• International Journal of Automotive Technology
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• v.6 no.3
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• pp.293-303
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• 2005

Bonded dissimilar materials are being increasingly used in automobiles, aircraft, rolling stocks, electronic devices and engineering structures. Bonded dissimilar materials have several material advantages over homogeneous materials such as high strength, high reliability, light weight and vibration reduction. Due to their increased use it is necessary to understand how these materials behave under stress conditions. One important area is the analysis of the stress intensity factors for interface cracks emanating from circular holes in bonded dissimilar materials. In this study, the bonded scarf joint is selected for analysis using a model which has comprehensive mixed-mode components. The stress intensity factors were determined by using the boundary element method (BEM) on the interface cracks. Variations of scarf angles and crack lengths emanating from a centered circular hole and an edged semicircular hole in the Al/Epoxy bonded scarf joints of dissimilar materials are computed. From these results, the stress intensity factor calculations are verified. In addition, the relationship between scarf angle variation and the effect by crack length and holes are discussed.

• Korean Journal of Pharmacognosy
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• v.10 no.2
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• pp.41-53
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• 1979

A 6', 8a-bonded catechin dimer was synthesized by action of phenoloxidase on 2mol (+)-catechins. The same dimer and other two dimers which are also 6', 8a-bonded were isolated from the fresh cortex of Quercus robur. The 4, 8a-bonded and the etherified 4, 8a-bonded dimers were isolated from it. It was discussed about the meaning of the enzymatically produced 6', 8a-bonded dimers in plant cell. The isolated dimers are as following: 1. 6', 8a-bonded dimers: (+)-catechin-(+)-catechin-6', 8a-dimer(IX), (+)-catechin-(+)-gallocatechin-6', 8a-dimar (XIII), (+)-gallocatechin-(+)-catechin-6', 8a-dimer(XIV). 2. 4, 8a-bonded dimers: (+)-catechin-(+)-catechin-4, 8a-dimer(X), (-)-epicatechin-(+)-catechin-4, 8a-dimer (XI), (+) -galloatechin-(+)-catechin-4, 8a-dimer (XII). 3. 4,8a-bonded dimers with ether linkage: etherified(+)-catechin-(+)-catechin-4, 8a-dimer (XV), etherifid (+)-catechin-(+)-gallocatechin-4, 8a-dimer (XVI), etherified (+)-gallocatechin-(+)-catechin-4, 6a-dimer (XVII).

• Structural Engineering and Mechanics
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• v.26 no.4
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• pp.409-426
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• 2007

Following previous work carried out in Building Research Institute in Japan, finite element analyses of conceptual column designs are performed in this paper. The effectiveness of the numerical model is evaluated by experimental tests and parametric studies are conducted to determine influential factors in conceptual column designs. First, three different column designs are analysed: bonded, un-bonded, and un-bonded with additional reinforcing bars. The load-displacement curves and cracking patterns in concrete are obtained and compared with experimental ones. The comparisons indicate that the finite element model is able to reflect the experimental results closely. Both numerical and experimental results show that, the introduction of un-bonded zones in a column end can reduce cracking strains, accordingly reduce the stiffness and strength as well; the addition of extra reinforcement in the un-bonded zones can offset the losses of the stiffness and strength. To decide the proper length of the un-bonded zones and the sufficient amount of the additional reinforcing bars, parametric studies are carried out on their influences. It has been found that the stiffness of un-bonded designs slightly decreases with increasing the length of the un-bonded zones and increases with the size of the additional reinforcing bars.

• Transactions of the Korean Society of Automotive Engineers
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• v.12 no.2
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• pp.182-189
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• 2004

The application of adhesively bonded components is increasing in various industries such as automobile, aircraft, IC packages, and soldering techniques. In spite of such wide application in adhesively bonded components, nondestructive test techniques applying to adhesively bonded components have not been clearly established yet. In this paper, characteristics of ultrasonic test on interfaces of adhesively bonded components have been investigated by calculating transmission coefficient theoretically and experimentally. From the experimental results, the optimum conditions to establish frequencies for adhesively bonded homogeneous and dissimilar components are 4∼6 MHz and 2∼4 MHz, respectively.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.1
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• pp.58-68
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• 1998

Advantages of adhesively bonded joints and techniques of weight reduction have led to increasing use of structural adhesives such as LSI(large scale integration) package, automobile, aircraft in the various industries. In spite of such wide applications of adhesively bonded joints, the evaluation method of bonding strength has not been established. Stress singularity occurs at the interface edges of adhesively bonded joints and it is required to analyze it. In this paper, the stress singularity using 2-dimensional elastic boundary element method (BEM) with the changes of the lap length and adhesive for single lap joint was analyzed, and experiments of strength evaluation were carried out. As the results, the evaluating method of bonding strength considering stress singularity at interface edges of adhesively bonded joints and stress intensity factor of interface crack have been proposed in static and fatigue test.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.6 no.1
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• pp.59-68
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• 1997

