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EFFECTS OF INTERFACE CRACKS EMANATING FROM A CIRCULAR HOLE ON STRESS INTENSITY FACTORS IN BONDED DISSIMILAR MATERIALS  

CHUNG N.-Y. (Department of Mechanical Engineering, Soongsil University)
SONG C.-H (AMLCD Division, Samsung Electronics Co., Ltd.)
Publication Information
International Journal of Automotive Technology / v.6, no.3, 2005 , pp. 293-303 More about this Journal
Abstract
Bonded dissimilar materials are being increasingly used in automobiles, aircraft, rolling stocks, electronic devices and engineering structures. Bonded dissimilar materials have several material advantages over homogeneous materials such as high strength, high reliability, light weight and vibration reduction. Due to their increased use it is necessary to understand how these materials behave under stress conditions. One important area is the analysis of the stress intensity factors for interface cracks emanating from circular holes in bonded dissimilar materials. In this study, the bonded scarf joint is selected for analysis using a model which has comprehensive mixed-mode components. The stress intensity factors were determined by using the boundary element method (BEM) on the interface cracks. Variations of scarf angles and crack lengths emanating from a centered circular hole and an edged semicircular hole in the Al/Epoxy bonded scarf joints of dissimilar materials are computed. From these results, the stress intensity factor calculations are verified. In addition, the relationship between scarf angle variation and the effect by crack length and holes are discussed.
Keywords
Bonded dissimilar materials; Interface crack; Bonded scarf joint; Centered circular hole; Edged semicircular hole; Stress intensity factor; Boundary element method;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
Times Cited By Web Of Science : 0  (Related Records In Web of Science)
Times Cited By SCOPUS : 0
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1 Chung, N. Y. and Jang, J. M. (1997). Fracture criterion of mixed mode in adhesively bonded joints of Al/Steel dissimilar materials. Korea Society of Mechanical Engineers(A) 21, 8, 1322-1331
2 Chung, N. Y. and Song, C. H. (1996). Prediction of propagation path for the interface crack in bonded dissimilar materials. Trans. Korean Society of Automotive Engineers 4, 3, 112-121
3 Erdogan, F. (1965). Stress distribution in bonded dissimilar media. J Appl. Mech., 32, 403-410   DOI
4 He, M. Y. and Hutchinson, J. W. (1989). Kingking of a crack out of an interface. J Appl. Mech., 56,270-278   DOI
5 Isida, M. and Noguchi, H. (1984). Tension of a plate containing an embedded elliptical crack. Eng. Frac. Mech., 20,3, 387-408   DOI   ScienceOn
6 Kuo, A. S., Saul, S. and Levy, M. (1983). Stress intensity factors for two cracks emanating from two holes and approaching each other. Eng. Frac. Mech., 17,3,281-288   DOI   ScienceOn
7 Salama, M. and Hasebe, N. (1996). Stress concentration factors at an elliptical hole on the interface between bonded dissimilar half-plane under bending moment. J Appl. Mech., 63, 7-14   DOI
8 Erdogan, F. and Sih, G. C. (1963). On the crack extension in plate under plane loading and transverse shear. J Basic Eng. Trans. 85, 519-527   DOI
9 Comninou, M. (1977). The interface crack. J Appl. Mech., 44, 631-636   DOI
10 Groth, H. (1967). Some problems of bonded anisotropic plate with cracks along the bond. Int. J Frac. Mech. 3, 253-265
11 Woo, C. W., Wang, Y. H. and Cheung, Y. K. (1989). The mixed mode problems for the cracks emanating from a circular hole in a finite plate. Eng. Frac. Mech., 32, 2, 279-288   DOI   ScienceOn
12 Mukai, D. J., Ballarini, R. and Miller, G. R. (1990). Analysis of branched interface cracks. J Appl. Mech., 57, 887-893   DOI
13 Bowie, O. L. (1956). Analysis of an finite plate containing radial cracks originating at the boundary of an infinite circular hole. J Math. Phys., 35, 60-71   DOI
14 England, F. (1965). Stress distribution in bonded dissimilar materials with cracks. J Appl. Mech., 32, 403-410   DOI
15 Williams, M. L. (1959). The stresses around a fault or crack in dissimilar media. Bull. Seismol. Soc. America. 49, 199-204
16 Chung, N. Y. (2002). Evaluation method of interface strength in bonded dissimilar materials of Al/Epoxy, Korea Society of Mechanical Engineers(A) 26, 11, 2277-2286   DOI
17 Newman, J. C. (1971). An improved method of collocation for the stress analysis of cracked plate with various shaped boundaries. NASA TA D-6373
18 Rice, J. R. (1988). Elastic fracture mechanics concepts for interfacial cracks. J Appl. Mech., 55, 98-103   DOI
19 Bowie, O. L. (1973). Soultion of Plane Crack Problems by Mapping Technique. Mechanics of Fracture (Ed. Sih G. C.). NoordhoffIntemational Publishing Leyden, 1,1-55
20 Raju, I. S. (1987). Calculation of strain-energy release rates with higher order and singular finite elements. Eng. Frac. Mech., 28, 3, 251-274   DOI   ScienceOn
21 Murakami, Y. and Nasser, S. N. (1982). Interacting dissimilar semi-elliptical surface flaws under tension and bending. Eng. Frac. Mech., 16,3,373-386   DOI   ScienceOn
22 Rice, J. R. and Sih, G. C. (1965). Plane problems of cracks in dissimilar media. J Appl. Mech., 3, 418-423
23 Kane, J. H. (1994). Boundary element analysis in engineering continuum mechanics. Prentice-Hall, Inc. 161-167, New Jersy
24 Chung, N. Y., Lee, M. D. and Kang, S. K. (2000). Analyses of stress intensity factors and evaluation of fracture toughness in adhesively bonded DCB joints. Korea Society of Mechanical Engineers(A) 24, 6, 1547-1556
25 Chung, N. Y. and Park, S. I. (2004). Detection of interfacial crack length by ultrasonic attenuation coefficients on adhesively bonded joints. Int. J Automotive Technology 5,4,303-309
26 Yuuki, R. and Cho, S. B. (1989). Efficient boundary element analysis of stress intensity factors for interface cracks in dissimilar materials. Eng. Frac. Mech., 34, 1, 179-188   DOI   ScienceOn
27 Comninou, M. (1977). Interface crack with friction in contact zone. J Appl. Mech., 44, 780-781   DOI