosslinking density might decrease water permeability and improve cathodic disbonding protection in the coatings. Other factors are studied to understand anti-corrosion mechanism of Cresol-novolac epoxy coatings. In addition, the water absorption rate and the effect of cure temperature on the adhesion and cathodic disbonding resistance ofthe films were studied in different epoxy coatings and the effect of substrate was evaluated. The results of field application are proved that the Cresol-novolac epoxy coating system developed recently is one of the most suitable coatings for protection of pipelines.

Buckling and vibration analyses of MGSGT double-bonded micro composite sandwich SSDT plates reinforced by CNTs and BNNTs with isotropic foam & flexible transversely orthotropic cores

  • Mohammadimehr, M.;Nejad, E. Shabani;Mehrabi, M.
    • Structural Engineering and Mechanics
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    • 제65권4호
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    • pp.491-504
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    • 2018
  • Because of sandwich structures with low weight and high stiffness have much usage in various industries such as civil and aerospace engineering, in this article, buckling and free vibration analyses of coupled micro composite sandwich plates are investigated based on sinusoidal shear deformation (SSDT) and most general strain gradient theories (MGSGT). It is assumed that the sandwich structure rested on an orthotropic elastic foundation and make of four composite face sheets with temperature-dependent material properties that they reinforced by carbon and boron nitride nanotubes and two flexible transversely orthotropic cores. Mathematical formulation is presented using Hamilton's principle and governing equations of motions are derived based on energy approach and applying variation method for simply supported edges under electro-magneto-thermo-mechanical, axial buckling and pre-stresses loadings. In order to predict the effects of various parameters such as material length scale parameter, length to width ratio, length to thickness ratio, thickness of face sheets to core thickness ratio, nanotubes volume fraction, pre-stress load and orthotropic elastic medium on the natural frequencies and critical buckling load of double-bonded micro composite sandwich plates. It is found that orthotropic elastic medium has a special role on the system stability and increasing Winkler and Pasternak constants lead to enhance the natural frequency and critical buckling load of micro plates, while decrease natural frequency and critical buckling load with increasing temperature changes. Also, it is showed that pre-stresses due to help the axial buckling load causes that delay the buckling phenomenon. Moreover, it is concluded that the sandwich structures with orthotropic cores have high stiffness, but because they are not economical, thus it is necessary the sandwich plates reinforce by carbon or boron nitride nanotubes specially, because these nanotubes have important thermal and mechanical properties in comparison of the other reinforcement.

금속면의 표면처리 방법에 따른 금합금과 전장레진간의 전단결합강도에 관한 연구 (THE EFFECT OF DIFFERENT SURFACE TREATMENTS ON THE SHEAR BOND STRENGTH OF THE RESIN TO TYPE IV GOLD ALLOY)

  • 박동원;임오남;우이형;최부병
    • 대한치과보철학회지
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    • 제33권4호
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    • pp.685-692
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    • 1995
  • The effect of five different surface treatments on the shear bond strength of the resin bond to Type IV Gold alloy was studied by bonding resin to metal. The metal surface was subjected to one of the following treatments and bonded ;(1) air abraded with $50{\mu}m$ alumina particles,(2) beads(3) beads and tin-plated at curreant density of 300mA/$cm^2$,(4) tin-plated at current density of 300mA/$cm^2$,(5) silicacoating with sililink, and bonded with an MDP Opaque primer, CESEAD resin system. The bonded specimens were immersed in water for 23 hours after 1 hour resin curing and shear bond strength were recorded. On the basis of this study, the following conclusions can be drawn; 1. Difference were found in the shear bond strength among all experimental groups. And bead glroup exihibited the highest shear bond strength and sand blasting group exhibited the lowest shear bond strength on five groups. 2. Bead group, mechanical bonding was significantly higher than that obtained with the samples, tinplating, silicacoating, and chemical bonding. 3. No statistically signiflcant difference was found between the shear bond strengths obtained with bead and bead-tinplating, and between tinplating and sili cacoating.

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Influence of silver nanoparticles on resin-dentin bond strength durability in a self-etch and an etch-and-rinse adhesive system