Recently, the cases of using bonded dissimiliar materials which have each of the different components tend to increase for the purpose of developing new materials and using the special objects in the field of industry. Among the cases the strength evaluation of the joining materials of vehicle engine and the structural materials with ceramic/metal bonded joints becomes more important. But the residual stress occurs, because the joining of ceramics and metals is performed in extremely high temperature. It becomes a dominant cause to reduce the strength of the ceramic/metal bonded joints. In this paper, strength evaluation method of ceramic/metal bonded joints considering stress singularity was investigated by boundary element method and 4-point bending test. An advanced method of quantitative strength evaluation for ceramin/metal bonded joints is to be suggested.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.11
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• pp.2277-2286
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• 2002

The application of bonded dissimilar materials to industries as automobiles, aircraft, rolling stocks, electronic devices and engineering structures is increasing gradually because these materials, compared to the homogeneous materials, have many advantages for material properties. In spite of such wide applications of bonded dissimilar materials, the evaluation method of quantitative strength considering the stress singularities for its bonded interface has not been established clearly. In this paper, the stress singularity for Bctors and the stress intensity factors were analyzed by boundary element method(BEM) for the scarf joints of Al/Epoxy with and without a crack, respectively. From static fracture experiments of the bonded scarf joints, a fracture criterion and a evaluation method of interface strength in bonded dissimilar materials were proposed and discussed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.921-926
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• 1997

SOI(Silicon On lnsulator) technology is many advantages in the gabrication of MOS(Metal-Oxide Semiconductor) and CMOS(Complementary MOS) structures. These include high speed, lower dynamic power consumption,greater packing density, increased radiation tolearence et al. In smiple form of bonded SOL wafer manufacturing, creation of a bonded SOI structure involves oxidizing at least one of the mirror polished silicon surfaces, cleaning the oxidized surface and the surface of the layer to which it will be bonded,bringing the two cleanded surfaces together in close physical proximity, allowing the subsequent room temperature bonding to proceed to completion, and than following this room temperature joining with some form of heat treatment step,and device wafer is thinned to the target thickness. This paper has been performed to investigate the possibility of the bonded SOI wafer manufacturing Especially, we focused on the bonding quality and thinning method. Finally,we achieved the bonded SOI wafer that Si layer thickness is below 3 .mu. m and average roughness is below 5.angs.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.4 no.4
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• pp.50-60
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• 1995

Recently advantages joining dissimiliar materials and light weight material techniques have led to increasing use of structural adhesives in the various industries. Stress singulartiy occurs at the interface edges of adhesively bonded dissimilar materials. So it is required to analyze its stress singularity at the interface edges of adhesively bonded joints indissimilar materials. In this paper, the analysis method of stress singularity is studied in detail. Also, effects of the stress singularity at the interface edge of adhesively bonded scarf joints in combinations of dissimilar materials are investigated by using 2-dimensional elastic program of boundary element method. As the results, the strength evaluation method of adhesively bonded dissimilar materials using the stress singularity factor, $\Gamma$,is very useful. The fracture criterion, method of strength evaluation and prediction of fracture strength by the stress singularity factor on the adhesively bonded dissimilar materials are proposed.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.212-212
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• 2012

The Coverage dependent attachment of multifunctional groups included in threonine molecules adsorbed to Ge (100)$-2{\times}1$ surface was investigated using core-level photoemission spectroscopy (CLPES) and density functional theory (DFT) calculations. The core-level spectra at a low coverage indicated that the both carboxyl and amine groups participated in the bonding with the Ge (100) surface by "O-H dissociated and N-dative bonded structure". However, at high coverage level, additional adsorption geometry of "O-H dissociation bonded structure" appeared possibly to minimize the steric hindrance between adsorbed molecules. Moreover, the C 1s, N 1s, and O 1s core level spectra confirmed that the carboxyl oxygen is more competitive against the hydroxymethyl oxygen in the adsorption reaction. The adsorption energies calculated using DFT methods suggested that four of six adsorption structures were plausible. These structures were the "O-H dissociated-N dative bonded structure", the "O-H dissociation bonded structure", the "Om-H dissociated-N dative bonded structure", and the "Om-H dissociation bonded structure" (where Om indicates the hydroxymethyl oxygen). These structures are equally likely, according to the adsorption energies alone. Conclusively, we investigate in threonine on Ge (100) surface system that the "O-H dissociated-N dative bonded structure" and the "O-H dissociation bonded structure" are preferred at low coverage and high coverage.