  • Jowkar, Zahra;Shafiei, Fereshteh;Asadmanesh, Elham;Koohpeima, Fatemeh
    • Restorative Dentistry and Endodontics
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    • 제44권2호
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    • pp.13.1-13.9
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    • 2019
  • Objectives: This study evaluated the effect of dentin pretreatment with silver nanoparticles (SNPs) and chlorhexidine (CHX) on the microshear bond strength (${\mu}SBS$) durability of different adhesives to dentin. Materials and Methods: Occlusal surfaces of 120 human molars were ground to expose flat dentin surfaces. The specimens were randomly assigned to six groups (n = 20). Three groups (A, B, and C) were bonded with Adper Single Bond 2 (SB) and the other groups (D, E, and F) were bonded with Clearfil SE Bond (SEB). Dentin was pretreated with CHX in groups B and E, and with SNPs in groups C and F. The specimens were restored with Z250 composite. Half of the bonded surfaces in each group underwent ${\mu}SBS$ testing after 24 hours and the other half was tested after 6 months of water storage. Results: SNP application was associated with a higher ${\mu}SBS$ than was observed in the CHX and control groups for SEB after 24 hours (p < 0.05). A significantly lower ${\mu}SBS$ was observed when no dentin pretreatment was applied compared to dentin pretreatment with CHX and SNPs for SB after 24 hours (p < 0.05). The ${\mu}SBS$ values of the 6-month specimens were significantly lower than those obtained from the 24-hour specimens for all groups (p < 0.05). This decrease was much more pronounced when both adhesives were used without any dentin pretreatment (p < 0.05). Conclusions: SNPs and CHX reduced the degradation of resin-dentin bonds over a 6-month period for both adhesive systems.

Sintered-reaction Bonded Silicon Nitride Densified by a Gas Pressure Sintering Process - Effects of Rare Earth Oxide Sintering Additives

  • Lee, Sea-Hoon;Ko, Jae-Woong;Park, Young-Jo;Kim, Hai-Doo;Lin, Hua-Tay;Becher, Paul
    • 한국세라믹학회지
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    • 제49권4호
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    • pp.318-324
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    • 2012
  • Reaction-bonded silicon nitrides containing rare-earth oxide sintering additives were densified by gas pressure sintering. The sintering behavior, microstructure and mechanical properties of the resultant specimens were analyzed. For that purpose, $Lu_2O_3-SiO_2$ (US), $La_2O_3$-MgO (AM) and $Y_2O_3-Al_2O_3$ (YA) additive systems were selected. Among the tested compositions, densification of silicon nitride occurred at the lowest temperature when using the $La_2O_3$-MgO system. Since the $Lu_2O_3-SiO_2$ system has the highest melting temperature, full densification could not be achieved after sintering at $1950^{\circ}C$. However, the system had a reasonably high bending strength of 527 MPa at $1200^{\circ}C$ in air and a high fracture toughness of 9.2 $MPa{\cdot}m^{1/2}$. The $Y_2O_3-Al_2O_3$ system had the highest room temperature bending strength of 1.2 GPa.

제 5급 와동에서의 단일용기 상아질 접착제와 자가 산부식 접착제의 상아질에 대한 침투도 평가 (A CONFOCAL MICROSCOPIC STUDY ON DENTINAL INFILTRATION OF ONE-BOTTLE ADHESIVE SYSTEMS AND SELF-ETCHING PRIMING SYSTEM BONDED TO CLASS V CAVITIES)

  • 김형수;박성호
    • Restorative Dentistry and Endodontics
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    • 제27권3호
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    • pp.257-269
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    • 2002
  • Objective : The purpose of this study was to evaluate the resin infiltration into dentin of one-bottle adhesive systems and self-etching primer bonded to Class V cavities using confocal laser scanning microscope(CLSM). Material and Methods : Forty Class V cavities were prepared from freshly extracted caries-free Human teeth. These teeth were divided into two groups based on the presence of cervical abrasion: Group I, cervical abrasion : Group II, wedge-shaped cavity preparation. Resin-dentin interfaces were produced with two one-bottle dentin bonding systems-ONE COAT BOND(OCB; Coltene$^R$) and Syntac$^R$SPrint$^{TM}$(SS; VIVADENT)-, one self-etching priming system-CLEARFIL$^{TM}$ SE BOND (SB : KURARAY)- and one multi-step dentin bonding system-Scotchbond$^{TM}$Multi-Purpose (SBMP, 3M Dental Products)-as control according to manufacturers' instructions. Cavities were restored with Spectrum$^{R}$(Dentsply). Specimens were immersed in saline for 24 hours and sectioned longitudinally with a low-speed diamond disc. The resin-dentin interfaces were microscopically observed using CLSM. The quality of resin-infiltrated dentin layers were evaluated by five dentists using 0~4 scale. Results : Confocal laser scanning microscopal investigations using primer labeled with rhodamine B showed that the penetration of the primer occurred along the cavity margins. Statistical analysis using one-way ANOVA followed by Duncan's Multiple Range test revealed that the primer penetration of the group 2(wedge-shaped cavity preparation) was more effective than group 1(cervical abrasion) and that of the gingival interfaces was more effective than the occlusal interfaces. In the one-bottle dentin bonding systems, the resin penetration score of OCB was compatible to SBMP, but those of SS and self-etching priming system, SB were lower than SBMP.

아미노산의 광학이성화 및 GC, GC/MS, HPLC에 의한 광학이성질체의 분리에 관한 연구 (A Study on the Racemization of Amino acids and its Separation with GC, GC/MS and HPLC)

  • 이재성;홍종기;어연우;김택제
    • 분석과학
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    • 제7권1호
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    • pp.41-52
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    • 1994
  • 아미노산 중 alanine, threonine, isoleucine, leucine, aspartic acid, methionine, glutamic acid, tyrosine을 대상으로 열처리, 산처리, UV 광선 조사, 효소(trypsin)의 영향을 살펴보고 6N-HCl, $105^{\circ}C$로 가열했을 때 이성화하는 정도를 측정하였다. 또한 Mass Spectrometer를 이용할 때 각 아미노산의 fragment되는 과정을 조사하여 GC에서 서로 겹칠 때 분석하는 법을 개발하였다. HPLC에서 cyclodextrin bonded phase를 이용해서 dansyl amino acid의 분리를 시도하였다.

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압전형 센서/액추에이터를 이용한 진동구조물의 능동-수동제어 (Active-passive control of flexible sturctures using piezoelectric sensor/actuator)

  • 고병식
    • 소음진동
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    • 제5권3호
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    • pp.313-325
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    • 1995
  • Two active/passive vibration dampers were designed to control a cantilever beam first mode of vibration. The active element was a piezoelectric polymer, polyvinlidene fluoride (PVDF). The passive damping was provided by the application of a viscoelastic layer on the surface of the steel beam. Two substantially different damper configurations were designed and tested. One damper consisted of a piezoelectric actuator bonded to one face of the beam, with a viscoelastic layer applied to the other surface of the beam. The second one was composed of a layer viscoeastic layer with one surface bonded to the beam, and with other being constrained by nine piezoelectric actuators connected in parallel. A control law based on the sign of the angular velocity of the cantilever beam was implemented to control the beam first mode of vibration. The piezoelectric sensor output was digitally differentiated to obtain the transverse linear velocity, and its sign was used in the control algorith. Two dampers provided the system a damping increase of a factor of four for the first damper and three for the second damper. Both dampers were found to work well at low levels of vibration, suggesting that they can be used effectively to prevent resonant vibrations in flexible structure from initiating and building up.

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Benzidine 鹽酸鹽의 結晶構造 (The Crystal Structure of Benzidine Dihydrochloride)

  • 구정회;김훈섭;신현소
    • 대한화학회지
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    • 제16권1호
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    • pp.18-24
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    • 1972
  • Benzidine dihydrochloride crystallizes in the triclinic system. The space group is $P_1$. The unit cell dimensions are; a = 4.38${\pm}$0.01, b = 5.76${\pm}$0.01, c = 12.82${\pm}$0.02${\AA}$, $\alpha$ = 101.5${\pm}$0.2, $\beta$ = 99.5${\pm}$0.2, $\gamma$ = 99.5${\pm}$0.2$^{\circ}$; with one molecule per unit cell. The crystal structure has been solved by two dimensional Patterson and by trial and error methods, and refined by means of two dimensional differential synthesis. The bond distances are C-C(*) = 1.40${\pm}$0.02, C-C = 1.52${\pm}$0.02, C-N = 1.51${\pm}$0.03 and N-H${\cdot}{\cdot}{\cdot}$Cl = 3.21${\pm}$0.03${\AA}$. The structure consists of hydrogen bonded molecular layers, extending to the (100) plane, and the hydrogen bonding scheme is similar to that of p-phenylenediamine dihydrochloride. The adhesion between hydrogen bonded molecular layers is due to van der Waals forces.

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DIMM-in-a-PACKAGE Memory Device Technology for Mobile Applications

  • Crisp, R.
    • 마이크로전자및패키징학회지
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    • 제19권4호
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    • pp.45-50
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    • 2012
  • A family of multi-die DRAM packages was developed that incorporate the full functionality of an SODIMM into a single package. Using a common ball assignment analogous to the edge connector of an SODIMM, a broad range of memory types and assembly structures are supported in this new package. In particular DDR3U, LPDDR3 and DDR4RS are all supported. The center-bonded DRAM use face-down wirebond assembly, while the peripherybonded LPDDR3 use the face-up configuration. Flip chip assembly as well as TSV stacked memory is also supported in this new technology. For the center-bonded devices (DDR3, DDR4 and LPDDR3 ${\times}16$ die) and for the face up wirebonded ${\times}32$ LPDDR3 devices, a simple manufacturing flow is used: all die are placed on the strip in a single machine insertion and are sourced from a single wafer. Wirebonding is also a single insertion operation: all die on a strip are wirebonded at the same time. Because the locations of the power signals is unchanged for these different types of memories, a single consolidated set of test hardware can be used for testing and burn-in for all three memory types.